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软硬结合板设计制作指引与生产控制要点目录•软硬结合板的常见结构及工艺流程•软硬结合板的设计指引•软硬结合板的生产控制要点常见结构及工艺流程（4L）•1R+2F+1R：单面硬板夹软板结构RigidmaterialFlexmaterialR-FpartFlexpartTopS/MTaiyoPSR400032L135102Coverlay12um12AD25um25L2CopperCopper18um1414PIPI25um2525L3CopperCopper18um1414AD25um25Coverlay12um1250umAD50200umStiffener102200L435BottomS/MTaiyoPSR400032TotalThickness520377GMEDesignFinish(um)GraceGracePanasonicFCCL6564R15660.102mm(H/0)R1551NFPP1080LayerType4LR-FStack-upGMEproposalasbelow:1.Coverlaysupplier:Grace2.Rigidmaterialsupplier:Panasonic3.FCCLsupplier:Panasonic4.Stiffener:FR4with3MPSAglue5.IVHholewallcopperthickness(bybuttonplatingprocess):10ummin.6.THholewallcopperthickness:18ummin.20umavg.7.Flexfinishedboardthickness:0.377+/-0.05mm8.Totalfinishedboardthickness:0.52mm+/-0.08mmR15660.102mm(0/H)coreNFPPNFPPcoreR1551NFPP1080L2-L3Boardcutting–Mech.drill–Shadow–Buttonimage--ButtonPlating–I/LD/F–I/Lexposure–DES–AOI–B.O.–StickingCoverlay–Pressingcoverlay–MeasuringexpansionCoefficient–PEPunch--FQCL1-L4NFPPOpen–Plasma–B.O.–Pressing(L1&L4isSinglecoppercore)–Mech.Drill–De-burr–De-smear–PTH+Flash–PanelPlating–OLD/F–OLexposure–DES–AOI–S/M–C/M–ENIG–Pre-Routing–LaserDe-cap–LaserRouting–Routing–ET–Pressingstiffener–FQC–Packing常见结构及工艺流程（6L）•2R+2F+2R：双面硬板夹软板结构LayerTypeCust.DesignMaterialtypeFinishedsoldermaskPSR400030umL1CopperH35umcore150150umL2CopperH15umCoverlay25umAD25umL3CopperCopper17.5um17.5umH15umPIPI50um50um50umL4CopperCopper17.5um17.5umH15umAD25umCoverlay25umL5CopperH15umcore150150umL6CopperH35umsoldermaskPSR400030um790um125um125umNo-FlowPPNo-FlowPP2116RC57%2116RC57%Customerrequirement:0.8+/-0.15mmStack-upL3-L4Boardcutting–I/LD/F–I/Lexposure–DES–AOI–B.O.–StickingCoverlay–Pressingcoverlay–MeasuringexpansionCoefficient–PEPunch--FQCL12/L56Boardcutting—I/LD/F—DES—PEPunch—AOI—B/OL1-L6NFPPOpen–Plasma–B.O.–Pressing(L12&&L34&L56)–Mech.Drill–De-burr–De-smear–PTH+Flash–OLD/F–OLexposure–Patternplate—SES–AOI–S/M–C/M–ENIG–Pre-Routing–LaserDe-cap–LaserRouting–Routing–ET–Pressingstiffener–FQC–PackingLayerCust.DesignGMEproposalCucontentFinish(um)PSR4000G23KPSR4000G23K30L1HT38.0%35TUC-72P-710673%Normal10678%48.3L238.0%3550.8coverlay13umNFPP10672%AD25umL3Copper18um40.0%15PI50umFlexcore50.8L4Copper18um44.5%15AD25umcoverlay13umNFPP10672%50.8L538.0%35TUC-72P-710673%Normal10678%48.30L6HT38.0%35PSR4000G23K30572GMEsuggestmaterial:PanasonicR1556WandR1551LVR1566W2milcoreTUC-722-72mil(H/0)4548TUC-84PNF10670%Stack-upTUC-722-72mil(H/0)TUC-84PNF10670%R1566W2milcore常见结构及工艺流程（1+HDI6L）•1+1R+2F+1R+1：1+HDI结构的硬板夹软板结构L3-L4Boardcutting–I/LD/F–I/Lexposure–DES---––AOI–B.O.