DP1608-A2455DG-S-R00-N625-2

DP1608-A2455DGT/LFREV:2PAGE:1/7ACXAdvancedCeramicXFeaturesMonolithicstructureincludingonelow-passandoneband-passfilterswithlosspoleatadjacentpassband.RoHSCompliantApplicationsDual-band/dual-mode2.4GHz/5GHzWLANSpecificationsPartNumberPassband(MHz)InsertionLoss(dB)PassbandVSWRAttenuation(dB)2400~25000.75max.2.0max.25min.@4800~5000MHz20min.@7200~7500MHzDP1608-A2455DG_4900~59501.10max.2.0max.20min.@1800~2500MHz15min.@9800~11900MHzQ’ty/Reel(pcs):4000OperatingTemperatureRange:-40~+85oCStorageTemperatureRange:+5~+35oC,Humidity45~75%RHStoragePeriod:12monthsmax.PowerCapacity:2Wmax.PartNumberTypeDP:DiplexerDimensions(L×W)1.6×0.8mmMaterialCodeAFrequencyRange2455=2400MHz/5500MHzSpecificationCodeDGPackagingT:Tape&ReelB:BulkSoldering/LF=lead-freeDP1608SeriesMultilayerChipDiplexersDP1608-A2455DG/LF:2PAGE:2/7ACXAdvancedCeramicXTerminalConfigurationNo.TerminalNameNo.TerminalNameLowerFreq.Port(P1)GNDGNDCommonPort(P2)HigherFreq.Port(P3)GNDDimensionsandRecommendedPCBoardPatternMarkLWTabcgpDimensions1.6±0.10.8±0.10.6±0.10.2±0.10.2+0.1/-0.150.15±0.10.3±0.10.5±0.05*Linewidthshouldbedesignedtomatch50ohmcharacteristicimpedance,dependingonPCBmaterialandthickness.apgbTLWcUnit:mmLandSolderResistThrough-hole(0.35)***0.250.250.250.55:2PAGE:3/7ACXAdvancedCeramicX24681012014-50-40-30-20-10-600freq,GHzdB(S(2,1))dB(S(2,3))24681012014-30-20-10-400freq,GHzdB(S(1,1))dB(S(2,2))dB(S(3,3))MeasuringDiagramTypicalElectricalCharacteristics(T=25oC)AttenuationReturnLossNotesThecontentsofthisdatasheetaresubjecttochangewithoutnotice.Pleaseconfirmthespecificationsanddeliveryconditionswhenplacingyourorder.NetworkanalyzerPort2(50)GNDGNDGND(50)(50)Port3Port1:2PAGE:4/7ACXAdvancedCeramicXTapingSpecificationsTapeDimensions(Unit:mm)&QuantityReelDimensions(Unit:mm)LeaderandTrailerTapeTypeAA’BCDEFTQuantity/reelTapematerial16084.0±0.14.0±0.11.10±0.11.92±0.12.0±0.13.5±0.18.0±0.10.75±0.054,000pcsPaperTypeAB16082.3±0.59.0±0.360±1178±113.5±0.5ALabelLabel:Customer’sName,ACXP/N,Q’ty,Date,ACXCorp.1.4±0.2BTrailerEndEmptyCompartmentswithCoverTapeA’DFE1.75±0.1ABTPAPERTAPECTrailer(160mmmin.):2PAGE:5/7ACXAdvancedCeramicXPeel-offForcePeel-offforceshouldbeintherangeof0.1–0.6Natapeel-offspeedof300±10mm/min.StorageConditions(1)Temperature:15~35℃,relativehumidity(RH):45~75%.(2)Non-corrosiveenvironment.NotesThecontentsofthisdatasheetaresubjecttochangewithoutnotice.Pleaseconfirmthespecificationsanddeliveryconditionswhenplacingyourorder.PeelingDirectionTopCoverTapeCarrierTape100:2PAGE:6/7ACXAdvancedCeramicXMechanical&EnvironmentalCharacteristicsItemRequirementsProcedureSolderability1.Noapparentdamage2.Morethan95%oftheterminalelectrodeshallbecoveredwithnewsolder1.Preheat:1205oC2.Solder:2455oCfor51secSolderingstrength(TerminationAdhesion)1.1kgminimum1.Solderspecimenontotestjig.2.Applypushforceat0.5mm/suntilelectrodepadsarepeeledofforceramicarebroken.PushingforceisappliedtolongitudedirectionDeflection(SubstrateBending)1.Noapparentdamage1.Solderspecimenontotestjig(FR4,0.8mm)usingtherecommendsolderingprofile.2.Applyabendingforceof2mmdeflection.`Heat/HumidityResistance1.Noapparentdamage2.Fulfilltheelectricalspecificationaftertest1.Temperature:852oC2.Humidity:90%~95%RH3.Duration:1000±48hrs4.Recovery:1-2hrsThermalshock(TemperatureCycle)1.Noapparentdamage2.Fulfilltheelectricalspecificationaftertest1.Onecycle/step1：125±5Cfor30minstep2：-40±5Cfor30min2.Noofcycles：1003.Recovery:1-2hrsLowTemperatureResistance1.Noapparentdamage2.Fulfilltheelectricalspecificationaftertest1.Temperature:-40o5oC2.Duration:500±24hrs3.Recovery:1-2hrs90mmPressureRodR230:2PAGE:7/7ACXAdvancedCeramicXSolderingConditionsTypicalSolderingProfileforLead-freeProcessReflowSoldering:NotesThecontentsofthisdatasheetaresubjecttochangewithoutnotice.Pleaseconfirmthespecificationsanddeliveryconditionswhenplacingyourorder.Temperature(oC)Pre-heating60-180sTime(s.)20smax.260oC150-200oC217oC60-150s.AdvancedCeramicXCorp.16TzuChiangRoad,HsinchuIndustrialDistrictHsinchuHsien303,TaiwanTEL:886-3-5987008FAX:[phone]E-mail:[e-mail]