日本东京精密

东京精密株式会社公司简介东京精密株式会社是日本著名半导体制造设备之一,公司总部设在日本东京都三鹰市,在美国,欧洲,新加坡,中国等地设有分公司,研发基地或生产厂等.Wedevelopourbusinessesintwokeyareas:semiconductormanufacturingequipmentandprecisionmeasuringsystems.Ourphilosophyistogeneratelong-termgrowththroughthecreationofWIN-WIN,ormutuallybeneficial,relationships,withallourstakeholders-customers,businesspartners,shareholdersandemployees.（公司网站原文）东京精密主要从事半导体加工设备及精密测量仪器制造及开发.半导体加工设备有硅片加工用地倒角机、内圆切片机,半导体加工前道工序用的光刻机（LEEPL）、CMP、晶片表面综合检查设备及测试封装用的探针台、划片机、硅片背面抛光机等.过去，东京精密简称“TSK”，在国内半导体行业享有盛誉。现在东京精密采用了新的商标“ACCRETECH”，她是由英文成长ACCRETE和技术TECHNOLOGY的合成词，是融合公司”以WIN-WIN精神工作，创世界一流产品“经营理念的新标志。参展产品：硅片材料的内圆切片机、硅片倒角机，光刻机，CMP，硅片表面检查系统，探针台背面减薄抛光机，划片机。网址：:ProductlistWaferManufacturingSystemVarietyofproductslineforwafermanufacturersincludingWaferSlicingMachineandWaferEdgeGrindingMachine.SlicedWaferCarbonDemountingandCleaningMachine:C-RW-200/300Feature1Automaticdemountingofwafersfromtheslicingbase,cleaningandstoringintothecassette.WaferEdgeGrinding:W-GM-5200Newly-developedgrindingunitenhancestherotativeprecisionofthespindle,andimprovesthesurfaceroughness.Thenon-contactmeasuringmethodachievesthestablealignment.Performsthenon-contactmeasuringofthepre-processedwaferthicknessatmultiplepoints,thediameterandnotchdepthofthepost-processedwafer.Themodularconcepttomaketheoptimumprocesslinepossible.Lowdamagegrindingmethodisavailable.Feature1Machinespecificationreadyfor300mmand200mmwafer.Feature2Visualsystem(optional)formeasuringthechamferwidthofperipheryandnotch.WaferEdgeGrinding:W-GM-4200Newly-developedgrindingunitenhancestherotativeprecisionofthespindle,andimprovesthesurfaceroughness.Thenon-contactmeasuringmethodachievesthestablealignment.Performsthenon-contactmeasuringofthepre-processedwaferthicknessatmultiplepoints,thediameterandnotchdepthofthepost-processedwafer.Themodularconcepttomaketheoptimumprocesslinepossible.Lowdamagegrindingmethodisavailable.Feature1Machinespecificationreadyfor75-150mmwaferorfor150-200mmwafer.Feature2Capableofvariousmaterialprocesses,suchaschemicalcompoundsemiconductor.WaferSlicingMachine:S-LM-116GPreciseslicingmachineforfragilematerialssuchasglass,ceramics,ferrite.Feature116-sizebladeforeasyhandling,liftingandadjustment.Feature2Open-structureloadingunitforeasymountingoftheworkpiece.Feature3Easysettingofslicingspeedandwaferthicknesswithdigitalswitch.Feature4Strongframe,highlyrigidtableprovideslong-termstabilityinperformance.Feature5Easycoolantadjustmentanddressingoperation.WaferSlicingMachine:A-WS-100SScribeswafersubstratewithhighprecisionFeature1EasyalignmentWithfineadjustmentinhorizontalandrotativedirectionsFeature2EasyscribesettingWiththetouchpaneltosettheindexamount,numberoftimesofscribing,etc.CMPCMPsremoveunevennessonwafersurfacesthatoccurduringtheproductionprocess.Applicationsaregrowingduetotheincreaseoflayersinsemiconductordevicesandthegrowingvarietyofwiringmaterials.ChaMP:For300mmWafersCombiningthetechnologicalexpertisebuiltupbyAccretechinprecisionmeasuringequipmentandsemiconductormanufacturingequipment,wenowoffertheChaMPSeries,theCMPsystemscompatiblewith300mmwafers,withprocessperformancerequiredbydesignrulesfor90nmand32nmdevices,andabletokeepupwiththemostadvancedvolume-productionfabs.Feature1Air-floatHeadSylphideReferencepolishingismadepossibleviaanaircushionthatprovidesuniformpressuredistribution.Waferpressureisappliedbyanairbagindependentofringpressure,providingexcellentlow-pressurecontrollabilityandstability.Zonecontrolisavailable.Feature2EdgeExclusionof1mm!Feature3WaferPressureControllability&RepeatabilityFeature4SimpleMaintenanceforPolishingHeads-RingChangeDemounting(approximately5seconds)SlidethesnapringcoverupwithbothhandsSpreadthesnapringwithyourthumb(theretainingringdropsoff)CompletelyremovetheretainingringMounting(approximately10seconds)1.Gripthesnapringwithbothhandsandpushtheretainerintothecarrier.Rotateitslightlytoalignthefaceswherethepositioningframeslipsintoplace.2.Attachthesnapringroundthewholecircumferenceandslidethecoverdown.ChaMP:For150or200mmWafersFor150or200mmWafersChaMP:CompactCMPSystemSmallfootprintWaferProbingMachinesWaferprobingmachinesperformelectricaltestsofeachchiponawafer,ensuringthequalityofsemiconductordevices.WaferProbingMachines:UF3000EXNext-generationhigh-specprobingmachinetheworldNo.1supplierpresentsPhenomenallevelsofthroughputhavebeenmadepossiblewiththesynergisticeffectsofhigh-speedwaferhandlingenabledbyanewalgorithm,andthehigh-speedandlow-noiseXYStageenabledbyanewlydevelopedpurpose-builtdriveunitforprobes.TheZaxisensuresworld-classloadcapacityandhighprecision,andoffersexcellentcontactviaanoptimalstructuraldesignthatemploystopologywhichreliablyeliminateschangesinflatnessduetopositioning.WithadvancedOTSlatestpositioningsystemtechnologyandbycolorizingwaferalignmentimagingandequippingalightsupermagnificationfunction,theUF3000EXhasimproveddramaticallyintermsofprecisionandoperability.WaferProbingMachines:UF3000EX-eAssimilatingtheup-to-datetechnologiessuchasoriginativeOTS,QPUandTTG,thissup