搜索
半导体量测设备及应用介绍陈贵荣2013/09/11E_mail:chen.kueijun@msa.hinet.net芯片凸块制程检验•雷射扫瞄仍是目前凸块检测最广为使用的三维量测技术FailureAnalysis_1FailureAnalysis_2Examplesofsolderbumpdefect•Explain高阶封装技术•300mm晶圆高阶封装技术•WaferBump3DBumpInspectionusingLaserTriangulation•3Dand2Dbumpinspectionisacriticalcomponentinmanufacturingofbumpedwafers.Continuousminiaturizationanduseofthroughsiliconvia(TSV)in3Dpackagesarepushingbumpsizessmallerandsmaller.Thesmallbumpsize,smallpitchandhighnumberofbumpsarechallenginginspectiontechnologies,requiringhighaccuraciesandhighthroughput.•Lasertriangulationisthedominanttechnologyfor3Dcharacterizationofsolderandpillarbumpsusedinconventionalpackagingtechniques.Thetechnologyisalinescanlaserwiththeabilitytocollecthundredsof3Ddatapointsalongonescanlineinafractionofasecond.Thesedatapointscanthenbeusedtobuilda3Dmodelofthetopofthebumpandsurfaceofthewaferforlocalheightinspection.Asbumpsizeandpitchcontinuetodecreaseandbumpnumbersheadtowardstensofmillionsperwafer,thespeedandaccuracyoflasertriangulationtechnologygives3DICmanufacturerstheabilitytotightlycontrolbumpprocessesanddetectbumpdefects.BasicGeometryofLaserTriangulation雷射三角几何示意图此雷射三维系统之量测精度，主要受限于传感器之分辨率及投射之雷射光线宽，越细的雷射线宽及高分辨率传感器，可获得较高之量测精度。雷射三角法系统架构图•利用程控，可以调整雷射光之线宽及扫瞄速度。•此系统之组成简单稳健，适合工业环境之实际应用。StageLaserM50ObjectEncoderDriverM50I/OSlitScanner•Slitscannersareadirectionextensionofthebasictriangulationprinciple非接触三角法探头原理WaferScanner•Forbothstandardandflipchipwafers,theWaferScanner™InspectionSeriesprovidessuperioryieldmanagementfor3D/2DbumpandRDLmetrology,bumpandRDLdefectandmacrodefectinspectionthroughoutpost-fabprocesses.•Defectscreatedinthepost-fabareabetweenwaferprocessing,bumpprocessingandfinalmanufacturingcannegativelyimpactproductyieldsandtime-to-market.•TheWaferScannerquicklyandreliablylocatesbumpandwaferdefects,reducingprocesscostsandimprovingyield.Through-SiliconVia(TSV)•Athrough-siliconvia3Dpackage(3DIC)containstwoormorechipsstackedvertically,withviasthroughthesiliconsubstratesreplacingedgewiringtocreateanelectricalconnectionbetweenthecircuitelementsoneachchip.•TSVtechnologyprovidesadramaticincreaseinthefunctionalityofthedeviceinaverysmallfootprint.Multipletechnologiesarebeingexploredtoformviasduringthewaferfabricationprocess(front-end)andtheICpackagingandassemblystage(back-end).