OSA产品及零件简介

OSA產品及零件簡介MaximMaRDGroupComponent/FiberxonContent(1)OSA簡介(2)相關元器件介紹(3)OSA製程注意事項(4)OSA的分类(1)OSA簡介OSA的位置Transceiver的組成1.OSA2.IC3.PCB4.殼件Transceiver的成本OSA佔TRx的成本普遍70%縮略語TOSA:TransmittingOpticalSub-Assembly,光发射组件ROSA:ReceivingOpticalSub-Assembly,光接收组件BOSA:Bi-DirectionalOpticalSub-Assembly,光发射接收组件LD:LaserDiode,激光二极管PD:Photo-Diode,光电二极管FP:Fabry-Perot,法布里-珀罗激光二极管DFB:DistributedFeedbackLaser,分布反馈式激光二极管VCSEL:VerticalCavitySurfaceEmittingLaser,垂直腔面发射激光器PIN:PositiveIntrinsicNegative,同质PN结光电二极管APD:AvalanchePhoto-Diode,雪崩光电二极管TIA:TransimpedanceAmplifier,跨阻放大器TO-can:AkindofpackagemethodforactivecomponentOLT:OpticalLineTermination光线路终端ONU:OpticalNetworkUnit光网络单元SDH:SynchronousDigitalHierarchy,同步数字体系SONET:SynchronousOpticalNetwork,光同步网络GBE:GigabitEthernet,千兆以太网ITU&IEEEIEEE(InstituteofElectricalandElectronic,電氣及電子工程師學會)IEEE802(IEEE802seriesofstandardsforLocalAreaNetworks,電氣及電子工程師學會802系列標準)GE-PON–GigabitEthernet,1.25GbpsITU(InternationalTelecommunicationsUnion,國際電信聯盟)ITU-T(ITUTelecommunicationsStandardSector,國際電信聯盟電信標準化部門)A-PON–ATM,155MbpsB-PON–Broadband,622MbpsG-PON–Gigabit,1.25GbpsSONET/SDHTransmissionRatePONConceptPON（PassiveOpticalNetwork无源光网络）技术是一种点对多点的光纤传输和接入技术;下行采用广播方式、上行采用时分多址方式，可以灵活地组成树型、星型、总线型等拓扑结构;在光分支点不需要节点设备，只需要安装一个简单的无源光分路器，光信号在传输过程中不再经过放大和再生，网络的分路由光分路器来实现。1550DFBVoice+Data(continuous)ONUUpstream(burst)Video(analog)Dual-bandFWDMTri-bandFWDM1x8Splitter1x4SplitterTri-bandFWDMUpstream(burst)Video(analog)Voice+Data(continuous)1490DFB1310FPPON系統示意圖OLT1550DFBVoice+Data(continuous)ONUUpstream(burst)Video(analog)Tri-bandFWDM1x8Splitter1x4SplitterTri-bandFWDMUpstream(burst)Video(analog)Voice+Data(continuous)1490DFB1310FP1550DFBVoice+Data(continuous)ONTUpstream(burst)Video(analog)Dual-bandFWDMTri-bandFWDM1x8Splitter1x4SplitterUpstream(burst)Video(analog)Voice+Data(continuous)1490DFB1310FPPON系統元件MELCOB-PONProductPONApplicationMediaConverter系統架構(P2P)100Mbps1550nm1310nm45filter45filterTxRxTxRxReceptacleBOSAPigtailBOSAMediaConverter系統示意圖光路示意图LDPDFilterFiberConnector1490nmPIN-TIA1310nmLaserDiode1550nmPhotodiode12356(1490nm)(1550nm)(1310nm)4BOSA基本结构LDTo-CanEngineBasePigtailHolderFilterPDTo-CanFilterHolderPigtail(2)相關元器件介紹器件分類ActiveComponentPassiveComponentMetal&PlasticHousingActiveComponent主動元件(coaxialtype)上游中游下游chipchipTO-canTOSA/ROSALDmoduleTransceiverEnduser,Sub-system,System(Butterfly,Pigtail,Receptacle)主動元件(rectangulartype)(Packaging)LDTO-canCap(Aspherical/ballLens)Header(Stem)ChipMonitorPDSubmountTOSA基本结构SiOBLenscapwith8OfacetHeaderZ-BushingReceptacleIsolatorLensWindow-capPDChipLDChipFiberStubSplitSleevePDSubmountPDChipLDChipLDSubmountHeader+SiOB+LDChip+PDChip+Cap=To-CanTo-Can+Isolator+Z-Bushing+Receptacle=TOSATo-CanTOSA/ROSA常见问题介绍(To-Can)镀金层划伤、缺损或粘有焊锡等管脚粘有焊锡或镀金层缺损镀金层氧化To-Can封盖开缝To-Can封盖焊带缺陷To-CanCap玻璃开裂BATo-Can玻璃封装碎裂或脱落To-Can玻璃封装碎裂或脱落Cap’scharacteristicTO-56FTO-56BTO-56CTO-56AOffsetdesignofTO-canCouplingCharacteristicsofOffsetPINPDPD-PD+VpdGND应用：Triplexer，PDmodulePIN-TIA（4pin）DataDataVccGNDPD1nFIN1nFFilter应用：GEONUBOSA，ROSAPIN-TIA（5pin）DataDataVccGNDPDVpd12543应用：GEPONBOSA，ROSAAPD-TIADataDataVccGNDAPDVapd12543应用：GEPONOLT，GPONONU，Triplexer，ROSAPINChipPIN:Positive-Intrinsic-NegativeRealcaseforPIN’sspecificationAPDChipAPD:AvalanchePhotoDiodeRealcaseforAPD’sspecificationRealcaseforAPDinPONapplicationIowithDistZ0.7400.7600.7800.8000.8200.8400.8600.8801.852.052.252.452.65ZDist(mm)Io(uA)IowithDistX0.5400.5900.6400.6900.7400.7900.840-0.05-0.03-0.010.010.030.05XDist(mm)Io(uA)IowithDistY0.4700.5200.5700.6200.6700.7200.7700.820-0.05-0.03-0.010.010.030.05YDist(mm)Io(uA)Result:Xdirection~50umYdirection~55umZdirection~800umPassiveComponentFiberFilterLensIsolatorReceptacleFiberConnecttypeSCconnectLCconnectFC/PCconnectMU/MUJconnectSTconnectConnecttypeFC/PCSC/PCFC/APCSC/APCFiberInspection外觀FiberInspection外觀End較輕微的情況較為嚴重的情況End光芯(core)與覆層(cladding)端面破損次嚴重的情況FilterTR0EdgefilterRTR0cut-offfilerIsolatorIsolatorInspectionMetal&PlasticHousingEngineBaseFilterHolderLDLensHolderPigtailHolder(3)OSA製程注意事項AssemblyLaserWeldingPDAlignmentTestingBOSA关键工艺简介FilterAssembly滤波片装配LDAssemblyLDTo-Can装配PDAlignPD耦合LaserWelding激光点焊AssemblyFilter有正反之分Filter有入射角的限制Lens需注意L1的距離LDTOPin根部的保護膠的保存條件及固化顏色LaserWelding焊点的外观：颜色，位置，大小焊点的剪切力PostWeldshift(20%)XYlaswerweldingZlaswerweldingDefectiveLaserweldingDefectiveLaserwelding激光焊点开裂激光焊点位置过低激光焊点位置过高激光焊点开缝激光焊点离Z-Bushing太近穿透焊点过浅穿透焊点过深焊点变色PDAlignment輸入光源是否飽和不帶電帶光插拔TOPD反偏先開再開VccTO腳位的正確TestingOutputPowerTEatlowandhightemp.Spectrum(WL,widthandSMSR)SensitivityOverLoad产品测试项目应用测试项FPPo,Slope,Im,Vf,TE,WL,WidthDFBPo,Slope,Im,Vf,TE,WL,Width,SMSRIf(mA)P(mW)Ith逻辑1逻辑0输入电脉冲IbImIo=Ib+ImPo=η(Ib+Im-Ith)/2Po数字调制If(mA)P(mW)Ith输入电信号Io=Ib+ImPo=η(Ib-Ith)Po模拟调制IbIm输出光脉冲输出光脉冲产品测试项目应用测试项其它可选PINRes，IdCNR，Two-TonePIN-TIASenOLPIN-TIA(5pin)SenOL,Res,IdAPD-TIAVbr，Id，Iop，Io，Gain，SenOL(4)OSA产品分类TOSAROSABOSATOSA分类TOSA分类应用工作速率工作波长芯片类型光接口形式OptionSDH/SONET155M850nmVCSELLC/SCFiberStubIsolator622M1.244G1310nmFP/DFB2.488G1550nmGBE1.0625G850nmVCSEL1310nmFP/DFB1550nmFC1.0625/2.125G850nmVCSEL1310nmFP/DFB1550nmCWDM155M~2.67G1270~1610nmDFBROSA产品分类ROSA分类应用工作速率工作波长芯片类