搜索
大庆师范学院本科生毕业论文单片机温度控制系统上下限报警器院（系）物理和电气信息工程学院专业电子信息工程（自动化方向）研究方向智能控制学生姓名王伟学号201001071607指导教师姓名李瑞英指导教师职称讲师2014年5月20日摘要随着现代工业科术的发展及人们对生活环境要求的提高，检测和控制温度显得尤为的重要。此温度上下限报警器的设计和制作，讲述了该装置设计和制作的具体过程及方法。该温度报警器结构简单，可操作性强，具有广泛的使用性，可防止因温度升高而带来的不必要的损失。因在机房内所用的电子产品发热量大，在少量时间内机房温度升高超出设备的正常温度，导致系统停机或产生火灾，这时温度报警系统就会发挥其应有的功能。本文讲述的是采用温度传感器DS18B20的温度上下限报警器，自动能够测量目前环境温度，由单片机AT89C2051控制，并通过三位段数码管显示提示，如果当前环境温度超过此温度，系统发出报警。采用的AT89S52单片机做信号处理单元，其成本低廉，精确度较高，LCD1602显示测量数值，选用红外传感器采集人体信号，经过放大整形电路而后传送给单片机AT89S52来处理，最后该信号传送至LCD1602显屏。已达到测量温度，防止，切断火灾的目的，实用性强。关键词：温度控制系统；AT89S52单片机；传感器AbstractWiththedevelopmentofmodernGongYeKetechniqueandtheimprovementofpeople'slifeenvironment,detectionandcontroloftemperatureisparticularlyimportant.Thedesignandmanufactureoftheupperandlowertemperaturealarm,devicetoillustratethedetailedprocessandmethodofdesignandmanufacture.Thetemperaturealarmhassimplestructure,strongoperability,wideapplicability,canpreventtheunnecessarylossduetotemperatureand.Ofelectronicproductsinthetelecomroomheatfast,roomtemperatureinashorttimebeyondthenormaltemperature,causingthesystemtocrashortoproducefire,whenthetemperaturealarmsystemwillplaytheirfunctions.IsintroducedinthispaperusingtemperaturesensorDS18B20temperaturealarm,automaticmeasuringthecurrentenvironmenttemperature,controlledbysinglechipmicrocomputerAT89C2051,andthroughthethreesegmentdigitaltubedisplay,ifthecurrentenvironmenttemperatureexceedsthetemperature,thealarmsystem.USEStheAT89S52singlechipmicrocomputerforthesignalprocessingunit,itslowcost,highaccuracy,LCD1602displaymeasuredvalues,useinfraredsensortocollectthebodysignals,afteramplificationshapingcircuitandthensenttoMCUAT89S52,finallythesignalstotheLCD1602displayscreen.Hasreachedtomeasuretemperature,toprevent,tocutoffthefire,thepurposeofstrongpracticability.Keywords:Temperaturecontrolsystem;AT89S52MCU;Sensor目录第一章引言.....................................................................................................................01.1选题的背景和意义........................................................................................................01.2温度控制器的研究现状及发展.....................................................................................0第二章硬件电路设计.........................................................................................................12.1AT89S52简介.................................................................................................................12.2AT89S52的引脚说明.....................................................................................................12.4复位电路........................................................................................................................22.5振荡电路........................................................................................................................3第三章基本结构模块.........................................................................................................43.1温度传感器的选择........................................................................................................43.1.1温度传感器DS18B20的特点及选择原因................................................................43.1.2DS18B20的测温原理.................................................................................................53.2温度采集电路................................................................................................................6图3-2温度采集电路...........................................................................................................63.3按键电路和指示灯电路。.............................................................................................63.4LCD1602模块................................................................................................................73.5报警电路........................................................................................................................7第四章主程序.....................................................................................................................94.1主程序图........................................................................................................................94.2读出温度子程序..........................................................................................................104.3温度数据显示子程序..................................................................................................114.4设置温度上下限程序..................................................................................................12第五章系统测试...............................................................................................................125.1焊接阶段......................................................................................................................12第六章总结和展望...........................................................................................................15[参考文献]..............................................................................................................................16谢辞...........................................................................................