工程英文确认常用词及语句

1工程英文确认常用词及常用语句汇总单词1.附件：attached(attachment)2.样品：sample3.承认：approval4.答复：answer;reply5.规格：spec(specification)6.与...同样的：thesameas(identicalto)7.前版本：previousversion(oldversion)8.生产：production9.确认：confirm10.再次确认：doubleconfirm11.工程问题：engineeringquery（EQ）12.尽快：ASAP(assoonaspossible)13.生产文件：productiongerber14.联系某人：contactsomebody15.提交样板：submitsample16.交货期：deliverydate17.电测成本：ET（electricaltest）cost18.通断测试：Openandshorttesting19.参考：referto20.IPC标准：IPCstandard21.IPC二级：IPCclass222.可接受的：acceptable23.允许：permit(allow)24.制造：manufacture(fabricate)25.修改：revise/amend/change/modify26.公差：tolerance27.忽略：ignore(omit)28.工具孔：toolinghole29.安装孔：mountinghole30.元件孔：componenthole31.槽孔：slot32.邮票孔：snapoffhole(break–offholes)33.导通孔：via34.盲孔：blindvia35.埋孔：buriedvia36.金属化孔：PTH(platingthroughhole)37.非金属化孔：NPTH(noplatingthroughhole)38.孔位：holelocation(position)39.避免：avoid(incaseof)40.原设计：originaldesign41.修改：modify42.按原设计：leaveitasitis43.附边：wastetab44.铜条：copperstrip45.拼板强度：panelstrength46.板厚：boardthickness47.删除：remove(delete/erase)48.削铜：shavethecopper49.露铜：copperexposure50.光标点：fiducialmark51.不同：bedifferentfrom(differfrom)52.内弧：insideradius53.焊环：annularring54.单板尺寸：singlesize55.拼板尺寸：panelsize56.铣：routing57.铣刀：router58.V-cut：scoring59.哑光：matt60.光亮的：glossy61.锡珠：solderball(solderplugs)62.阻焊：soldermask(solderresist)63.阻焊开窗：soldermaskopening64.单面开窗：singlesidemaskopening65.补油：touchupsoldermask66.补线：trackwelds67.毛刺：burrs68.去毛刺：deburr69.镀层厚度：platingthickness70.清洁度：cleanliness71.离子污染：ioniccontamination72.阻燃性：flammabilityretardant73.黑化：blackoxidation74.棕化：brownoxidation75.红化：redoxidation76.可焊性：solderability77.焊料：solder78.包装：packaging79.角标：cornermark80.特性阻抗：characteristicimpedance81.差分阻抗：differentialimpedance82.正像：positive83.负片：negative84.镜像：mirror85.线宽：conductorwidth86.线距：conductorspacing87.做样：buildsample288.按照：asper89.成品：finished90.做变更：makethechange91.相类似：similarto92.规格：specification93.下移：shiftdown94.垂直地：vertically95.水平的：horizontally96.增大：increase97.缩小：decrease98.表面处理：SurfaceFinishing99.波峰焊：wavesolder100.钻孔数据：drillingdate101.标记：Logo(marking)102.Ul标记：UlMarking103.蚀刻标记：etchedmarking104.周期：datecode105.翘曲：bowandtwist106.外层：outerlayer107.内层：internallayer108.顶层：toplayer109.底层：bottomlayer110.元件面：componentside111.焊接面：solderside112.阻焊层：soldermasklayer113.丝印层：legendlayer(silkscreenlayer)114.兰胶层：peelableSMlayer115.贴片层：pastemasklayer116.碳油层：carbonlayer117.外形层：outlinelayer(profilelayer)118.白油：whiteink119.绿油：greenink120.喷锡：hotairleveling(HAL)=hotairsolderleveling(HASL)121.水金：flashgold122.插头镀金：platedgoldedge-boardcontacts(goldfinger)123.