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序号术语-英文术语-中文1A/Dsignal/converter数模信号/转换器2ABCSABCS3Absorption吸收4AcceptancePattern接受图5AcceptorImpurity受主杂质6ActiveMatrixDisplay有源矩阵显示器7ActiveMatrixLiquidCrystalDisplays(AMLCDs)有源矩阵液晶显示器(AMLCD)8AEL(AccessibleEmissionLimits)AEL（可接近放射限值）9AFS(AdvancedFrontlightingSystem)AFS（高级前照明系统）10AGC(AutomaticGainControl)AGC（自动增益控制）11ALCVDALCVD12ALEALE13AlGaAsAlGaAs14AllnGaPAllnGaP15AllnGaPchip(LED)AllnGaP芯片(LED)16AlphanumericDisplay字母数字显示器17AlternatingCurrent(AC)交流电(AC)18Ammeter电流计19Amorphous非晶体20AnalogDisplay模拟显示器21AnalogMeter模拟仪22Anode阳极最全电子、半导体、led术语解释（中英文对照）23ANPR(AutomaticNumberPlateRecognition)ANPR（车牌自动识别系统）24ARC(AntiReflectionCoating)ARC（防反射涂层）25Arsenic砷26ASCII(AmericanStandardCodeforInformationInterchange)ASCII（美国信息交换标准代码）27ASIC(ApplicationSpecificIntegratedCircuit)ASIC（专用集成电路）28ASPASP29AtomicOrbital原子轨道30AV-inputAV输入3132Back-End后端33Backlighting背光照明34Band频带35Bandgap带隙36Bandpassfilter带通滤波器37Beamdivergence(FWHMparalleltopnjunction)光束发散度（与PN结平行的FWHM）38BEF(BrightnessEnhancementFilm)BEF（增亮膜）39BEOL(BackEndOfLine)BEOL（后端制程）40Bias偏压41BiasControl偏压控制42Biasing施加偏压43Bin(binning)BIN（分选）44Bipolar双极45Bipolartransistor双极晶体管46Bit位47Blackpackage黑色封装48BLUs(Backlightunits)BLU（背光模组）49BondedWafer已键合晶圆50Bonding键合51Breakdownvoltage(VBR)击穿电压(VBR)52Brightness亮度53Buck/boostregulator(converter)降压/升压调节器（转换器）54Bypasscapacitor旁路电容器5556C-mount/cs-mountC安装/cs安装57Candela坎德拉58Capacitance电容59Carrierfrequency载波频率60Carrier/ChargeCarrier载流子/电荷载流子61Cathode阴极62Cathodoluminesence(CL)阴极发光(CL)63CBECBE64CCD-sensorCCD传感器65CCFL(ColdCathodeFluorescentLamps)CCFL（冷阴极荧光灯）66CCT(CorrelatedColorTemperature)CCT（相关色温）67CCTV(ClosedCircuitTelevision)CCTV（闭路电视）68CDM(ChargedDeviceModel)CDM（带电器件模型）69Centroidwavelength质心波长70CFD(ComputionalFluidDynamics)analysisCFD（计算流体动力学）分析71ChargeCarrier电荷载流子72Chargecoupleddevices电荷耦合器件73ChemicalEtching化学腐蚀加工74ChemicalMechanicalPolishing(CMP)化学机械抛光(CMP)75ChemicalVaporDeposition(CVD)化学气相沉淀(CVD)76Chip芯片77ChipCarrier芯片载体78Chip-On-Board(COB)板上芯片(COB)79Chip-on-Flex(COF)软膜覆晶接合技术(COF)80Chip-on-Glass(COG)晶玻接装(COG)81CHMSL(CenterHighMountedStopLight/Lamp)CHMSL（中央高位刹车灯）82Circuit电路83Cladding镀层84Cleanroom无尘室85CMOS(ComplementaryMetal-OxideSemiconductor)CMOS（互补金属氧化物半导体）86CMP(Chemical-MechanicalPolish)(CMP)化学机械抛光87Coating涂层88COB(ChipOnBoard)technologyCOB（板载芯片）技术89CoD(Color-on-Demand)CoD（按需选色）90Collectorcurrent(Ic)集电极电流(Ic)91Collectoremittersaturationvoltage集电极发射极饱和电压92Collectoremittervoltage集电极发射极电压93Collectorsurgecurrent集电极浪涌电流94ColorCoordinates颜色坐标95Colorspectrum色谱96ColorSuper-TwistNematic(CSTN)Display彩色超扭曲向列(CSTN)型显示器97Comparator比较器98Complementary互补99CompoundSemiconductor化合物半导体100Conductionband传导带101Conductor导体102ConnectorInsertionLoss连接器插入损耗103Contactless(SMT)sensors非接触式(SMT)传感器104Contrast对比度105ContrastRatio对比率106Controllerx-bit控制器x位107Conversiontechnology转换技术108Core线芯109Coupling耦合110CPU(CentralProcessingUnit)CPU（中央处理器）111CRI(ColorRendering/ReproductionIndex)CRI（显色指数）112CRT(CathodeRaytube)CRT（阴极射线管）113Crystal晶体114CTE(CoefficientofThermalExpansion)CTE（热膨胀系数）115Current电流116CurrentTransferRatio(CTR)电流传输比(CTR)117CustomIntegratedCircuit定制集成电路118CW(mode/pulsed)CW（模式/脉冲）119120DALI(DigitalAddressableLightingInterface)standardprotocolDALI（数字可寻址照明接口）标准协议121Darkcurrent暗电流122DarkcurrentIR暗电流IR123DAW(DigitalAudioWorkstation)DAW（数字音频工作站）124DBEF(DualBrightnessEnhancementFilm)-DDBEF（反射式增光偏光片)-D125Decoder/Driver解码器/驱动器126Delocalized(electrons)离域（电子）127Demodulator解调器128Deposition蒸镀129Detectionlimit(D)检测限(D)130Dice晶粒131Die晶粒132DieArea晶粒面积133DieAttach固晶134DieBonding晶粒贴合135DieCost晶粒成本136DieSize晶粒尺寸137DieSort晶粒分选138DieYield晶粒成品率139Diffuser(film)散光罩（薄膜）140DigitalDisplay数字显示141DigitalI²Coutput数字I²C输出142Diode二极管143Diodelaser二极管激光器144DIP(DualIn-linePackage)DIP（双列直插式封装）145DIPpackageDIP封装146DirectBandGap直接带隙147DiscreteDevice分立器件148Displayformat显示格式149DMD(DigitalMirrorDevice)DMD（数字微镜装置）150DominantWavelength(λdom)主波长(λdom)151Dopant掺杂剂152Doping掺杂153DotMatrixDisplay点阵显示154DpiDpi155DRAMDRAM156Driftvelocity漂移速度157Drivingcircuit驱动电流158DUT(DeviceUnderTest)DUT（被测装置）159Dutycycle占空比160DynamicScatteringLCD动态散射LCD161162EarlyEffect厄利效应163EarlyVoltage厄利电压164EBDIC(ExtendedBinaryCodedDecimalsInterchangeCode)EBDIC（扩展的二进制编码的十进制交换码）165EBL(ElectronBlockLayer)EBL（电子块层）166ECRMBEECRMBE167Edge-emittingLasers边缘发射激光器168EEPROMEEPROM169EL(ElectroLuminescence)EL（电致发光）170ElasticRecoilDetectionAnalysis弹性反冲探测分析171ELDELD172ElectricGenerator发电机173ElectricalConductivity导电性174ElectricalResistance电阻175Electricity电176Electroluminescent(EL)Display电致发光(EL)显示屏177ElectromagneticRadiation(waves)电磁辐射（波）178Electron电子179ElectronEnergyLevel电子能级180Electronics电子学181ElementarySemiconductor基本半导体182EMI(ElectroMagneticInterference/Influence)EMI（电磁干扰/影响）183EmissivePolymerLayer发光聚合物层184Emitter发射器185EN(EuropéenNormalisation)-standardsEN（欧洲标准化）标准186Encapsulation(epoxy/silicon)封装（环氧树脂/硅树脂）187EOS(ElectricalOverstress)EOS（电过载）188Epitaxy外延189EPROMEPROM190ESD(ElectroStaticDischarge)ESD（静电放电）191ESDprotection(electrostaticdischarge)静电放电(ESD)防护192ETL(ElectronTransportLayer)ETL（电子传输层）193EXAFSEXAFS194Excitons激子195Externalbeamexpander外粒子束扩展器196Extri