华正电子产品资料

1覆铜板材料专业制造商TheprofessionalmanufacturerforCCL产品资料ProductData地址：浙江省杭州市余杭镇金星工业园区Address:JinxingIndustryZoneYuhangHangzhouZhejiangTEL:86-0571-88650112:86-0571-88650120PC:3111212目录/Catalog板材CCL产品类别Classification板材型号CCLDsg.特性简述FeatureTg(DSC,℃)页码Page常规FR-4ConventionalFR-4H140-1/FR4-74UV板UVBlocking135orelseTg3H150高耐热性中Tg板Excellentthermalresistance&Mid-Tg1505无铅制程专用板Lead-freeCompatibleH170LF高耐热性高Tg板Excellentthermalresistance&Hi-Tg1707无卤板Halogen-freeCompatibleH1308无卤板Halogen-free140orelseTg9高CTIHighCTIH1600CTI60013511CEM-3H2130普通型UV板Conventional,UVBlocking13013铝基板Al-SubstrateCCLHA40系列散热性极佳，性价比高Excellentthermalconductivity,highcostperformance_15附1.半固化片规格PrepregSpec.Page17附2.覆铜板厚度公差表/CCLthicknessandtolerancelistPage183H140-1/FR4-74特性/FeaturesTg135±5℃（DSC）可依需求提供多种Tg值/DifferentTgavailableuponrequestTg：140±5℃、Tg150±5℃、Tg170±5℃UVBlocking与AOI兼容可提高PCB生产效率UVBlockingandAOIcompatible,soastoincreaseproductivityefficiency可依需求提供仪表专用的FR-4板材/themeterappropriativeFR-4CCLuponrequest可依需求提供具UV阻挡功能的自然色板材/UVBlockingandnaturalcolorCCLuponrequest可依需求提供不具UV阻挡功能的自然色板材（白料）/NoUVBlockingandnaturalcolorCCLuponrequest应用领域/Applications电脑、通讯设备、仪器仪表、摄像机、电视机、电子游戏机等.Computer,Communicationequipment,Instrumentation,VCR,Television,Electronicgamemachine,etc.主要特性/Generalproperties检测项目Item单位Unit检测条件TestCondition规范值Spec典型值TypicalValue玻璃化转变温度Tg℃DSC135±5135.5剥离强度1ozPeelStrengthN/mm288,10S℃≥1.401.81热应力ThermalstressS288,solderdip℃＞1060sNodelamination经向LW≥415580弯曲强度FlexuralStrengthN/mm2纬向CW≥345485燃烧性Flammability－E24/125UL94V-0V-0表面电阻SurfaceResistivityMΩAftermoisture≥1.0×1045.16×107体积电阻VolumeResistivityMΩ·cmAftermoisture≥1.0×1065.07×108介电常数DielectricConstant－1MHZC24/23/50≤5.44.6介质损耗角正切LossTangent－1MHZC24/23/50≤0.0350.015耐电弧ArcResistanceSD48/50＋D0.5/23≥60125击穿电压DielectricBreakdownKVD48/50＋D0.5/23≥4058吸水率MoistureAbsorption%D24/23≤0.80.15热分解温度Td℃WeightLoss5%－306Alpha1ppm/℃－65Alpha2ppm/℃－305CTEZ-axis50-260℃%TMA－4.5T288minTMA－2相比漏电起痕指数CTIVIEC-60112175～250175SpecimenThickness:1.6mm;Explanation:C:Humidityconditioning;D:Immersionconditioningindistilledwater;E:Temperatureconditioning;H140-1/FR4-74◆介电常数/Dielectricconstant3456151050100Frequency(MHz)Dk◆热处理后板材经纬向尺寸变化Dimensionalchangeincrossandlengthdirectionafterheattreatment-0.02-0.0100.01处理前/untreated105℃4h150℃2h处理条件尺寸变化率Dimensionalchange%经向Lengthwise纬向Crosswise产品系列/Purchasinginformation厚度Thickness铜箔Copperfoil标准尺寸Standardsize0.15~3.2mm18um~105um37×49、41×49、43×49Othersheetsizeandthicknesscouldbeavailableuponrequest※45H150Lead-free特性/FeaturesTg150±5℃（DSC）UVBlocking与AOI兼容可提高PCB生产效率UVBlockingandAOIcompatible,soastoincreaseproductivityefficiency优异的耐热性，Td≥325℃，T288≥5min，适合于无铅焊工艺；Highthermalperformance，Td≥325,T288℃≥5min，suitableforlead-freeprocess。