金手指：Gold-finger124.防氧化：Entek(OSP)125.沉金：Immersiongold(chem.Gold)126.沉锡：ImmersionTin(chem.Tin)127.沉银：ImmersionSilver(chem.silver)128.单面板：singlesidedboard129.双面板：doublesidedboard130.多层板：multilayerboard131.刚性板：rigidboard132.挠性板：flexibleboard133.刚挠板：flex-rigidboard134.铣：CNC(mill,routing)135.冲：punching136.倒角：beveling137.倒斜角：chamfer138.倒圆角：fillet139.尺寸：dimension140.材料：material141.介电常数：Dielectricconstant142.菲林：film143.成像：Imaging144.板镀：PanelPlating145.图镀：PatternPlating146.后清洗：FinalCleaning147.叠层：layup(stack-up)148.污染焊盘：contaminatepad149.分孔图：drillchart150.度数：degree151.被…覆盖：becoveredwith152.负公差：minustolerance153.标靶盘：targetpad154.外形公差：routingtolerance155.芯板：core常用语句－、厚度1.要求孔内铜厚0.001,超过了IPC二级标准，我们建议按IPC二级0.0008。Thecopperthicknessofthewalloftheplated-throughholesisspecified0.001.It'sexceedingIPCclass2andWesuggestasperIPCclass2.that'stosay,It's0.0008.2.要求金手指镀金厚度为1.2-1.5um，超过IPC标准太多，建议按我们常规0.45um。TheplatingthicknessofAuinedgecontactisspecified1.2-1.5um,itexceedIPCstandardtoomuchwesuggestfollowingstandard,thickness0.45uminstead.3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。Thecopperthicknessisspecified2OZ.Wesuggestthefinishedcopperthickness2OZ.Andwewillusethebase3materialwith1.5OZcopperthicknessandplateupto2OZ.4.要求锡厚为0.0005-0.003，相对IPC标准要求难很多，建议按IPC二级，即保证可焊性，Thesolderthicknessrequired0.0005-0.003,itismuchmorethanIPCstd..WesuggestfollowingIPCclass2thisistosaytoassurethesolderability.二、公差1.XXX.的尺寸公差为+/-0.005，建议按IPC二级标准也就是+/-10mil，或我方最好控制能力+/-8mil生产。ThetoleranceofdimensionisspecifiedXXX.+/-0.005.werecommendasperIPCclass2aswepreviouslyagreed,thisistosay+/-10mil,or+/-8milthatisourbestwemeet.2.在*.pdf文件中要求外形公差为+/-0.005，建议按IPC二级+/-0.01代替。Theprofiletoleranceisspecified+/-0.005in*.pdffile.WesuggestasperIPCclass2，thatistosay,itis+/-0.01.3.在叠层图中要求板厚公差为+/-0.007，而notes1中要求板厚公差为+/-0.005，他们是不同的，建议按0.062+/-0.007这与IPC标准相符Thetoleranceoftheboardthicknessisspecified+/-0.007inlayupdetailwhichisdifferentformNOTES1+/-0.005.Wesuggest0.062+/-0.007basedonIPCclass2.4.外形公差要求+/-0.1mm，建议按IPC二级标准也就是+/-10mil，或我方最好控制能力+/-8mil生产。Thetoleranceoftheoutlineisspecified+/-0.1mm.It'saboveuswerecommendasperIPCclass2aswepreviouslyagreed,thisistosay+/-10mil,or+/-8milthatisourbestwemeet.5.v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，建议标准公差即+/-0.1mm控制。Theremainingtoleranceofv-cutisspecified+/-0.06mmandoffsettoleranceis+/-0.05mm.,wesuggestbothtoleranceare+/-0.1mminstead.asperstandardspec..6.孔位公差为0.05mm，这比IPC标准严很多，建议用+/-0.076mm替代。Thetoleranceoftheholepositionisspecified0.05mm.itismuchhigherthanIPCclass2,Wesuggest+/-0