Real6410HardwareDevelopmentmanualVer1.0Date:2010-05-20Real6410HardwareDevelopmentmanual(Core6410)introduce...................................72.1LayoutandFunctionalBlockDiagram...................................82.2Dimensions............................................................................82.3170-PinConnector.................................................................9Chapter3HardwarewSpecification..............................................153.1ConnectorPin-outsandCables...........................................153.2Serialport...........................................................................153.3Networkinterface.................................................................163.4AVoutinterface...................................................................163.5USBOTG.............................................................................173.6USBHOST..........................................................................173.7LCDinterface.......................................................................183.8Camerainterface.................................................................203.9extensioninterface...............................................................203.10SDcardinterface...............................................................213.11Audiointreface...................................................................22ChapterIVHardwarefeature........................................................234.1Bootmodeset......................................................................234.1.1WinceBOOTmode.......................................................244.1.2LinuxAndroidbootmdoe..............................................244.2keydefine............................................................................264.3LED......................................................................................274.4Reset...................................................................................274.5systemmemoryaddress......................................................284.6WIFIinterface......................................................................284.7GPRS/GSMmodule.............................................................304.8GPSmodule........................................................................334.9serialuse.............................................................................35Real6410HardwareDevelopmentmanual(QFPpackage).InadditiontothosefeaturesprovidedbytheCPUboardCoreWind,theexpansionboardhasexposedmanyofotherfeaturesoftheS3C6410.IthasintegratedRS232,USB,Ethernet,AudioIn/Out,Keyboard,LCD,CVBS、TVout,SDcard,camera,WiFi,GPS,GPRSandmoreotherfunctionsonboard.Somanyhardwareresourcesprovidedbytheexpansionboard,itbecomesasolidreferenceboardforcustomerdesign.1.2HardwareFeaturesTheS3C6410Xisa16/32-bitRISCmicroprocessor,whichisdesignedtoprovideacost-effective,low-powercapabilities,highperformanceApplicationProcessorsolutionformobilephonesandgeneralapplications.ToprovideoptimizedH/Wperformanceforthe2.5G&3Gcommunicationservices,theS3C6410Xadopts64/32-bitinternalbusarchitecture.ItalsoincludesmanypowerfulhardwareacceleratorsReal6410HardwareDevelopmentmanual(MFC)supportsencodinganddecodingofMPEG4/H.263/H.264anddecodingofVC1.TheReal6410SingleBoardComputerisbasedonS3C6410processoranddesignedwithatinyprocessorcardCore6410mounteddirectlyontoanexpansionboard.Thisboardischaracterizedasfollows:CPUBoardCore6410•Dimensions:60x60x2.8mm,8layer.•ARM11SamsungS3C6410,ARM1176JZF-S,upto667MHz•256MByteMoblieDDR,266MHz•1GByteNANDFlash(support8GByteNANDFlash)•iNANDFlashinterface(Cansupport8GByteiNANDFlash)•AudioI/O:WM9713chips,Supporttwo-channelAudioI/O,supportphonetalk•100MEthernet,DM9000chips•170pinexpansioninterfaces(QFPpackage)•ThemodularisledoutmostsignalsofARM11S3C6410,likeMatrixKeypad,USBOTG,USBHOST,SDIO,