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1,1,2(1.,221008;2.,200051):,:;;:X705:B:1004-695X(2003)03-0047-04MechanicalRecyclingofElectronicsScrapCurrentStatusandProspectsCHAIXiao2lan1,ZHAOYue2min1,WNAGChun2yan2(1.SchoolofChemistryandEngineeringTechnology,CUMT,Xuzhou,Jiangsu221008,China;2.DonghuaUniversity,Shanghai200051,China)Abstract:Wastedelectricandelectronicequipments(WEEEs)wererecognizedasanenvironmentalchallengeintheworld.Inthispaper,thecharacteristicsofWEEEsandsomequalititiesrelatedtomechanicalrecyclingwasanalyzed.Thestatusofmechanicalprocessingtechnologyandcommercialapplicationandprospectswerepresented.Keywords:Wastedelectricandelectronicequipments;Recycling;Mechanicalseparation,:,,01454kg11362kg,[1]10t[2],,,,,,,,,10%,90%,20044kg,25%;200680%,IT75%,60%[3],:2002-11-29;:2003-01-02:(1978),,,,11.1,19924.5,2005[4],19982060,20051,2.1t1%600800t,4%,516%28%,35[3]60t,74163200391%[5]2080,,1.1,1.5,3.2,,400,500,50020031.240%30%30%(12)1[6]%323221523514691116104104178514151302[7]%2012228414015663301C-H-O25430,20%,1968,82t,1973127t,1978,80t/a,,[8],9193.4[9],,,1.3(3),199570,[10]3[11],15.25543.253.25mgPkg,[12],20001/3,[4],21724kg,,4540kg[13],,,22.1,,40,,4,2.22,,,,,,1942,,,,,84153.20039,,:,Zhang76%,83%91%,72%3281908gPt[14]4[15]19.321.410.211.31.74.5690.91.0--1.01.11.11.52.3;:,,,Zhang,85%,90%[16]KrowinkelJ.M.6mm,76%,16%,89%[17]2.4,,,,,,5mm,96.5%99.5%[15]3:;;3.1:,;,,;,;,[18],,StennettA.D.[19],[20],[21]IBM1994,3178kg,5000,1000500[22],200kg[23]:,,,,,,3.2,ZhangS.,3mm,;16mm,;7mm;,[24]94153.200393131969,0.23tPh:,,,-,,,,11991,[25],,AlSi5Cu13t,2,95%99%,91%99%,0.5%5%[23],,3,100300m94%,,82%[26]23,,,,(67)05153.20039K+Mg2+Mg2+Mg2+12mgPL0,,,Mg2+12mgPL7202400mgPL,,,,,,,[][1],.UASB[M].:,2000[2],.[M].:,2000[3],,,.[J].,1999,19(4):20(50),4,,,,21[][1]LEEGoldberg.TheAdventofGreenComputerDesign[J].Com2puter,1998(9):16-19[2]WINMERBSeaver.DesignConsiderationsforRemanufacturability,RecyclabilityandReusabilityofUserInterfaceModules[J].IEEE,1994.241-245[3]DIRKBoghe.ElectronicScrap:AGrowingResource[J].PreciousMetals,2001(7):21-24[4]ARENSMANRuss.ReadyforRecycling[J].ElectronicBusiness,1997,26(12):108-115[5]ONORATODanielle.JapaneseRecyclingLawTakesEffect[J].WasteAge,2001,32(6):25-26[6]JURGENErtel.CurrentTechnologiesfortheValorisationofPCBsandElectronicWaste[J].IEEE,1994.279-282[7]NOURREDDINEMenad,BOBjorkman,SHUNLIZhang,etal.ThermodynamicConditionsfortheFormationofDioxinDuringtheRecyclingofNonFerrousMetalsfromElectricandElectronicScrap[J].EPDCongress,1998.657-673[8]LEGARTHJensBrobech,ALTINGLeo,BALDOGianLuca.Sustain2abilityIssuesinCircuitBoardRecycling[J].IEEE,1995.126-131[9]REIMERB,SODHIMS,KNIGHTWA.OptimizingElectronicsEnd-of-lifeDisposalCosts[J].IEEE,2000.342-347[10]JOHNCBullock.EnvironmentallySoundManagementofElectronicScrapandtheBaselConventiononControlofTransboundaryMove2mentsofHazardousWastesandTheirDisposal[J].IEEE,1995.192-197[11]WINTERDe,COURTNEYK.FromHeretoEternity:RecyclingHi-techJunk[J].WasteAge,2001,32(3):186-190[12]WINKAMichael,CAPPENTERJoeeph.NewJerseyDepartmentofEnvironmentalProtectionPUnionCountyDemanufacturingProgram[J].IEEE,1998.328-330[13]RecyclingElectronics[J].Environment,2000,42(8):6-7[14]ZHANGShunli,FORSSBERGEric,MENADNourredine,etal.MetalsRecyclingfromElectronicScrapbyAirTableSeparation-TheoryandApplication[A].TheTMSAnnualMeeting[C].EPDCongress1998,SanAntonio,USA:1998.16-19[15]ZHANGShunli.MechanicalRecyclingofElectronicsScrap[J].WasteManagementandResearch,1998(16):119-128[16]ZHANGShunli,ForssbergEric,ArvidsonBo,etal.AluminumRecoveryfromElectronicScrapbyHigh-ForceEddyCurrentSepara2tion[J].Resources,ConservationandRecycling,1998(23):225-241[17]KROWINKELJM,DALMIJNWL.ProcessingofTelevisionsbyMechanicalSeparationTechniques[D].4thInternationalSymposiumonRecyclingofMetalsandEngineeredMaterials,2000.47-59[18]FROHLICHG,KRAMERU.ConfigurationofaDismantlingandProcessingPlantfortheRecyclingofElectricalEquipmentandElec2tronicScrap[J].ProceedingoftheXXIMPC,Sep21-26,1997.253-260[19]STENNETTAD,WHALLEYDC.NovelReworkTechniquesforElectronicAssemblies[J].IEEE,1998.196-201[20]HARALDZebedin,KONRADDaichendt,PETERKopacek.ANewStrategyforaFlexibleSemi2automaticDisassemblingCellofPrintedCircuitBoards[J].IEEE,2001.1742-1746[21]EIICHIHirasawa.ARecyclingPlantforHomeElectricAppliances[J].MitsubishiElectricAdvance,1999(9):7-11[22]EDGrenchus,ROBERTKeene,CHARLESNobs.DemanufacturingofInformationTechnologyEquipment[J].IEEE,1997.157-160[23]RENEEStDENIS,STEVESkurnac.InformationTechnologyProductRecyclinganOemPrecyclerCollaboration[J].IEEE,1998.144-146[24]KOZLOWSKIJ,MAZURCKT,CZYZYKH.TheRecoveringMet2alsandAlloysfromtheElectronicScrap[J].Metall,2000,54(11):645-649[25]ZHANGShunli,ERICForssberg.IntelligentLiberationandClassifica2tionElectronicScrap[J].PowderTechnology,1999(105):295-301[26]YAKOYAMAS,IJIM.RecyclingofThermosettingPlasticWastefromElectronicComponentsProductionProcess[J].IEEE,1995.132-13776163.UASB20039