软性印刷电路板的应用及发展(FPC)

律勝科技股份有限公司（MICROCOSMTECHNOLOGYCO.,LTD）軟性印刷電路板的應用及發展趨勢演講人:張漢茂E-mail:[e-mail](I).Material(II).Process(III).Application．IntroductionofPolyimide(I).Sputtering/Platingprocess(II).Castingprocess(III).Laminationprocess．FutureDevelopment․IntroductionofFPC․IntroductionofPolyimideIntroductionofFPC•MaterialCoverlayerFCCL(3-layer)FCCL(2-layer)PIfilmAdhesiveCopperfoilIntroductionofFPC•ProcessUVExposureDevelopingEtchingStrippingLaminatingIntroductionofFPC•StructureIntroductionofFPC•QuickPressIntroductionofFPC•ApplicationIntroductionofFPC•Application應用於照相頭應用於面板應用於記憶卡應用於彎曲部線路板應用於按鍵IntroductionofFPC•ApplicationIntroductionofFPC•ApplicationCopperplatingUWRWSputterCathodeRFtreatmentUWRWSputteringseedlayerSputtering/Platingprocess•Processintroduction•PretreatmentofpolyimidefilmSputtering/Platingprocess•CharacteristicofpolyimidefilmSputtering/Platingprocess•Structureofsputtering2-layerSputtering/PlatingprocessSputterSeedLayer0.1~0.4umSputtertielayer5nm~50nmPI35um(25um)PlatingCu2~8umCarrierFilm•RoughnessofMicroflexSputtering/Platingprocess•InitialpeelstrengthofsubstrateswithtiecoatmetalTiecoat（Thickness）PeelingStrength（lb/in）5µmcopper12µmcopperMicroflex（100Å）5.26.5Cr（150Å）4.55.7NiCr（100Å）4.05.1NiCr（200Å）4.66.0Monel（100Å）4.25.3None2.42.8Sputtering/Platingprocess012345670255075100Time(hours)Peel(lb/in)Microflex（100Å）NiCr（100Å）Cr（150Å）NiCr（200Å）Monel（100Å）None•Peelstrengthafterthermalaginginairat150℃Sputtering/PlatingprocessIPC-TM650.2.4.9。00.30.60.91.2原始拉力0.980.950.980.940.990.96Sample1Sample2Sample3Sample4Sample5AVEkgf/cmSputtering2-layer(PSTC1081)ofMicrocosm•PeelstrengthIPCTM650-2.5.17。Sample14.7763E+16ΩSample51.0009E+15ΩSample23.3393E+16ΩSample61.2865E+16ΩSample31.4879E+15ΩSample75.4538E+15ΩSample44.1047E+15ΩSample81.8551E+16Ω•SurfaceresistanceSputtering2-layer(PSTC1081)ofMicrocosmIPC-FC-241/2CLASS1MethodB。%1002×−′+−′CDCDDCABABBASample1Sample2Sample3Sample4Sample5Sample6AVETD(%)0.0530.0550.0490.0410.0360.460.047MD(%)0.0380.0430.0360.0340.0350.360.037•DimensionalstabilitySputtering2-layer(PSTC1081)ofMicrocosm•IPCTestSputtering2-layer(PSTC1081)ofMicrocosm•MITTestSputtering2-layer(PSTC1081)ofMicrocosm․PeelStrengthReliability00.10.20.30.40.50.6PCTTCTHTA(kgf/cm)TestItemConditionOriginalValue(kgf/cm)Reliability(kgf/cm)PCT:pressurecookertest120℃.85%RH.1&7atm.100Hr0.980.33TCT:thermalcycletest-40℃&85℃.SteadyTemperature.50cycle0.980.42HTA:Hightemperatureaging160℃.24Hr0.980.42Sputtering2-layer(PSTC1081)ofMicrocosm․IonmigrationTestSputtering2-layer(PSTC1081)ofMicrocosm30umPitch0246810010020030040050060070080090010001100Time(Hr)Log(R)MicrocosmT-ComanyPitch:30um1010hrs(全部測試時間:1010小時)Testingcondition:85℃/85%RH/60V․SmallerpitchlinewithoutsideetchingSputtering2-layer(PSTC1081)ofMicrocosm30umPitchCircuit：45umPitchCircuit：DianhydrideDiaminePolyamicacidvarnishStirringreactionCastingprocess•VarnishpreparationPolyamicacidvarnishRWUWCuFoilDryingheaterCastingprocess•Casting&DryingTimeTemp.PolyimidePolyamicacidvarnish-H2OCastingprocess•Thermalimidization•MonomerCastingprocessDianhydride/Diamine=1PMDA+BPDA60wt%dianhydridePDA50wt%diamine•RoughnessofcopperfoilCastingprocess•TreatmentofsurfaceIntroductionofCopperfoilIntroductionofCopperfoil•RoughnessofMattesideCastingprocess•CrystalorientationofcopperfoilCastingprocess•CrystalorientationofcopperfoilCastingprocess•ComparewithEDandRA資料來源：三井金屬CategoryItemno.FCCLStructureCoverlayCycles2-layerPSTI09123-layer(standardRA)PSBR1209½ozRACuSinglesided½milPI½ozRACuSinglesided½milPI½milPI15umAD50~60K150~160K½milPI15umADMulti-Flexwith5layers•HingeofclamshellmobilephoneCasting2-layerofMicrocosm•ComparePI&TPILaminationprocess高分子結構fairExpensiveYesTPIexcellentCheapNoPI耐熱性單體價格加工性差異性種類高分子結構fairExpensiveYesTPIexcellentCheapNoPI耐熱性單體價格加工性差異性種類CNCCNCOOOOnOOOCNCOOnCCF3CF3CNCOOPI(Polyimide)：HighTgandTmTd,hardtowork.TPI(ThermoplasticPolyimide)：TdTm(300~380℃),workbetweenTdandTm.Laminationprocess•Processintroduction-FilmtypeUWPre-heatingAnnealingRWHeatPressureRollCuCuTPIW-helicalRollerLaminationprocess•Processintroduction-CastingTypeRWUWCuFoilDryingheaterPAARWUWCuFoilDryingheaterTPAA2’ndlayerTPAAcoating1’stlayerPAAcoatingFutureDevelopment•PSPI非感光性聚亞醯胺系自身感光性壓克力系自身感光性環氧系感光性聚亞醯胺系材料耐熱性NipponSteelSFP•Tg=330℃•Resolution:≤100μmDu-PontPC1000•Tg=45℃•Resolution:≤50μmNipponpolytech/Roger•Tg=90℃•Resolution:≤50μmMitsuiOSR-100•Tg=200℃•Resolution:≤100μm材料種類FutureDevelopment•HeatConductionDielectricLayer~Thankyou.~~Thankyou.~MicrocosmTechnologyCo.,Ltd.MicrocosmTechnologyCo.,Ltd.