从环境温度到260℃，板材具备较低的膨胀系数；/LowerCTEfromambientto260℃。应用领域/Applications适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。Suitableformediummultilayerprintedcircuitboard,computer,communicationequipment,OAequipment,lead-freePCBprocessetc.主要特性/Generalproperties检测项目Item单位Unit检测条件TestCondition规范值Spec典型值TypicalValue玻璃化转变温度Tg℃DSC150±5150.5剥离强度1ozPeelStrengthN/mm288,10S℃≥1.051.41热应力ThermalstressS288,solderdip℃＞10100sNodelamination经向LW≥415570弯曲强度FlexuralStrengthN/mm2纬向CW≥345465燃烧性Flammability－E24/125UL94V-0V-0表面电阻SurfaceResistivityMΩAftermoisture≥1.0×1046.12×107体积电阻VolumeResistivityMΩ·cmAftermoisture≥1.0×1046.25×108介电常数DielectricConstant－1MHZC24/23/50≤5.44.5介质损耗角正切LossTangent－1MHZC24/23/50≤0.0350.016耐电弧ArcResistanceSD48/50＋D0.5/23≥60125击穿电压DielectricBreakdownKVD48/50＋D0.5/23≥4057吸水率MoistureAbsorption%D24/23≤0.50.16热分解温度Td℃WeightLoss5%≥325338Alpha1ppm/℃≤6052Alpha2ppm/℃≤300285CTEZ-axis50-260℃%TMA≤4.03.8T288minTMA≥512相比漏电起痕指数CTIVIEC-60112175～250175SpecimenThickness:1.6mm;Explanation:C:Humidityconditioning;D:Immersionconditioningindistilledwater;E:Temperatureconditioning;6H150Lead-free◆热压力容器蒸煮测试/PCT（Highpressurecookertest）SolderDipping(288,10S)℃PCT(E-120/105KPa)℃NormalFR-4H15030minOKOK60minOKOK120minNGOK◆使用建议/Suggestionforuse1、使用前请进行烘板处理：150℃、2h。PleasebakingtheLaminateat150℃、2hoursbeforeusing.2、由于层间结合力较常规FR－4差，钻孔加工时请注意。钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：钻刀转速：45~105KRPM，进刀速度：50~150IPM缩刀速度：500~1000IPM，最多使用次数：3000HITS(若有填料，最多1000HITS)叠层高度：≤2pnls(2~6layers),1pnl(≥8layers)覆层材料：0.2mmAluminumPleasepayattentiontotheDrillingfortheinterbeddedenergyislowerthanthenormalFR-4.Drillingparametersaremainlydependentonholesize,layerthickness,layernumber,copperthicknessandstackheight.Thefollowingdrillingparametersareforreferenceonly.Typicaldrillingparametersfor0.4~1.0mmdrillsareasfollows:Spindlespeed:45~105KRPMFeedrate:50~150IPMRetractrate:500~1000IPMMax.hitcount:3000HITS(ifhavefillers,max1000HITS)Stackheight:≤2pnls(2~6layers),1pnl(≥8layers)EntryMaterial:0.2mmAluminum产品系列/Purchasinginformation厚度Thickness铜箔Copperfoil标准尺寸Standardsize0.15~3.2mm18um~105um37×49、41×49、43×49Othersheetsizeandthicknesscouldbe※availableuponrequest7H170LFLead-free特性/FeaturesTg170±5℃（DSC）UVBlocking与AOI兼容可提高PCB生产效率UVBlockingandAOIcompatible,soastoincreaseproductivityefficiency优异的耐热性，Td≥340℃，T288≥15min，适合于无铅焊工艺；Highther