环氧树脂在电子封装中的应用及发展方向

2Vol.22No.220032ELECTRONICCOMPONENTS&MATERIALSFeb.2003112TQ323.5A1001-2028200302-0036-02TheApplicationofEpoxyResintotheElectronicEncapsulationLIXiao-yun1,ZHANGZhi-sheng1,CHAOJun-feng2(1.TheSchoolofElectronicEngineering,TianjinUniversity,Tainjin300072,China;2.WangfangBuildingMaterialLtd.,Co.,ShengliOilField,Dongyin257000,China)Abstract:Theapplicationofepoxyresintotheelectronicencapsulationisdiscussed.Epoxyresinischaracterizedwithlessershrinkageratio,higherheatresistance,bettersealing,higherinsulation,betterapplicability,etc.Theimprovementsabroadarereviewed,includinglowerviscosity,higherheatresistanceandlowermoistureabsorbingratio.Keywords:epoxyresin;materialofencapsulation;lowviscosity;heat-resistance;humidity-resistanceVLSL23%~24%95%100%90%90%IC112345EMCEpoxymoldingcompound,101IC2002-04-082002-08-101974–Tel:[phone]E-mail:[e-mail]237IC301EMCTab.1ThecompositionandcompoundingratioofEMCw/%w/%20107022.11231232.2200CH312[1].[J].,1996,(3):25.[2].[J].,1997,(11):12–13.[3].[J].,1993,(10):10–18.