微电子机械系统及硅微机械加工工艺

,(,361005):(MEMS)21MEMSMEMSMEMS,MEMS,:;;;LIGA:TP212:A:1001-3474(2003)05-0185-04MicroelectronicsMechanicalSystemAndSiliconMicromachiningTechniqueHONGYong-qiang,JIANGHong-xia(XiamenUniversity,Xiamen361005,China)Abstract:Microelectronicsmechanicalsystem(MEMS)isanewtechnologywidelyusedin21thcentury.SiliconMicromachiningtechniquehasdevelopedintothemainMEMSproducingtechnologywiththedevelop2mentofintegratecircuittechnique.ThecharacteristicandstatusofMEMSareintroduced,threemachiningmethodsaredescribedindetail,andthetechniquesareemphasisedsuchasetching,bonding,photoetching,oxi2dizing,diffusing,sputteringandsoon.Keywords:MEMS;Bulkmicromachining;Surfacemicromachining;LIGADocumentCode:AArticleID:1001-3474(2003)05-0185-04(MEMS),MEMSMEMSXMEMS,MEMS11.1,,,,,,,,:(1959-),,,,58124520039ElectronicsProcessTechnology©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.,,1.2.2,,,1.2.3MEMS,,,,1.2.4,,,MEMS1.2.5,22.12080,,MEMS,,MEMSMEMS,MEMS(0.1kg10kg),(0.1kg)MEMS,MEMSAD,1.5mm1.5mm,50g,15mV/g;Park(STM)(AFM),,IC,LIGA,2.22080MEMS,1995(19961999)1999:;;;;;,()DNAMEMS20006700km,60kg0.07m3IC,,MEMS,,,,33.1,MEMS,,,,,3.2681245©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.,,,,,MEMS,,,,,MEMS,,MEMS,;;,X,,,3.3LIGALIGA,LIGAXLIGAX,,1,,LIGA,X,,LIGALIGA,,,4MEMS,,,MEMS,MEMS,4.1,,,,,,,,,4.2,MEMS,,,,,,0.5m1m78120039:©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.,4.3,,SiO2,,SiO2,SiO2:,,,,,4.4SiO2,,SiO2,SiO2,SiO2SiO2,SiO2,,,,4.5,,,,,;,,4.6,,,,,5MEMS,,MEMS,,,MEMS,,:[1]ReichlH,GrosserV.OverviewanddevelopmenttrendsinthefieldofMEMSpackaging[C].Microelectromechanicalsys2tems2001,MEMS2001The14thIEEEInternationalConfer2ence,2001.1-5.[2].[D].,2001.10.[3].[M].:,1996.:2002-07-17:61-87,,416,:61-870.60,31.20:ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓITÓÓ,()()881245©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.