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JETCHEMJETCHEM(WUXI)CHEMICALTECHNOLOGIESCO.,LTD.超特（無錫）化學科技有限公司填孔制程BlindviaCopperFillingJetchemInternationalCo.,Ltd.概要OUTLINE:1机理概念MechanismConcept2化学关联作用InteractionwithChemistry3阳极的影响InfluenceofAnode4工艺参数和运行ProcessparametersandOperation填孔制程AcidCopperBlindviaFillingplatingProcessJetchemInternationalCo.,Ltd.机理概念MechanismConcept•概述General•1,填孔的机理是底部填满•TheBVFMechanismisbasedontheBottomFilled-upconcept•2,这就意味着底部的铜的沉积要比表面的快.ThismeansthatthegrowthofcopperdepositisfasterinsidetheviathanonthesurfaceJetchemInternationalCo.,Ltd.关键因素：KeyFactors•添加剂的含量和性质影响沉积量•TherateofdepositionisinfluencedbytheAdditiveconcentrationandnature(Brightener).•两个不同的增长速度是通过两个不同的添加剂的加速调节来实现的。•Wecanmanagetwodifferentgrowthspeedisbyhavingtwodifferentspecies(Additive)workingasacceleratorontheviaJetchemInternationalCo.,Ltd.机理Mechanism•填孔机制Mechanismforviafilling:•成份Y在孔底取代成份X+Y来实现底部填平。ThereasonfortheBottomFilled-upmechanismtoworkisbecauseofthecreation,atthecathode,ofthebrokenform-YfromtheoriginalAdditiveX-YwhichhasthepowertoacceleratemoreofcopperdepositionJetchemInternationalCo.,Ltd.机理Mechanism•填孔机制Mechanismforviafilling:•在不同的电场信号下，不同的地方吸附不同的添加剂来使铜有不同的沉积速度•thepresenceofthe–Yspeciesbeonlyinthevia,soonlybegeneratedatthecathodeduringtheCopperdepositionprocess.ThisisachievedwithproperCarriermaterialJetchemInternationalCo.,Ltd.化学品作用ChemicalInteraction•关键因素：KeyFactors•1，添加剂成份在一定的浓度下，不会在不同电场处富集，槽液成为一般槽液。ifthe–Yspeciebecomespresentatthesurfaceofplatingbathingeneralatacertainconcentration:JetchemInternationalCo.,Ltd.化学品作用ChemicalInteraction•关键因素：KeyFactors•出现上述状况会导致，dimple很深或填孔失败Thisphenomenonwillresultinhigherdimpleand/orinvoid•这种情况的出现一般与槽液寿命及阳极设置有关Thisismainlyasthebathagesandespeciallywithsolubleanodesset-up:JetchemInternationalCo.,Ltd.•关键因素：KeyFactors有一点要注意，在有填孔不良时我们分析的添加剂含量可能还是正常的，即使那时有效成份已经很低了。因为我们通过分析替代成份来表示添加剂含量的。Onehavetobecarefulbecauseinthissituation,theAdditiveCVSreadingwillcomeoutgoodasweanalyzeforcombinationofX-Yand–Yspecies,evenifAdditiveX-Yisatlowlevel:化学品作用ChemicalInteractionJetchemInternationalCo.,Ltd.•关键因素：KeyFactors增加OriginalAdditive成份可以使槽液成分重新达到平衡。•increaseOriginalAdditiveX-Yconcentrationcanre-equilibratethebalancebetweenX-Yand–Y:化学品作用ChemicalInteractionJetchemInternationalCo.,Ltd.•关键因素：KeyFactors这一问题的跟本解决方法在于，不要使添加剂Y在阳极上富集theonlyrealsolutionnottoencounterthisproblemistoavoidthegenerationandaccumulationofthe–Yspecieattheanode:化学品作用ChemicalInteractionJetchemInternationalCo.,Ltd.阳极的影响InfluenceofAnode为什么不溶性阳极使用频率较高•ThisiswhyConsumptionwithinsolubleanodesishigher!!!•可溶性阳极SolubleAnode•有部分Y成份会在阳极上附着Backtobulksolutionandintheanodicfilm•不溶性阳极InsolubleAnode•能够完全去除Y成份•CompletedestructionoftheoriginaladditiveJetchemInternationalCo.,Ltd.阳极的影响InfluenceofAnode示意图JetchemInternationalCo.,Ltd.工艺参数和操作：ProcessparametersandOperation:•该系填孔流程用直流电•OurBVFsystemisoperatingwithDCcurrent.•电流密度据盲孔开口可以在15-30ASF之间。•OperatingCurrentDensityisdependingonviasize(especiallywidth)andcanrangefrom15to30ASF•酸铜比列对填孔率有很大影响•TheCopper/SulfuricAcidratioisveryimportanttomaintaintokeepgoodfillingratio.JetchemInternationalCo.,Ltd.•好的循环对提升填孔率有益•Goodagitationisrequiredtoachievegoodfillingratioandlowdimple•.要填满5mil的盲孔，面铜厚度要到1.2mil，dimple会200mil.•Withincreasingviawidth(over120μm),itisrequiredtoincreasefinalcopperthickness(upto30μm)ifwewanttoachievedimple\5μm.•不溶性阳极会延长槽液寿命•Bathlifewithinsolubleanodesisgreatlyincreased.工艺参数和操作：ProcessparametersandOperation:JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.JetchemInternationalCo.,Ltd.填孔电镀实例介绍