WAT-Introduction-(Andy)

GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthWaferAcceptanceTestIntroductionGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthContentBriefideasofWATSystemintroduction(Hardware)TestEnvironment(Software)TestStructuresandTestMethodJudgement&DatareportConnectionwithEDAGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthBriefideasofWATGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthPurposeofWATWAT:Totestparametersofdevicesintestkeyswhicharemadeinscribeline.Tobasicallydefineprocesscontrolstatusandprovidethedataforimprovingprocess.TestingdatashouldmeetcustomerPCMspec.GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthTestkeyTestkey:Agroupofdeviceswhicharemadeinanarea.Thereareseveraltestkeys(Eg.7)inadie.Eachtestkeyhasitsownnameandcontainsdifferentdevices.Everytestkeyhassamepads.Testkeysineverydiesarethesame.165432712111098121110165432798Examples：GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthScribelineScribeline:TheStreetbetweendies(chips).WaferDiesDieTestkeysScribelineGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthTestStructures(Devices)TestkeyStructures1.Transistor3.Resistance5.Junction4.GoxIntegrity2.Isolaton4terminaldevicesCont./ViaResistanceSheetResistance6.OthersSTIMOSCapacitanceActivetoWellJunctionGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthSystemintroduction(Hardware)GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthWATSystemConfigurationMainPartsofWATSystem1.TesterCabinet2.Testhead3.Probecard4.ProbestationGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthSystemBlockDiagram(4072A)C3600WorkstationAgilent4284AAgilent3458ACPUDiagBoardInputSelector8SMUsGNDUMatrix48pin48ExtendedPathInputsChuckconnectionOpticalInterfaceTestheadPowerSupplyCabinetCoolingFanTestheadCoolingFanAirDuctAgilent81110A6HFPortsPulseSwitch8AUXportsTesterCabinetGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthSwitchMatrixChuckTerminal48DUTPinsSMU-1SMU-2SMU-7SMU-8GNDU8AUXPorts48-InputExtendedPorts48PulseSwitch4721232425261278122324252647481234566HighFrequencyPortsPulseSwitchInput/OutputPortsGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthProbeCardThispartactsasconnectorbetweentesterandprober,andtransfersthesignalsfromtestheadtothedevicetobetestedinthewafer.Totransferthesignalscorrectly,theremustbelittleleakageamongthepins.8765432112111098322824482016412444036GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthProbeStationAmachinetotransferwaferbyMicrons,itcanmakethedeviceconnectedwiththepinsofprobecardbymovingthewaferaccurately.Beforetesting,wafercassettemustbeloadintothestageofprober,PeoplealsomustmakeprogramwhichleadthemachinetomakecorrectconnectionbetweentheprobepinsandtestkeyGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthTestSystemTesterCabinet(Agilent4072)TestHeadGPIBcableTesterProbecardProberPadofDeviceWaferPinofProbecardGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthTestEnvironment(Software)GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthHP-UXEnvironmentEASYTOUSEHIGHPERFORMANCEI/OPOWERFULCOMPUTATIONOPTIMIZEDFORINSTRUMENTCONTROLHP-UXNETWORKINGMULTITASKINGWINDOWINGINDUSTRYSTANDARDHPBASIC/CGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthMeasurementProgrammingStyleInitializethe4070SystemApplytheappropriatebiasesResetbiasestoZerostateSTARTConnecttheDUTMeasuretheresultDisconnectDUTENDGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.Warmth5PointsMeasurementWaferDiesInWATarea,everywafermustbetested5pointsGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthHowtoperformtestingSelectwaferSelectdieSelecttestkey(Module)SelectdevicemakeconnectsBeforetestingwemustfindthedevicetobetestedSoweshouldmakeatestplanwhichdoesactionsabove.GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthTestDevicesinmodule.Padnumbersofterminalsofeachdevice.Algorithmtouseforeachdevice.ProbeSWMpinnumbertowhichthetesterappliesormeasuresV/I.WaferDieProbingposition+TestPlanSummaryGraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthWaferModuleDevice–ATestPlancontainsinformationaboutdevicetestsforawafer.–EachsetofinformationiscalledaSpec.TestPlanWaferSpecProbeSpecTestSpecDieSpecWhatisaTestPlan?GraceSemiconductorManufacturingCorp.PIEAndyWooMay2002Trust.Hardwork.WarmthDieXsize(STEPX)WaferDiameter(SIZE)12345671234567xyDefinitionofanexamplewaferCenterDieDieNamePosition(x,y)DieLabelXB8B(4,7)XB8B_1XB8B(1,4)XB8B_2XB8B(4,4)XB8B_3XB8B(7,4)XB8B_4XB8B(4,1)XB8B_5AttributeNameValueSTEPX(um)16000STEPY(um)16000SIZE150mmALIGNDIEX4ALIGNDIEY7ALIGNMODX0ALIGNMODY0CENTERDIEX4CENTERDIEY4OFFSETDIEX0OFFSETDIEY0WaferSpecParametersDieYsize(STEPY)AlignDieGraceSemiconductorManufacturingC