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半导体术语表第1页共68页A1stlevelpackaging第一级封装2ndlevelpackaging第二级封装aberration象差/色差absorption吸收accelerationcolumn加速管acceptor受主Accumulatev.积聚,堆积acid酸acousticstreaming声学流activeregion有源区activate激活activateddopant激活杂质activecomponent有源器件adsorption吸附aerosol悬浮颗粒airionizer空气电离化器alignmentmark对准标记alignment对准alloy合金半导体术语表第2页共68页alternateadj.交替的,轮流的,预备的v.交替,轮流,改变aluminum铝aluminumsubtractiveprocess铝刻蚀工艺ambient环境ammonia(NH3)氨气ammoniumfluoride(NH4F)氟化氨ammoniumhydroxide(NH4OH)氢氧化氨amorphous非晶的，无定型analog模拟信号angstrom埃anion阴离子anisotropicetchprofile各向异性刻蚀剖面anneal退火antimony(sb)锑antirelectivecoating(ARC)抗反射涂层APCVD常压化学气向淀积applicationspecificIC(ASIC)专用集成电路aqueoussolution水溶液areaarray面阵列argon（Ar）n.[化]氩半导体术语表第3页共68页arsenic(As)砷arsine(AsH3)砷化氢，砷烷ashing灰化，去胶aspectratio深宽比，高宽比aspectratiodependentetching(ARDE)与刻蚀相关的深宽比asphyxiant窒息剂assaynumber检定数atmosphericadj.大气的atmosphericpressure大气压atmosphericpressureCVD(APCVD)常压化学气向淀积atomicforcemicroscopy(AFM)原子力显微镜atomicnumber原子序数attemptn.努力,尝试,企图vt.尝试,企图augerelectronspectroscopy(AES)俄歇电子能谱仪autodoping自掺杂automaticdefectclassification(ADC)缺陷自动分类Bback-endofline(BEOL)（生产线）后端工序backgrind减薄半导体术语表第4页共68页backingfilm背膜bafflevt.困惑,阻碍,为难（挡片）baffleassemblyn.集合,装配,集会,集结,汇编（挡片块）ballgridarray(BGA)球栅阵列ballroomlayout舞厅式布局，超净间的布局barrelreactor圆桶型反应室barriermetal阻挡层金属barriervoltage势垒电压base基极，基区batch批bayandchaselayout生产区和技术夹层区beamblow-up离子束膨胀beamcurrent束流beamdeceleration束流减速beamenergy离子束能量beol（生产线）后端工序bestfocus最佳聚焦BGA球栅阵列Biasing电压拉偏BICMOS双极CMOS半导体术语表第5页共68页bincodenumber分类代码号binmap分类图bipolarjunctiontransistor(BJT)双极晶体管bipolartechnology双极技术（工艺）bird’sbeakeffect鸟嘴效应blanketdeposition均厚淀积blower增压泵boat舟BOE氧化层刻蚀缓冲剂Bonvoyage[法]再见,一路顺风[平安]bondingpads压点bondingwire焊线，引线boron(B)硼borontrichloride(BCL3)三氯化硼borontrifluoride(BF3)三氟化硼borophosphosilicateglass(BPSG)硼磷硅玻璃borosilicateglass(BSG)硼硅玻璃bottomantireflectivecoating(BARC)下减反射涂层boule单晶锭bracketn.墙上凸出的托架,括弧,支架v.括在一起半导体术语表第6页共68页breakthroughstep突破步骤，起始的干法刻蚀步骤brightfielddetection亮场检查brushscrubbing涮洗bubbler带鼓泡槽bufferedoxideetch(BOE)氧化层腐蚀缓冲液bulkchemicaldistribution批量化学材料配送bulkgases大批气体bulkheadequipmentlayout穿壁式设备布局bumpedchip凸点式芯片buriedlayer埋层burn-box燃烧室（或盒）burn-in老化CCA化学放大（胶）cantilevern.[建]悬臂cantileverpaddle悬臂桨capoxide掩蔽氧化层capacitance电容capacitance-voltagetest(C-Vtest)电容-电压测试capacitivecoupledplasma电容偶合等离子体capacitor电容器半导体术语表第7页共68页carbontetrafluoride(CF4)四氟化碳caro’sacid3号液carrier载流子carrier-depletionregion载流子耗尽层carriergas携带气体cassette（承）片架cation阳离子caustic腐蚀性的cavitation超声波能CD关键尺寸CD-SEM线宽扫描电镜Celsiusadj.