IC封装大全及世界各大品牌

IC封装介绍BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LQFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPSOJ32LSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO18TO220FTO220FlatPackHSOP28ITO220ITO3pJLCCLCCLDCCTO247TO264TO3TO5TO52TO71TO72LGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LTO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayMETALQUAD100LPQFP100LQFPQuadFlatPackageSOT220SOT223SOT223SOT23SOT23/SOT323uBGAMicroBallGridArrayZIPZig-ZagInlinePackageTEPBGA288LTEPBGA288LC-BendLeadCERQUADCeramicQuadFlatPackCeramicCaseLAMINATECSP112LChipScalePackageGullWingLeadsJ-STDJ-STDJointIPC/JEDECSOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackageStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsLLP8LaPCI32bit5VPeripheralComponentInterconnectPCI64bit3.3VPeripheralComponentInterconnectPCMCIAPDIPPLCCPS/2PS/2mouseportpinoutSIMM30SIMM30PinoutTO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOHICBrand