手机摄像头介绍

[e-mail]’sprincipium.ThestructureoftheCameraandsubassembly.Theguidelineofcamera.Thecameraroadmap.PresentationofCamera1.0Aroutineofpresentation2.0TechnologyofpresentationFormechanical1.0AroutineofpresentationCAMERACAMERAmobilephone30130200.PresentationofCameraFormechanical.PresentationofCamera2.0TechnologyofpresentationGeneralDescriptionThecameramoduleisasensorsonboardmoduledesignedformobileapplicationwherelowpowerconsumptionandsmallsizeareofutmostimportance.ProprietarysensortechnologyutilizesadvancedalgorithmstocancelFixedPatternNoise(FPN),eliminatesmearing,anddrasticallyreduceblooming.AllrequiredcamerafunctionsareprogrammablethroughtheSerialCameraControlBus(SCCB)interface.Thedevicecanbeprogrammedtoprovideimageoutputinvariousfullyprocessedandencodedformats.ApplicationPCCamera/DualMode,andCellularphonesVideoconferenceequipment,Machinevision,Securitycamera,Biometrics,DigitalStillCamerasFormechanical.Cameraofallsort1.0Digitalcamera2.0DigitalStillCamerasFormechanical.Cameraofallsort1.0DigitalcameraUSBHOSTSYSTEMCAMERAUSBIO(BTB,USB,MINIUSB…)HOSTSYSTEMHOSTSYSTEMDISPLAYCAMERACAMERADIGITALCAMERAFormechanical.Cameraofallsort2.0SimulantcameraSYSTEMMEMORYHOSTSYSTEMHOSTSYSTEMDISPLAYFormechanical.Camera’sprincipium1.0GeneralDescription2.0SystemShowFormechanical.Camera’sprincipium1.0GeneralDescriptionLENSA/DDSPIODISPLAYFormechanicalCAMERALENSA/D(CMOSIODISPLAYSCESENSOR(DSP)(PC)(PIC).Camera’sprincipium2.0SystemShowFormechanical.Camera’sprincipiumFormechanical.Camera’sprincipiumMicroMI360CMOSFormechanical.ThestructureoftheCameraandsubassemblyCCDCCD“LENS”CAMERASENSORCCDLENSSENSORSENSORSENSORLENS“”A.RGBR.G.BRGBB.CMYKCMYKRGB“SENSOR”CCDSENSORSENSORDSPFormechanicalSolderingreflowprocesscanbeapplicableforthesocket.SocketsareappliedfromSocketmakerdirectly.AssemblymethodproposalAssemblymethodproposalSockettype(cameramoduledetachable)Formechanical.ThestructureoftheCameraandsubassemblySi-subReadoutgatephotodiodennDetectionNodeSiO2Micro-lensColorFilterSurfaceshieldnLeakcurrentflowingintophotodiodedefectCCDFormechanical.ThestructureoftheCameraandsubassembly1.0LENSCAMERAPLASTIC)(GLASS)CAMERA1P,2P,1G1P,1G3P,2G2P,4GMOBILEPHONECAMERA1G3P132.0SENSORSENSORSENSORCCDChargeCoupleDevice)CMOSComplementaryMetalOxideSemiconductorFormechanical.ThestructureoftheCameraandsubassembly¾CCD/CMOSA.CCDCMOSAADCB.CCDCMOSCMOSCCDFormechanical.ThestructureoftheCameraandsubassemblyC.CCDCCDADC34CMOSCCD1/3CMOS3.3VFormechanical.ThestructureoftheCameraandsubassemblyCCDsensorElectronOxidelayer氧AluminumlayerD.Structurecomparison:CCDsensor&CMOSsensorVerticalCCDHorizontalCCDVerticalCCDVerticalscanHorizontalscanCMOSsensorElectronFormechanical.ThestructureoftheCameraandsubassemblyHorizontalCCDVerticalCCDVerticalCCDAmpTrPhotodiodeIT-CCDFT-CCDHorizontalCCDVerticalCCDVerticalCCDPDPDPDPDPDPDPDPDPDPDPDPDPDPDPDPDVerticalCCDPDPDPDPDPDPDPDPDVerticalCCDPDPDPDPDPDPDPDPDPDPDPDPDPDtoV-CCDV-CCDtoH-CCDH-CCDtoAmpTrStoragesectionImagesectionInterlinetransferCCDFrametransferCCDE.OperationComparisonFormechanical.ThestructureoftheCameraandsubassemblyHorizontalCCDVerticalCCDAmpTrPhotodiodeFIT-CCDPDPDPDPDPDPDPDPDPDPDPDPDStoragesectionImagesectionVerticalCCDVerticalCCDFrameinterlinetransferCCDFormechanical.ThestructureoftheCameraandsubassemblyPerformancecomparison(CCD)ThesamepixelsizeisassumedITCCDFTCCDFITCCDDyastronsensorSensitivitygoodgoodwithoutmicrolensgoodgoodNoisegoodfairgoodgoodSmearlargelargesmallNoneChipsizesmalllargelargesmallFormechanical.ThestructureoftheCameraandsubassembly1k30010030101033100300Arrayresolution(10kpixels)CMOS(NoADC)CCDwithdriverandADCProportionaltosquarerootofarrayresolutionProportionaltoarrayresolutionmakesbigdifferenceinMegapixelareaF.Powerconsumptioncomparison:CMOSsensor–CCDFormechanical.ThestructureoftheCameraandsubassembly(CCDblock)CCDdrivecircuit:2or3chip+3powerSizeofmoduleislarge(CMOSblock)includedrivecircutSizeofmoduleissmallH-DriverV-DriverTGS/H,A/D,DSP3powersourceOpticallensCCDOpticalLensCMOS(DSP&JPEG)Imageprocessor(JPEG)Imageprocessor1or2powersourceMechanicalshutter+2.5V+1.5V+5V-7.5V+15VH.ModuleconstructioncomparisonCMOSvsCCDFormechanical.ThestructureoftheCameraandsubassemblyCCD:MIDDSP:flipchipCCD:CSPDSP:MCPBGACCD:WirebondingDSP:MCPBGAI.CCDcameramodulestructureElaboratehighdensityassemblytechnologyisrequiredineachcasetoinstallseveralsemiconductorchipsandmanypassivesontoboard.Formechanical.ThestructureoftheCameraandsubassemblySubstrate(FR4)SensorchipIRcutglassLensJ.DynastroncameramodulestructureMuchsimplerassemblyowingtosinglechipandfewerpassivesFormechanical.ThestructureoftheCameraandsubassembly¾CMOSA.CCD“”B.5luxC.CCDCCDMOBILEPHONECAMREACMOSMOBILEPHONECCDCAMERAFormechanical.ThestructureoftheCameraandsubassembly3.0A/DA/DADC(AnalogDigitalConverter)ADCCAMERASYSTEMADCCAMERACMOSA/D4.0DSPDSPDIGITALSIGNALPROCESSINGUSBPCDSP:A.ISPimagesignalprocessorB.JPEGencoderJPEGC.USBdevicecontrollerUSBFormechanical.ThestructureoftheCameraandsubassembl