–StickingCoverlay–Pressingcoverlay–MeasuringexpansionCoefficient–PEPunch--FQCL2/L5Boardcutting—I/LD/F—DES（蚀刻单面）—PEPunch—AOI—B/O（Core厚大于0.2mm，需要在B/O前做预激光切割）L25NFPPOpen–Plasma–B.O.–Pressing(L2&&L34&L5)–Mech.Drill–De-burr–De-smear–PTH+Flash–PanelPlate—ILD/F–DES–AOI—B/OL16Pressing—LaserDrill—Mech.Drill–De-burr–De-smear–PTH+Flash—ODF—PatternPlate—SES—AOI—S/M–C/M–ENIG–Pre-Routing–LaserDe-cap–LaserRouting–Routing–ET–Pressingstiffener–FQC–PackingSolderResist20µmsoldermaskCopper41µm112µmNoflowprepreg58µmNo-flowPPCopper31µm212µmNoflowprepregstifferner45µmNo-flowPPCoverlayPI13µmAdhensive25µmCopper312µmPIflexCorePolyimide50µmCopper412µmAdhensive25µmCoverlayPIstifferner13µmNoflowprepreg45µmNo-flowPPCopper512µm31µmNoflowprepreg58µmNo-flowPPCopper612µm41µmSolderResist20µmsoldermaskTotal512µmFCCLcoverlaycoverlay常见结构及工艺流程（2+HDI6L）•1+1F+2F+1F+1：2+HDI结构L3-L4Boardcutting–Mech.Drill–Shadow--ButtonImage–Buttonplate--I/LD/F–I/Lexposure–DES––AOI–B.O.–StickingCoverlay–Pressingcoverlay–ENIG–PunchFinger--MeasuringexpansionCoefficient–PEPunch--FQCL2/L5Boardcutting(SinglesideFCCLPreparation)L25NFPPOpen–Plasma–B.O.–Pressing(L2&&L34&L5)–LaserDrill––De-smear–PTH+Flash–PanelPlate—ILD/F–DES–UVCutPI--AOI—B/OL16Pressing—LaserDrill—Mech.Drill–De-burr–De-smear–PTH+Flash—PanelPlate—D/F---DES—AOI—S/M–C/M–ENIG–Pre-Routing–LaserDe-cap–LaserRouting–Routing–ET–Pressingstiffener–FQC–PackingLayerTypeCust.DesignMaterialtypeCoppercontentFinishedsoldermask20umPSR400030umL1Foil+plating30umH46.20%35umNormalPP60um1080RC62%44umR1566WL2Copper30umH55.30%35umcore100um4mil100umL3Copper18umH50.30%15umCoverlay13umR1566VAD15umL4CopperCopper18um18umH57.80%15umPIPI25um25um1mil25umL5CopperCopper18um18umH32.40%15umAD15umR1566VCoverlay13umL6Copper18umH54.40%15umcore100um4mil100umL7Copper30umH54.80%35umNormalPP60um1080RC62%44umR1566WL8Foil+plating30umH45.90%35umsoldermask20umPSR400030umTotal:777um743umStack-up100um100umNo-FlowPPNo-FlowPP2116RC47%2116RC47%83um86um1+HDI硬板夹软板的层压结构常见结构及工艺流程（1+HDI8L）L4-L5Boardcutting–I/LD/F–I/Lexposure–DES–AOI–B.O.–StickingCoverlay–Pressingcoverlay–MeasuringexpansionCoefficient–PEPunch--FQCL23/L67Boardcutting–I/LDF–ILexposure–DES–PEPunch---AOI—B.O.L27NFPPOpen–Plasma–B.O.–Pressing(L23&&L45&L67)–Mech.Drill––De-smear–PTH+Flash–PanelPlate—ILD/F–DES–AOI—B/OL16Pressing—LaserDrill—Mech.Drill–De-burr–De-smear–PTH+Flash—PanelPlate—D/F---DES—AOI—S/M–C/M–ENIG–Pre-Routing–LaserDe-cap–LaserRouting–Routing–ET–Pressingstiffener–FQC–Packing两次压合2+HDI硬板夹软板的结构常见结构及工艺流程（2+HDI