TFT-LCD液晶成盒工艺介绍

CellProcessIntroductionCellStructureDiagramColorFilter(CF)TFTPolarizer(CFside)Polarizer(TFTside)SealantSpacerLCPIAgsealPadCellProcessFlowChartTFTSubstrateCFSubstrateInitialCleanPIPrintingRubbingPostRubbingCleanInitialCleanPIPrintingRubbingPostRubbingCleanSpacerDispenseSealantDispenseHotPressScribe&BreakLCInjection&EndSealPostInjectionCleanIsotropicAssemblyPolarizerAttachmentAutoclaveCellTestAg&uvglueProductProcessFlow(1)BeforePICleanerBeforePICleanerPIcoaterPIcoaterPIPrecurePIPrecurePIInspectionPIInspectionPIMaincurePIMaincureRubbingRubbingPIPrintingDoctorrollAPRplateAniloxrollPrintingcylinderDispenserStageMetalcylinder(Chromcoatingetc.)SPC.360lines/inchMaterial:EPDMSPC.400lines/inch,30%Aperture,75degreecircle,15±2umdeep(Oscillatehorizontally)(3)(4)Recipe:1.Doctorrollerpressdepth=0.4mm2.PIdropping=25~35drops/pcs3.APR&glassNIP=12.5~16.5mm4.Anilox&APRNIP=8~12mm5.Temperature=20~26℃6.Humidity=50~60%7.Tablespeed=21.5~22.5m/minAPRPlate•Material:poly-butadiene•fillingPIsolutionwithroughsurfaceRubbing配向前回轉方向延伸張力磨擦熱配向中配向後•UsemechanicalforcetorearrangetheorientationofPIfilmRubbingDirection&TiltAngle•Therod-shapeLCmoleculewillbealignednaturallywiththemicro-grooveofPIfilmsurfaceforthelowestenergy.RubbingInstrumentRollerThicknessmeasurementLoaderUnloaderRubbing機台AfterRubbing顯微鏡下看到基板表面上的條紋(正常現象)基板正面(PI面)基板背面蒸氣產生器斜向帶狀條紋(ex.13.3”CF)直條帶狀條紋(ex.14.1”CF)Rubbingbandmura撇狀條紋Rubbinglinemura(或稱為rubbingparticlelinemura)ForColorFilter1pcs/1cassetteSteamCheckRubbingDefect只有一小段(位置、大小不固定)橫跨整片基板(位置固定)Rubbingcloth受污染造成異常造成原因：particle造成可能原因基板原材問題Rubbing製程條件不好不需更換ROLLER產品可續RUN更換ROLLER後產品可續RUNProcessFlow(2)CFsubstrateAlignmentAlignmentHotPressHotPressSealantMaincureSealantMaincureAfterRub.CleanerAfterRub.CleanerAgSealUVglueAgSealUVglueSealantDispenser&Pre-cureSealantDispenser&Pre-cureAfterRubCleanerAfterRubCleanerSpacerInspectionSpacerInspectionSpacerSprayer&Pre-cureSpacerSprayer&Pre-cureAlignmentAlignmentHotPressHotPressHotPressHotPressSealantMaincureSealantMaincureSealantMaincureSealantMaincureAfterRub.CleanerAfterRub.CleanerAgSealUVglueAgSealUVglueAgSealUVglueAgSealUVglueSealantDispenser&Pre-cureSealantDispenser&Pre-cureSealantDispenser&Pre-cureSealantDispenser&Pre-cureAfterRubCleanerAfterRubCleanerSpacerInspectionSpacerInspectionSpacerInspectionSpacerInspectionSpacerSprayer&Pre-cureSpacerSprayer&Pre-cureSpacerSprayer&Pre-cureSpacerSprayer&Pre-cureTFTsubstrateAlignmentFabricationLayout(1)SealantPre-cureSealantPre-cureCFLoadAfterRubbingcleanCFLoadAfterRubbingcleanB/FB/FSealantDispenserSealantDispenserAgDispenseAgDispenseTFTLoadAfterRubbingcleanTFTLoadAfterRubbingcleanB/FB/FSpacerSrpayerSpacerSrpayerSpacerPre-cureSpacerPre-cureSpacerCountSpacerCountAlignmentAlignmentSealantPre-cureSealantPre-cureCFLoadAfterRubbingcleanCFLoadAfterRubbingcleanB/FB/FSealantDispenserSealantDispenserAgDispenseAgDispenseSealantPre-cureSealantPre-cureCFLoadAfterRubbingcleanCFLoadAfterRubbingcleanB/FB/FSealantDispenserSealantDispenserAgDispenseAgDispenseTFTLoadAfterRubbingcleanTFTLoadAfterRubbingcleanB/FB/FSpacerSrpayerSpacerSrpayerSpacerPre-cureSpacerPre-cureSpacerCountSpacerCountAlignmentAlignmentTFTLoadAfterRubbingcleanTFTLoadAfterRubbingcleanB/FB/FSpacerSrpayerSpacerSrpayerSpacerPre-cureSpacerPre-cureSpacerCountSpacerCountAlignmentAlignmentSealantDispenseSealant:•SupportingTFT&CFsubstratetoformaframeofcelltoholdLC•DispenserdrawthesealantintospecialpatternAgDispense‰Propose:ConnectingthecommonelectrodeofTFTandCFsubstratetocreateelectricfieldbetweencell.•TheelectricfielddrivearrangementoftheLCmolecule框膠Type比較DispenserTypeScreenType框膠Type比較少多材料用量易不易框膠寬度控制極佳差位置精度控度較少多污染問題無有基板損傷較低大產能DispenserScreen項目製造流程及目的a.Sealantdispenser:提供panel中AR與CF之接合，提供panel中液晶與外界的隔絕b.Sealantbreakchecker:確認框膠pattern之塗佈情形(斷膠、框膠粗細)c.Sealantprecure:將sealant中之溶劑揮發使sealant黏度變高，以防止hot-press時sealantpath之產生d.Cooling:協助precure後之基板冷卻d.Ag-sealantdispenser:導通CF與AR上之COM電極，以形成控制液晶分子驅動之電場框膠材料調配及填灌:框膠膠材退冰3hr框膠置於調膠杯內rod-spacer置於調膠杯內調配比率1.5/100手動攪拌真空攪拌脫泡2.5hr框膠填灌入膠筒膠筒真空靜置脫泡6~8hr置於冰箱冷藏膠材之脫泡•脫泡之目的:a.將膠材中所溶入之空氣，經各種脫泡方式，脫離膠材。b.防止膠材塗佈時，有吐膠不順及斷膠之現象產生。•脫泡之方式:a.靜置脫泡b.真空靜置脫泡c.離心力脫泡d.真空攪拌脫泡框膠塗佈控制參數塗佈台面塗佈壓力(N2)膠材黏度塗佈速度塗佈gap值針頭孔徑玻璃a.膠材黏度:44000mPa.sb.塗佈壓力:2.0~2.5kg/cm2c.塗佈gap值:30~40μmd.針頭孔徑:0.25mme.塗佈速度:50mm/sec銀膠塗佈控制參數塗佈台面塗佈壓力(N2)膠材黏度塗佈時間塗佈gap值針頭孔徑玻璃a.膠材黏度:550Poiseb.塗佈壓力:0.2~0.5kg/cm2c.塗佈gap值:25~30μmd.針頭孔徑:0.25mme.塗佈速度:0.15msec框膠塗佈之圖形(pattern)圖形之區別:a.主圖形(mainpattern)a-1.為支撐panel外圍之patterna-2.為液晶注入封口時之所須之patternb.輔助圖形(dummypattern)b-1.為mainpattern外之patternb-2.為切裂所須之patternc.機台辨別圖形c-1.辨別機台別之pattern14.1“之pattern順序24順序16順序18順序19~23順序15順序26順序14順序17順序1順序6順序7順序8~12順序13順序28順序5順序2順序3順序4順序29順序30~33順序27順序2515“之pattern順序6順序7順序8順序9順序10~14順序16順序15順序4順序5順序3順序26~29順序17順序18順序19~23順序25順序24順序1順序28.4“之pattern順序1順序2順序3~6順序7順序8~14順序15~21順序22順序23順序24順序25順序26順序27~30順序31順序32順序33~39順序40~46順序47~5017“之pattern順序4順序18~21順序3順序5~9順序23順序22順序1順序2順序12順序11順序13~17順序10基板塗佈流程:基板搬入對位記號對位膠筒針頭捨打gap值量測輔助圖形塗佈主圖形塗佈線幅值量測斷面積值量測基板搬出a.對位mark對位:控制塗佈精度b.膠筒針頭(nozzle)捨打:防止第一筆之膠量過大c.gap值量測:確認塗佈時之gap值d.線幅值量測:塗佈後之框膠路徑上寬度量測e.斷面積值量測:塗佈後之框膠路徑上截面積量測框膠線幅值及斷面積值圖示框膠路徑框膠線幅值框膠斷面積值玻璃常