ASM 自动焊线机器介绍Au wire bonding process

20-Sep-20ASMPacificTechnologyLtd.©2009page1Section9.3BasicAuWireBondProcess20-Sep-20ASMPacificTechnologyLtd.©2009page2ContentsBasicIntroductionGoldWireBonderBondingSequenceMaterial&ToolsBondQuality20-Sep-20ASMPacificTechnologyLtd.©2009page3BasicIntroductionUnderstandanICPackageICManufacturingFlowWireBondingIntroduction20-Sep-20ASMPacificTechnologyLtd.©2009page4Cross-sectionofanICPackageDieGoldWireLeadFrame20-Sep-20ASMPacificTechnologyLtd.©2009page5WaferGrindingDieBondingWaferSawToasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPackingICManufacturingFlowDejunkTrimSolderPlatingSolderPlatingForming/SingulationTrim/FormingBGASURFACEMOUNTPKGTHROUGHHOLEPKG20-Sep-20ASMPacificTechnologyLtd.©2009page6GoldWireBondingDiePadLeadGoldwireBallBond(1stBond)WedgeBond(2ndBond)20-Sep-20ASMPacificTechnologyLtd.©2009page7WedgeBonding20-Sep-20ASMPacificTechnologyLtd.©2009page8WhattechniqueisusedinGoldWireBonding?20-Sep-20ASMPacificTechnologyLtd.©2009page9WireBondingTechniquesTherearethreebasicwirebondingtechniques:Thermosonicbonding:utilizestemperature,ultrasonicandlowimpactforce,andball/wedgemethods.Ultrasonicbonding:utilizesultrasonicandlowimpactforce,andthewedgemethodonly.Thermocompressionbonding:utilizestemperatureandhighimpactforce,andthewedgemethodonly.20-Sep-20ASMPacificTechnologyLtd.©2009page10ThermocompressionvsThermosonicThermocompressionweldingusuallyrequiresinterfacialtemperatureoftheorderof300°C.Thistemperaturecandamagesomedieattachplastics,packagingmaterials,andlaminates,aswellassomesensitivechips.Thermosonicwelding,theinterfacetemperaturecanbemuchlower,typicallybetween100to150°C,whichavoidssuchproblems.Theultrasonicenergyhelpsdispersecontaminatesduringtheearlypartofthebondingcycleandhelpscompletetheweldincombinationwiththethermalenergy.20-Sep-20ASMPacificTechnologyLtd.©2009page11AdvantagesofThermosonicMetallurgicaljoiningismorereliablethanconductiveparticlesandadhesivejoining.Processcycletimecanbereducedfromseveralminutestolessthan10seconds.Lowermanufacturingcostperunit.20-Sep-20ASMPacificTechnologyLtd.©2009page12WirebondingOperatingTemperatureWireMaterialsPadMaterialsNoteThermo-compression300-500°CAuAl,AuHighpressure,noultrasonicenergyUltrasonic25°CAu,AlAl,AuLowpressureinultrasonicenergyThermosonic100-240°CAu,CuAl,AuLowpressureinultrasonicenergyComparisonofDifferentWireBondingTechniques20-Sep-20ASMPacificTechnologyLtd.©2009page13WhataretheimportantparametersinGoldWireBonding?20-Sep-20ASMPacificTechnologyLtd.©2009page14BondingParametersThermosonicBondingPressure(Force)Amplify&Frequency(Power–138KHz)WeldingTime(BondTime)WeldingTemperature(Heater)HighPower3.2WmaxLowPower1.6WmaxUltra-LowPower0.8WmaxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.5920-Sep-20ASMPacificTechnologyLtd.©2009page15SiO2SiBondingPrincipleAlPressure(Force)Vibration(Power)ContaminationMoistureAl2O3GlassHeat20-Sep-20ASMPacificTechnologyLtd.©2009page16NexttoGoldWireBonder20-Sep-20ASMPacificTechnologyLtd.©2009page17GoldWireBonderMachineRoadmapUnderstandIndividualPartMachineSpecificationBondingTemperature20-Sep-20ASMPacificTechnologyLtd.©2009page18ASMGoldWireBonderRoadmapMachineModel(ATS)AB308AB309AB309AAB339AB339EagleEagle60Eagle60APHarrierTwinEagleHummingBirdEagle50??20-Sep-20ASMPacificTechnologyLtd.©2009page19ASMGoldWireBonderMachineModel(ATS)DescriptionEagle60-00ICApplicationsEagle60-01TO-92Eagle60-02Opto(BentLeadframe)ApplicationsEagle60-03VerticalLEDorOptoApplicationsEagle60-08Power&HybridDeviceApplicationsEagle60-09Power&HybridDeviceApplications20-Sep-20ASMPacificTechnologyLtd.©2009page20Matching1)Eagle60AP2)Eagle60-033)HummningBird4)Harrier5)TwinEagleA..B..C..D..E..ACEDB20-Sep-20ASMPacificTechnologyLtd.©2009page21Eagle60APMachineIntroduction20-Sep-20ASMPacificTechnologyLtd.©2009page22Eagle60vsEagle60APEagle60Eagle60APFinepitch35μm.30μm.Speed60+ms.60ms.BondheadDigitalbondheadNewbondheadwith8~10%fasterBondPlacementAccuracy±3μm@3sigma±2.5μm@3sigmaLoopTypesStandardloopingdatabaseAdditionalEscargot,Flex,BellloopOpticsProgrammableBallFormationMonitoringStandard8xfasterCapacitancenon-stickdetectionStandard10xfaster20-Sep-20ASMPacificTechnologyLtd.©2009page23LowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith0.4micronperencoderstepFastcontactdetectionSuppressedForcevibration&FastForceresponseFastresponsevoicecoilwireclampBondHeadASSY20-Sep-20ASMPacificTechnologyLtd.©2009page24XYTableLinearMotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-3um@3sigmaResolutionof0.2umperencoderstep20-Sep-20ASMPacificTechnologyLtd.©2009page25W/HASSYIndexingresolutionof1umperencoderstepFullyprogrammableindexer&tracksMotorizedwindowclampwithsoftclosefeatureOutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice20-Sep-20ASMPacificTechnologyLtd.©2009page26BondingSystemBondingMethodThermosonic(TS)BQMModeMulti-modewithprogrammableBQMBdWireSize15.2umupto76.