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(WI)UCOP-02-WI-0536PCBprocesscapabilityintroduction36G/01234151617NPI189110____________________________________________________________________________(WI)UCOP-02-WI-0536PCBprocesscapabilityintroduction1.0Introduction:NPINPIThisisamanufacturingmanualforPCB.Theproductionprocessistobebasedonthisguidanceexceptforpeculiarcircumstances.Theaimistoimproveproductqualityandreducenonconformity.Ifthereisanykindofchangesinproductionplanningwhichdeviatesthestandard,NPIwillbeinformedinadvance.NPIisresponsibletodorootcauseanalysis,research&developmenttoworkoutthecorrectiveactionofmeetingtherequirementonengineeringandproduction.2.0Cutting2.1Maxpanelcuttingsize(a)510×610(mm);±1.5mmSingle-sideboard:510×610(mm),tolerance±1.5mm(itislimitedbytheworktablesizeoftheprintingmachine)(b)558×622.5(mm);±1mmDouble-sideboard:558×622.5(mm),tolerance±1mm(itislimitedbytheworktablesizeofthedrillingmachine)558×610mm;±1mmInnerlayerofMultilayerboard:558×610mm,tolerance±1mm2.2Theedgewidth(a)5mm3mm8mm3mmSingle-sideboard:fornon-platingboards,thebroaderedgeshallbenolessthan5mm,andthenarroweredgeshallbenolessthan3mmreillustrationbelow:Forplatingboards,thebroaderedgeshallbenolessthan8mm,andthenarroweredgeshallbenolessthan3mm.n(narro(WI)UCOP-02-WI-0536PCBprocesscapabilityintroduction(b)8mm10mm3mm5mmDouble-sideboard:thebroaderedgeshallbenolessthan8mm(Optimalfigureis10mm),andthenarroweredgeshallbenolessthan3mm(Optimalfigureis5mm).(c)12mm8mmInnerlayerofMultilayer(4layersandabove)board:thetargetholedirectionspacing12mm,theothertwosidesspacing8mm.Pleaserefertothefollowingillustration:(d)100150mmAluminumplugholecuttingsize:Needstobeoneside100~150mmwiderthanthepanelsize2.30.15mmMinthickness0.15mm(exclusiveofcopper)2.3.1CuttingofinnerlayerformultilayerboardCuttinginhorizontalorverticaldirectionA6layersandaboveB0.4mmcorethicknessofinnerlayer0.4mmC0.25mmThedistancebetweentheartworkholewalltotheconductorofinnerlayer0.25mmD500mmThecuttingsizeofboardlengthorwidthismorethan500mm2.3.2MIThematerialthatisusedontheinnerlayerformultilayerboardmustbespecifiedwiththelaminatesupplieronMI(exampleShengyilaminateetc.)12mm8mm(WI)UCOP-02-WI-0536PCBprocesscapabilityintroduction2.4CuringaftercuttingMaterialcodeProcessbaking(yes/no)Bakingcondition/ViapluggedholeofCarbon/SilverandHASLboardYes140±5×2HXPCnormalprocessNoCEM-1allprocessYes140±5×2HCEM-3allprocessYes140±5×2H/ViapluggedholeofCarbon/SilverandHASLboardYes140±5×2HFR-1normalprocessNo/ViapluggedholeofCarbon/SilverandHASLboardYes140±5×2HFR-2normalprocessNo0.8mmBoardthickness0.8mmNoFR-40.8mmBoardthickness0.8mmYes150±5×2HRO-4233ceramicallprocessYes150±5×2H150±5×4HAlltheinnerlayersofmultilayerboardmustbebakedat150±5×4Hafterthecutting,edgetrimmingpriortothedrillingprocess.3.0drilling:3.1drillbitsize:(a):0.25-6.40mm(0.05mm)3.175mmNormaldrillbit:0.25-6.40mm(0.05mmincrement)and3.175mm(b):0.60-1.55mm0.05mmUCdrillbit:0.60-1.55mm(0.05mmincrement)3.2:holediameterdifferencebeforeandafterdrilling(a):3.175mm+0/-0.025mm3.175mm±0.025mm(WI)UCOP-02-WI-0536PCBprocesscapabilityintroductionFornewdrillbit:+0/-0.025mmdifferenceforthedrillbitdiameterof3.175mmand±0.025mmdifferenceforthesizeof3.175mm(b):+0/-0.05mmRe-sharpeneddrillbit:+0/-0.05mm3.3maxboardsizeforthedrillingholeandtolerance:holepositiondeviationmmMachinecodeMaxboardsizefirstdrillseconddrillTianma356×457mm±0.08±0.1CEN2001470×622mm±0.08±0.1Giga8888559×635mm±0.08±0.13.4/:min/maxholediameter(a)?0.25mmDiameterofMinhole:?0.25mm(b)?6.4mm6.40mmDiameterofMaxhole:?6.4mm(spiraldrillingtechnologyshouldbeconsideredfortheholediameterof6.40mmorabove)3.5:HolediametertolerancecapabilityholePTHNPTHtolerance±0.08mm±0.05mm:A)PTHComment:A)Tochoosethedrillbitsize,differentfactorsmustbeputintoconsideration,theyaresuchas,holewallcopperthickness,tinthicknessortheoverallpatterndesignetc.1.Sn1oz2oz0.2mm0.2mmSn0.15mmThemaxcompensationvalueofholediameterforHASLboardshallnotbesetformorethan0.2mminwhichisplatedfrom1oztoto2ozcopperbasecopper.FortheotherHASLboardsthemaxcompensationvalueshallnotbesetformorethan0.15mm.2.0.15mmIngeneral,thecompensationvalue(enlarged)forthefinishedholesizeis0.15mmfortheENIG/OSPboards.(WI)UCOP-02-WI-0536PCBprocesscapabilityintroduction3.Cu/Ni/AuForthedrillholeofCu/Ni/Auboardsa.15um25um0.10mmIngeneral,thecompensationvalueof+0.10mmispremeditatedfortherequirementof?15um25umholewallcopperthicknessb.25um0.15mmCompensationvalueof+0.15mmispremeditatedfortherequirementof25umholewallcopperthickness4.PTHForthoseboardswhichpatterndesignanddistributionisseriouslyasymmetricandtheholediametertoleranceisstrict,thecompensationvalueneedstobeadjustedtoabiggerscale.5.Layupdirectionmustbefollowedas:A.HighdensitytraceareatowardsthecenterB.BGABGAareatowardstheinsideandcenterC.BigcopperareatowardstheedgeD.LayupindifferentwayssuchasfrontsideorbacksideB)NPTH0.05mmTochoosethedrillbitforNPTHhole:takethemedianvalue,itneedstobe0.05mmbiggerthanthelowerlimit.C)?3.175mmPPEGuideholedrillbit:thedrillbitdiameteris?3.175mmForsomespecialboards,thelayupdesignandthecompensationvaluemustbedeterminedbyPPEbasesontherealconditions