•MetrologyandinspectionoftheTSVsarecriticalforensuringtheperformanceofthe3DICsandtheprofitabilityoftheoverallmanufacturingprocess.BumpInspectionSystemSP-500B•TheSP-500Bautomaticallymeasurestheheights,coplanarity,shapesandpositionsofthebumpsonwafersorICchips.Toray'sAutomaticBumpInspectionSystemSeriesThe3Dprofilingtechniqueisbasedonanewlydevelopedopticalinterferometry,whichhastheworldfastestmeasurementspeedwithsub-micronaccuracyofheightmeasurement.SpecificationsTestResultsAugustTechnologyDesignedforhigh-speedbumpandwaferinspection,thesystemincorporatestheCompany'spatent-pendingthree-dimensional(3D)RapidConfocalSensor™,withproprietarytwo-dimensional(2D)bumpandactivedieinspectiontechnologiestoprovidebumpmanufacturerswithhigh-speedandhighaccuracycombinedinasinglebumpinspectionsolution.8~12Wafer高阶SolderBump检查机高Repepeatability(3δ):1um以下业界的最快检查能力对应8~12WaferFOUP自动机器提供多种多样化的讯息报告WVI-6000αFalcon800Camtek开发的Falcon800系列先进的测量系统用于凸起封装晶圆，并保证凸点达到他们严格的公差。CTS，Camtek三角测量系统（专利申请中）应用了比已知的三角测量原理更新的方式，提高了一系列凸起技术的精度与可重复性。更宽的角度范围创造了更多种类凸起形状与材料更强和更稳定的反射，支持凸起的真3D几何重建。Falcon800更是特别设计用于最精细的金板的测量。ASEIS-100ishigh-speedinspectiondevelopedforareaarraybumpinspectionMeasuringMethod:Triangulationbylaserscanning.Inspectionobject:Solderbumponthewafer.Handling:Cassettetocassetteinspection.Resultoutput:RealtimedisplayperchipandalsocanberecorderonMO.FeaturesHighspeedmeasurementoftheheightforsolderbumpswithhighaccuracy(±0.25µm@aveó).Measuringrangefrom10~130µmheight.High-speedinspectionbyAOD(AcoustoOpticalDeflector),laserscanning,andtriangulation.Inputandprocessingheightandbrughtnessinformationsat7megapoint/sec.Realtinedisplayforinspectionresultsperchip.WaferBump3DInspectionSystem•WaferBump3DInspectionSystemVi-Z800【WaferAutoHandler】WaferBump3DMeasurement•WaferBump3DMeasurement•WaferGoldBumpMeasurementInspection/MEM-5296D2D、3D、SDforBumping检测设备主要用途・具有高速及高精度测试WaferBump的功能・测试分辨力为0.1μm・世界领先地位的生产能力产品应用・缺陷检测功能・高精度BumpHeight检测能力及再生产的功能产品特色1.高速的检测能力2.提供有效的Off-LineReview功能3.对客户端提供简易的操作使用系统4.用独有的高精度激光变位传感器来实现高精度的测试・采用微细激光线的排列・用PSD排列来达到高速测试・对高度和缺陷进行高精度的检测，实现了先进的运算法则。5.先进的信号处理系统・采用高速的A/D转换机板・运用DMA技术来实现先进的高速信号处理・测试画面清晰Buffalo2D&3D量测设备•机台特性:该机以花岗石主体结构设计，其材质对温度变化的膨胀系数小，以至于提升机台精度，再加上机台X/Y轴使用线性马达及线性滑轨设计，无背隙产生，提高机台精度与稳定性。提供量测软件操作简易，易学易懂，快速上线使用。•机型规格:标准机型:Buffalo4(总行程400mmx400mm)Buffalo6(总行程600mmx600mm)Buffalo8(总行程800mmx800mm)另可依客户需求设计制作不同台面尺寸之规格应用领域:PCBPanelSize全范围应用BGA、CSPUnit、Strip＆Panelsize2D＆3D应用光罩尺寸与线宽线距量测覆晶载板锡球、盲孔量测晶圆凸块2D＆3D应用TFTLCD2D＆3D应用Classic2D&3D量测设备•机台特性:该机以花岗石主体结构设计，其材质对温度变化的膨胀系数小，再加上机台X/Y轴使用线性马达及空气轴承设计，流畅的平台移动，更提高机台精度与稳定性。提供量测软件操作简易，易学易懂，快速上线使用。•机型规格:标准机型:Classic600HA(总行程600mmx600mm)另可依客户需求设计制作不同台面尺寸之规格应用领域:PCBPanelSize全范围应用BGA、CSPUnit、Strip＆Panelsize2D＆3D应用光罩尺寸与线宽线距量测覆晶载板锡球、盲孔量测晶圆锡球2D＆3D应用TFTLCD2D＆3D应用VMMS全自动锡球检测设备•机台特性:该机以花岗石主体结构设计，高精度与稳定性，搭配多站