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COM-Express产品介绍和设计指南Hank郭恒AE技术支持工程师2014/12/26Thepulseofinnovation-2开门见山|12/26/20142Mini(84*55)Compact(95*95)Basic(125*95)ThepulseofinnovationProcessor/ComputerBoard计算机板|12/26/20143Thepulseofinnovation-4ProcessorBoards常见处理器板|12/26/20144CPCICPCI-SVPX2.5Pico-ITXMini-ITXATCAMicro-ATXATXPICMG1.0/1.3PC/104ComputerBlade计算机刀片Motherboard主板SingleBoardComputer(SBC)单板计算机ETXQsevenCOMeCOM计算机模块Thepulseofinnovation-5ComparingbetweenCPUBoards不同主板形式的对比|12/26/20145+=+=+更快捷，更简单，更通用更灵活，更专用，更强固COMe(COM)PC/104(SBC)ATX(Motherboard)ThepulseofinnovationComputer-On-Module计算机模块|12/26/20146Thepulseofinnovation-7WhatisComputer-On-Module什么是计算机模块|12/26/20147»高度集成的模块化产品»无常规接插件»需要配合载板使用Computer-on-Module»Motherboardor»SingleBoardComputerThepulseofinnovation-8Usemethod使用方法|12/26/20148Thepulseofinnovation-9»COMe（125x95,95x95,84x55,当前主流计算机模块类型,产品线丰富）»ETX（114x95,上一代广泛使用的模块类型,目前产品已很少）»Qseven（40x70,70x70,金手指,产品少）»SMARC/ULP-COM（82x50,82x80,金手指,ARM/x86,New)»DIMM-PC（68x40,金手指,卡扣固定,产品少）ComparingbetweenCOMs不同计算机模块的对比|12/26/20149EXTQsevenSMARCDIMM-PCThepulseofinnovationCOMExpress|12/26/201410Thepulseofinnovation-11»一种计算机模块»高集成度»通过专用载板进行系统扩展和功能定制»小型化、强固化的设计，适合于对机械、电气和功能有特殊要求的应用»机械和电气接口特性基于工业标准»是嵌入式应用控制器的理想解决方案，如BoxPC,CompactPCI,VPX,HMI,Machinecontroller,ruggedlaptops,ruggedtables,等»PICMG开放化标准WhatisCOMExpress?COMe简介|12/26/201411Thepulseofinnovation-12»COMe是一种非常紧凑的、高集成度的计算机模块，适合各种应用需求»外形及接口定义符合开放式规范（PICMGCOM.0），客户可以开发一款载板而适应各厂商、各代次的计算机模块»载板设计者可以灵活选择整个载板和设备的物理结构，而不拘泥于某一现有的主板（如ATX）规范»通过兼容性设计，同一款载板可以兼容不同尺寸和引脚定义的模块。良好的适应性利于成本控制和系统升级»将主板最为复杂的部分模块化，有利于减少研发成本，并加速产品上市和获取市场回馈»形式一致即功能一致，可降低当前和将来的设计风险»专注核心市场和能力»有大量的COM供应商可供选择»可以快速导入新兴技术»规范设计时已为新兴技术留有裕度（2.5GHzPCIe→5.0GHzPCIe→8.0GHzPCIe）BenefitsofCOMeCOMe产品的优势|12/26/201412Thepulseofinnovation-13COMeConnector连接器|12/26/201413220Pin,5mmor8mmstackheight,HighSpeedReceptacleModuleConnectorPlugCarrierBoardConnector5mmsingle,220pinTyco3-1827253-6FoxconnQT002206-2131-3Hept401-51101-515mmdual,440pinTyco3-1827233-6FoxconnQT002206-2141-3Hept401-51501-518mmsingle,220pinTyco3-6318491-6FoxconnQT002206-4131-3Hept401-55101-518mmdual,440pinTyco3-5353652-6FoxconnQT002206-4141-3Hept401-55501-51Thepulseofinnovation-14Revision1.0(2005)Revision2.0(2010)Revision2.1(2012)Pin-outType接口信号定义类型Type1Define定义Upgrade升级Type10Define定义Upgrade升级Type2Define定义Upgrade升级Type6Define定义Upgrade升级Type3Define定义Upgrade升级Type4Define定义Upgrade升级Type5Define定义Upgrade升级Size板卡尺寸MininanonanoDefine定义CompactDefine定义BasicDefine定义ExtendedDefine定义COM.0SpecificationhistoryCOMe规范沿袭|12/26/201414Thepulseofinnovation-15FeaturePin-OutType1Min/MaxPin-OutType10Min/MaxPin-OutType2Min/MaxPin-OutType6Min/MaxAC97/HDAudio0/10/10/10/1GbitEthernet1/11/11/11/1SerialATA1/41/21/41/4ParallelATA--1/1-PCI--1/1-PCIExpressx11/61/41/61/8PCIExpressx16(PEG)--0/10/1ExpressCardSupport1/20/21/21/2USB2.04/84/84/84/8USB3.0-0/2-0/4VGA0/1-0/10/1LVDSChannelA0/10/10/10/1LVDSChannelB0/1-0/10/1eDPonLVDSCH-APins-0/1-0/1DDI0-0/1--DDI1-3---0/3LPC1/11/11/11/1ExternalSMB1/11/11/11/1ExternalI2C1/11/11/11/1GPIO8/88/88/88/8SDIO(muxedwithGPIO)-0/1-0/1SerialPort-0/2-0/2CANonSER1Pins-0/1-0/1WDT0/10/10/10/1SpeakerOut1/11/11/11/1ResetFunction1/11/11/11/1PowerButton1/11/11/11/1PowerGood1/11/11/11/1SleepInput-0/1-0/1LIDInput-0/1-0/1TrustedPlatformModule-0/1-0/1FANPWMout-0/1-0/1Pin-outTypesOverview（Revision2.1）信号定义|12/26/201415Thepulseofinnovation-16»MiniSize：84mmx55mm»CompactSize：95mmx95mm»BasicSize:125mmx95mm»ExtendedSize:155mmx110mm(noproductons)SizeandAppearance尺寸和外观|12/26/201416Thepulseofinnovation-17SizeandAppearance尺寸和外观|12/26/201417MiniCompactBasicExtendedThepulseofinnovation-18Height高度|12/26/201418Thepulseofinnovation-19COMe–cBTi6RE3845Namingrule命名规则|12/26/201419Enhancements(Opt.)R:RapidshutdownXT:ExtendedTemp.Pin-outType6:Type62:Type2...Temp.Grade(Opt.)i:Industrial工业级c:Commercial商用级PlatformcodenameBT:BayTrailCOMeFormfactorc:Compactb:Basicm:Minie.g.COMe-bIP61047UE-Basicsize-IvyBridge+PantherPoint-Type6-1047UECPUCPUnameThepulseofinnovation-20COMExpress®FamilyTechnologieBasic(125x95mm)Compact(95x95mm)Mini(55x84mm)COMe-bXX2COMe-bXX6COMe-cXX2COMe-cXX6COMe-mXX10COMe-xCT#Intel®Atom™DualCore32nmN2000,D2000/NM10COMe-x(i/c)BT#(R)Intel®Atom™BayTrail22nmE3800/CeleronCOMe-xPV2uptoIntel®Atom™DualCore45nmN4xx,D5xx/ICH8MCOMe-xOH#AMDG-SeriesAPUTXXx/A50FusionControllerHubCOMe-xTH#AMDeTrinityR-SeriesA70M3FusionControllerHubCOMe-xHL6Intel®4thgenerationi722nmIntel®8seriesCOMe-xIP#Intel®Core™i-series32nm,uptoquadcore/QM77orHM75COMe-xSC#Intel®Core™i-series32nm,uptoquadcore/QM67orHM65COMeproducts产品|12/26/201420低功耗图形性能优异高性能Thepulseofinnovation-21Thenewestproducts最新产品ProductsbaseonIntelBayTrailplatform|12/26/201421COMe-mBT(c/i)10-Intel®Atom™E3800&Celeron®Series-Upto8GBDDR3Lmemorydown(ECCoptional)-Upto8xUSB2.0,1xUSB3.0,eMMCFlash,2xSATA,SD-Card-Commercial&IndustrialGradeTempSMARC-sXBTi-Intel®Atom™E3800Series-Upto8GBDDR3Lmemorydown(ECCoptional)-1xUSB3.0,3xUSB2.0(optional1OTG)-eMMCFlash,SDIO,2xSATA-IndustrialGradeTempCOMe-mBT(i/c)6-Intel®Atom™E3800&Celeron®Series-Upto2x4GBDDR3LSODIMMdualchannel-Upto8xUSB2.0,1xUSB3.0,eMMCFlash,2xSATA,SD-Card-Commerc