铝基板制作流程

深入Thorough專注Studious紮實Steady精緻化ExquisitePage1競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD鋁基板制作流程介紹深入Thorough專注Studious紮實Steady精緻化ExquisitePage2競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD一、鋁基板制程•1、噴錫流程：來料檢查→一次沖/鑽孔→圖形轉移→圖形檢查→蝕刻→退膜→蝕檢→阻焊制作→打定位孔→字符制作→噴錫→噴錫檢查→單面磨板（依客戶要求而定）→V-CUT/成型→通斷測試→高壓測試→FQC、FQA→包裝入庫深入Thorough專注Studious紮實Steady精緻化ExquisitePage3競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2、OSP流程来料检查→一次冲/钻孔→图形转移→图形检查→蚀刻→退膜→蚀检→→阻焊制作→打定位孔→字符制作→V-CUT/成型→测试→FQC、FQA→OSP→FQC→包装入库深入Thorough專注Studious紮實Steady精緻化ExquisitePage4競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD二、制程制作事项•2.1来料检查IQCA、铜面检查：不允许有凹坑、擦花和严重氧化痕迹；Cusurfacecheck:Notches,scratchesandseriousoxidationarenotallowed.B、保护膜检查：保护膜不应有破损至铝面露出；Protectivefilmcheck:Protectivefilmmustn’tbebrokenwithCuexposure.C、厚度检查：按流程卡要求检测板厚、铜厚。Thicknesscheck:CheckboardthicknessandCuthicknessaccordingtolotcard.深入Thorough專注Studious紮實Steady精緻化ExquisitePage5競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2.2一次冲/钻孔One-timeHole-punching/drillingA、一次冲/钻孔主要冲管位孔和工艺孔，孔位和孔徑均要符合图纸要求；One-timehole-punching/drillingismainlytopunchorientation-holeandtechnicalhole.Thehole-positionandhole-diametermustbeconsistentwithdrawingrequirement.B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花；Punching/drillingdirectionisfromCusurfacetoAlsurface,whichcaneffectivelyavoidscratchesofAlsurface.深入Thorough專注Studious紮實Steady精緻化ExquisitePage6競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2.3、图形转移ImageTransferA、磨板Scrubbinga、为提高干膜和保护膜面的结合力，防止保护膜面干膜、脱落，可轻磨保护膜面；Inordertoimprovethecombinationofdryfilm&protectivefilmandtoavoidfallingoffdryfilmontheprotectivefilm,itisnecessarytolightlyscrubthesurfaceofprotectivefilm.b、不允许有板面氧化和胶渍现象。Oxidationandleftgluestainsontheboardsurfacecannotbeallowed.深入Thorough專注Studious紮實Steady精緻化ExquisitePage7競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•B贴膜Filma、干膜种类：****filmtype:***b、预烘和贴膜时间间隔要尽量短。Theintervalbetweenpre-cureandfilm-pastingtimeshouldbeasshortaspossible•C、静置冷却PlacingandCooling.為了對位的准确，需將已貼膜的鋁基板靜置冷卻至室溫。Inordertoassureaccurateregistration,itisnecessarytoplacealuminousboardwithpastedfilmforawhileuntilitreachesroomtemperature.深入Thorough專注Studious紮實Steady精緻化ExquisitePage8競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•D、曝光a、负片黄菲林；NegativeYellowFilmb、注意丝印孔对位的准确性。Payattentiontotheregistrationaccuracyofsilkscreeninghole.•E、静置Placing线路部分发生光聚反应,经15min左右充分聚合。Thelight-gatheringreactionhappensatthecircuitpartandreachesfullaggregationafter15minutes.•F、显影Developing深入Thorough專注Studious紮實Steady精緻化ExquisitePage9競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2.4圖形檢查ImageCheckA、檢查重點在于開路、短路、缺口、顯影不淨等；Mainlycheckopencircuit,shortcircuit,gapanduncleandevelopingetc.B、修板時不能用黑油筆，只能用黑油補；Blackoil-pencannotbeusedwhenmendingboardbutblackoil.深入Thorough專注Studious紮實Steady精緻化ExquisitePage10競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2.5蚀刻A、必须在首板试验合格方可批量生产；Itisobligatorytoconductmassproductionafterthefirstbatchofboardsisconfirmedtobequalified.B、不允许有保护膜破损现象，如发现保护膜破损，则应先用皱纹胶贴好再过机蚀刻；Thedilapidationofprotectivefilmisnotallowedandiftheprotectivefilmisbroken,itshoulduseadhesivetapetomenditbeforeplacingboardsontheetchingmachine.C、尽量控制一次蚀刻干净；Assureone-timecleanetchingaspossibleasitcan.D、图形内任何地方的残铜或绝缘层上的垃圾都不允许用刀片来刮；UsingknifetoscrapeoffleftCuonanypartofthepatternorthedirtontheinsulatedlayerisnotallowed.深入Thorough專注Studious紮實Steady精緻化ExquisitePage11競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2.6退膜/清洗Film-stripping/CleaningA、退膜不能浸泡在退膜缸中，必须直接过机退膜，一次性退膜干净；Tostripthefilmsclearlyatonetime,usetacklerollerinsteadofimmersinginthestrippingchemistry.B、退膜过程中残留在板面的药水会影响铝基板成品的耐用程度，故需对剥膜后的铝基板进行有效的清洗；TheresiduesofthestrippingchemistrywouldaffectthedurabilityoftheIMS,sowhichneedefficientcleaningafterstrippingfilms.C、退膜干净后的铝基板必须进行烘干处理后方可往下流程；Bakingisrequiredafterstripping.D、所有铝基板均不能进行手动蚀刻；Nomanualetchingisallowed.E、如有蚀刻不净的板子，可进行快速过机返蚀;Ifetchingwasnotwelldone,re-etchisneededquickly.深入Thorough專注Studious紮實Steady精緻化ExquisitePage12競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2.7蚀刻检查EtchingCheckA、绝缘层上的任何地方都不允许用刀片来刮；Usingknifetoscratchanypartoftheinsulatedlayerisnotallowed.B、主要检查短路、缺口、开路，报废单元不能钻孔，只能用黑油笔打“╳”；Mainlycheckshortcircuit,gap,opencircuit.Abandonedunitmustn’tbedrilledandcanonlybemarkedwith“X”byblackoil-pen.深入Thorough專注Studious紮實Steady精緻化ExquisitePage13競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTD•2、8阻焊制作SolderMaskMakingA、单面磨板（线路面），不允许板面有氧化和胶渍现象；Single-sidescrubbing(circuitside).Oxidationandgluestainsontheboardsurfacearenotallowed.B、待板子冷却至室温后印阻焊Printsoldermaskaftertheboardiscooledintoroomtemperature.C、待铝基板冷却至室温后，方可对位曝光；RegisterandexposealuminousPCBafteritiscooledintoroomtemperature.a、对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；Beforeregistration,itisnecessarytoseriouslycheckifthesensitizationoilaccumulatesontheboardsurfaceorisuneven.Ifthereisalotofsensitizationoilontheboardsurface,itmustre-processsuchboardsintime.b、对位时应注意菲林与板面MARK点的同心度；Duringregistration,itisnecessarytopayattentiontotheconcentricityofthefilmandmarkpoint.深入Thorough專注Studious紮實Steady精緻化ExquisitePage14競華電子(深圳)有限公司A+PCBElectorics(ShenZhen)Co.,LTDD、曝光：ExposingE、顯影：DevelopingF、檢查：重點檢查顯影不淨和綠肥油上焊盤；Check:Mainlycheckuncleandevelop