摄氏的centeroffocus(COF)焦点焦平面centerslow中心慢速centralprocessingunit(CPU)中央处理器ceramicsubstrate陶瓷封装CERDIP陶瓷双列直插封装Channel沟道channellength沟道长度channeling沟道效应chargecarrier载流子半导体术语表第8页共68页chase技术夹层chelatingagent螯合剂chemicalamplification(CA)化学放大胶chemicaletchmechanism化学刻蚀机理chemicalmechanicalplanarization(CMP)化学机械平坦化chemicalsolution化学溶液chemicalvapordeposition(CVD)化学气相淀积chip芯片chiponboard(COB)板上芯片chipscalepackage(CSP)芯片尺寸封装circuitgeometries电路几何尺寸classnumber净化级别cleanroom净化间cleanroomprotocol净化间操作规程Clearfieldmask亮场掩膜板Clustertool多腔集成设备CMOS互补金属氧化物半导体CMP化学机械平坦化Coater/developertrack涂胶/显影轨道Cobaltsilicide钴硅化合物半导体术语表第9页共68页coefficientn.[数]系数Coefficientofthermalexpansion(CTE)热涨系数Coherenceprobemicroscope相干探测显微镜Coherentlight相干光coilv.盘绕,卷Coldwall冷壁Collector集电极Collimatedlight平行光Collimatedsputtering准直溅射Compensatev.偿还,补偿,付报酬Compoundsemiconductor化合物半导体Concentration浓度Condensation浓缩Conductor导体constantlyadv.不变地,经常地,坚持不懈地Confocalmicroscope共聚焦显微镜Conformalstepcoverage共型台阶覆盖Contact接触（孔）Contactalignment接触式对准（光刻）Contactanglemeter接触角度仪Contamination沾污、污染半导体术语表第10页共68页contiboat连柱舟conticaster[冶]连铸机Continuousspraydevelop连续喷雾显影Contourmaps包络图、等位图、等值图Contrast对比度、反差contributionn.捐献,贡献,投稿Conventional-linephotoresist常规I线光刻胶Cook’stheory库克理论CopperCVD铜CVDCopperinterconnect铜互连Costofownership(COO)业主总成本Covalentbond共价键Criticaldimension关键尺寸Cryogenicaerosolcleaning冷凝浮质清洗Cryogenicpump(cryopump)冷凝泵Crystal晶体Crystalactivation晶体激活Crystaldefect晶体缺陷Crystalgrowth晶体生长Crystallattice晶格Crystalorientation晶向半导体术语表第11页共68页CTE热涨系数Current-drivencurrentamplifier电流驱动电流放大器CVD化学气相淀积Cycletime周期CZcrystalpullerCZ拉单晶设备Czochralski(CZ)method切克劳斯基法Ddamascene大马士革工艺darkfileddetection暗场检测darkfiledmask暗场掩膜版DCbias直流偏压decomposev.分解,(使)腐烂deepUV(DUV)深紫外光defaultn.默认(值),缺省(值),食言,不履行责任,[律]缺席v.疏怠职责,缺席,拖欠,默认defectsdensity缺陷密度defect缺陷deglaze漂氧化层degreeofplanarity(DP)平整度dehydrationbake去湿烘培，脱水烘培半导体术语表第12页共68页density密度deplentionmode耗尽型degreeoffocus焦深depositn.堆积物,沉淀物,存款,押金,保证金,存放物vt.存放,堆积vi.沉淀deposition淀积depositedoxidelayer淀积氧化层depthoffocus焦深descum扫底膜designfortest(DFT)可测试设计desorption解吸附作用developinspect显影检查development显影developer显影液deviationn.背离deviceisolation器件隔离devicetechnology器件工艺DIwater去离子水Diametern.直径diametergrinding磨边diborane（B2H6）乙硼烷半导体术语表第13页共68页dichlorosilane(H2SiCL2)二氯甲硅烷die芯片diearray芯片阵列dieattach粘片die-by-diealignment逐个芯片对准dielectric介质dielectricconstant介电常数diematrix芯片阵列dieseparation分片diffraction衍射diffraction-limitedoptics限制衍射镜片diffusion扩散diffusioncontrolled受控扩散digital/analog数字/模拟digitalcircuitdiluentdirectchipattach(DCA)directionalitydiscretedishingdislocationdissolutionrate半导体术语表第14页共68页dissolutionratemonitor(DRM)溶解