电化学技术在印制电路板含铜废液处理的应用雷一锋

*510651、。、。。APPLICATIONOFELECTROCHEMICALTECHNOLOGIESINTREATMENTOFWASTEWATERCONTAININGCOPPERFROMPRINTEDCIRCUITBOARDSINDUSTRYLeiYifengJiangYusiHuangQishuZhangJianhuaChengHuayueDepartmentofRareMetalsGuangzhouResearchInstituteofNonferrousMetalsGuangzhou510651ChinaAbstractMuchattentionhasbeenpaidtotheelectrochemicaltechnologiesfortheirtechnologicalflexibilityeasycontrolandfriendlyenvironment.Thearticleintroducesthefundamentalprinciplesofcommonelectrochemicaltechnologiessuchasinnerelectrolysisgeneralelectrolysisandmembraneelectrolysis.Itreviewstheapplicationofelectrochemicaltechnologiestoregenerationandcopperrecoveryfromthewastewatercontainingcopperinprintedcircuitboardindustryandanalysestheadvantagesanddisadvantagesofelectrochemicaltechnologies.Inadditionthefutureofelectrochemicaltechnologiesfortreatmentofspentsolutioncontainingcopperisprospected.Keywordsprintedcircuitboardspentsolutioncontainingcopperelectrochemicaltechnologiesapplication*2007B080203003。、。。、。。。1、、100～160g/L20～25g/L30～50g/L。CuH2O42+CuCl42－、CuNH342+、CuC4H4O646－。pH8.0～8.51mol/L。22.1－。2.26320112291DOI:10.13205/j.hjgc.2011.01.012。2.3。1。2。3。33.1。5∶1～6∶1。R.OttH.Reith1。7.5∶1。。。Hillis2。10。。5～8V。84.3%、。1995。Oxley31995。1KnockdownCellCuCl42－CuCl32－2PlatingCellCuCl32－。CuCl32－、CuCl42－、。、。CuCl32－CuCl42－。Wu4、、、CuCl32－CuCl42－。91.2%1.3μm/min。5-6、95%、85%～87%。。3.2Konstanouros7、、95%v/v5%。。Cordani87.5～10.5A/dm2。、。Cordani97320112291。。Warheit101.5～20g/L15A/dm2。。3.3TuraevKruglikov11Horn0.1mol/L。91%。3.4。3.4.1TuraevKruglikov121mol/L。CuCl32－。3.4.2Reteccell、Chemmetcocell。。Wang13-14EMEWcell2A/dm290%97%。3.4.3JuangLin15IrO20.1mol/L。1.39A/dm220mmol/L90%96%。4。。1、、/。2、。3、。1OttRReithR.Methodandapparatusforregenerationofacopper-containingetchingsolutionP.US45085991985-04-02.2HillsMR.MethodfortheelectrolyticregenerationofetchantsformetalsP.US44683051984-07-28.3OxleyJESmialekRJPullRA.ApparatusandaprocessforregeneratingaCuCl.sub2etchantP.US57050481998-06-06.4WuQLamWHTsuiYC.MaintaininghighetchingcopperbyadvancedoxidationprocessJ.JournaloftheHongkongPrintedCircuitAssociation20061912-16.5.J.2009293235-238.6.P.CN1015321362009-9-16.7KonstanourosE.MethodofregeneratingammoniacaletchingsolutionsusefulforetchingmetalliccopperP.US42808871981-07-28.8CordaniJL.ProcessforregenaratingammoniacalchlorideetchantP.US50587301992-02-04.9CordaniJL.Processfordirectelectrolyticregenarationofchloride-basedammoniacalcopperetchantbathP.US52483981993-09-28.10WarheitKE.ProcessforreconditioningausedammoniacalcopperetchingsolutioncontainingcoppersoluteP.US44902241984-11-25.11TuraevDYKruglikovSS.RegenerationofasolutionforelectrolesscopperplatingJ.RussianJournalofAppliedChemistry2005784579-583.12TuraevDYKruglikovSSParfenovaAV.RegenerationbymembraneelectrolysisofanetchingsolutionbasedoncopperchlorideJ.RussianJournalofAppliedChemistry20057891444-1449.50832011229128000/tmPAC∶mPAM=4∶1201.3～180.500.535～0.528。。。54、pH、。pH300r/minpH=63g/LmPAC∶mPAM=4∶1SS4857mg/L3358NTUSS25mg/L7.09NTUGB8978—1996SS≤70mg/L。1.J.200923133-37.2.J.200622467-71.3.M.1989.4BeltránHerediaJSánchezMartínJ.MunicipalwastewatertreatmentbymodifiedtanninflocculantagentJ.Desalination20092491353-358.5.J.20095191-192.6.M.200513-14.7HoYCNorliIAlkarkhiAFMetal.CharacterizationofbiopolymericflocculantpectinandorganicsyntheticflocculantPAMAcomparativestudyontreatmentandoptimizationinkaolinsuspensionJ.BioresourceTechnology201010141166-1174.8.PAM-PACJ.199210310-15.9.PACPAMJ.200834958-60.10.--J.200927258-62.11ErsoyB.EffectofpHandpolymerchargedensityonsettlingrateandturbidityofnaturalstonesuspensionsJ.InternationalJournalofMineralProcessing2005753/[e-mail]2010－07－19櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅櫅3813WangShijie.RecoveringcopperusingacombinationofelectrolyticcellsJ.JournaloftheMineralsMetalsandMaterialsSociety2002651-54.14WangShijie.RecoveringcopperusingacombinationofelectrolyticcellsJ.JournaloftheMineralsMetalsandMaterialsSociety2008601041-45.15JuangRueyshinLinLinchun.Electrochemicaltreatmentofcopperfromaqueouscitratesolutionsusingacation-selectivemembrareJ.SeparationPurification[e-mail]2010－05－120520112291