ATCA标准简介

[e-mail]1,2003Slide2AdvancedTCATMOctober1,2003AcknowledgementszThistutorialdrawsheavilyontheworkof„ChuckByers,LucentTechnologies„JimKennedy,Intel„MarkOvergaard,PigeonPointSystems„MichaelThompson,Pentair/Schroff„HenryWong,Motorolawhojointlypresentedamoredetailedhalf-dayAdvancedTCAseminaronMay21,2003,see:„’sGoalzDescribetheAdvancedTCAplatform,anditsapplications,inenoughdetailsothatyoucanmakeinformeddecisionsOutlinezAdvancedTCAbackgroundandmarketfocuszTechnicaloverviewzDetails,details,detailszApplicationexampleszCurrentmarketstatuszConclusionsandQ&ASlide4AdvancedTCATMOctober1,2003EvolvingTelecomMarketzMuchhypedvoice-dataconvergence„Slowerthanoncepredicted,buthappeningzCorenetworkdataratesincreasing„NetworkequipmentperformancelimitedbyI/OzEnhancedserviceplatformsleveragingstandardcomputersandoperatingsystems„FrequentlySPARCSolarisorLinuxonIntelzTier1equipmentprovidershavedownsized„SeekingtooutsourceandleverageCOTStechnologySlide5AdvancedTCATMOctober1,2003ShortfallofExistingStandardszBoardarea,boardspacing,powerandcoolinginadequateforexistingandemergingsiliconzBackplanecapacitylimitedzDiversesystemmanagementapproacheszDifficultymeetingavailabilityobjectives„Legacybus(VME,PCI)limitations„PowerdistributionissueszPoormatchtotelecomequipmentpractices„Chassismechanicalstandardsdon’tmatchequipmentframesorsupportneededI/O„SystemsfailtoleveragetelecompowerarchitecturesSlide6AdvancedTCATMOctober1,2003AdvancedTCAObjectiveszMeettheevolvingneedsofcommunicationsnetworkinfrastructure„Telecomfocus„Edge,coreandtransport,aswellasdatacenter„Wireless,wirelineandopticalnetworkelements„Highlevelsofserviceavailability(99.999%ormore)„ScalableperformanceandcapacityzReducedevelopmenttimeandtotalcostofownership„Openarchitecture,modularcomponentssourcedbyadynamic,interoperable,multi-vendormarketSlide7AdvancedTCATMOctober1,2003AdvancedTCAFeatureszSeriallinks&switchfabrictechnology„Redundantstarorfullmeshdatatransport,withswitchfabricalternatives,canscaleto2.5Tb/s„DualredundantEthernetcontrolplanezLargeboardareasupportslatestsilicon„Powerandcoolingforupto200wattsperslotz600mm(~24”)ETSIframeequipmentpractice„Provisionfor19”and23”versionszSophisticatedsystemmanagement„AdvancedsoftwareinfrastructureforOAM&P„Healthmonitoring;modulepowercontrol;electronickeying;activecoolingcontrolSlide8AdvancedTCATMOctober1,2003AdvancedTCAFeatures(cont.)zTelecomcentricI/O„Multi-protocolsupportforinterfacesupto40Gb/s„Front-to-backclearancesforsimultaneousfrontandrearI/Oincludingfiberbendradii„OptionalreartransitionmodulesforrearI/OzAvailabilityscalesto99.999%ormore„Singleboardfailuredomain„Hotswapcapabilityforallboards&activemodules„Redundant-48VDCpowerfeeds„Redundantcontrolanddataplanes„SophisticatedsystemmanagementSlide9AdvancedTCATMOctober1,2003ComparisonWithPICMG2.XLowModerateHighLifecyclecostperfunctionHighModerateLowFunctionaldensityofshelfInstandardVendorspecificVendorspecificRegulatoryconformance2H200320011995StandardGAScheduleModerateLow-ModerateLowBasecostofshelfAnticipatedin2003BuildingExtensiveMulti-vendorsupportYesNoNoClock,update,testbusExtensiveOKLimitedI/OAdvancedOKOKManagementDistributedConvertersDual48VBackplaneCentralConverter5,12,3.3VBackplaneCentralConverter5,12,3.3VBackplanePowerSystem161921#ActiveBoards~2.4Tb/s~38Gb/s~4Gb/sBackplaneBandwidth150-200W35-50W35-50WBoardPower8U*x280mmx1.2”140sqin+4Mez6Ux160mmx.8”57sqin+2Mez6Ux160mmx.8”57sqin+2MezBoardSizePICMG3/ATCAPICMG2.16/CPSBPICMG2/CPCIAttributeSource:ChuckByers,LucentTechnologiesSlide10AdvancedTCATMOctober1,2003AdvancedTCAHistoryzInformal“SantaBarbara”group7/2001zPICMG3workgroupchartered11/2001withover100companiesparticipating„Subteams:FormFactor,Backplane/Fabric,RASM„Basespec(PICMG3.0)formechanical,power,cooling,interconnect,andRASMproperties„Sub-specsfordatatransportfabricsalternativeszPICMG3.0specratified12/30/2002„430pages;11,000personhoursofmeetingsandconferencecalls;UntoldhoursofindividualworkzRealinter-operableproductsavailabletoday„Fifthinter-opworkshopheldSeptember2003Slide11AdvancedTCATMOctober1,2003Details,Details,Details...zMechanicalzPower&ThermalzManagementzDataTransportzMezzanineCardszRegulatorySlide12AdvancedTCATMOctober1,2003MechanicalConfigurationz8Uboardsin12Uchassis„16slotsin600mmframe„14slotsin19”cabinetz1.2”boardpitchallowsheatsinksplusrearSMTzForcedaircoolingforupto200wattsperslotzFrontandrearfiberbendareain600mmdepthzSimplifiedsheetmetalconstructionzETSI&NEBSvibration,shockandserviceabilitySlide13AdvancedTCATMOctober1,2003Source:MichaelThompson,Pentair/SchroffChassisMechanics,Depthz600mmcabinetdepthz25mmthickdoorsz100mmfrontcable/airareaz60mmrearcable/airareaz390mmremainsforchassisz388faceplatetofaceplateSlide14AdvancedTCATMOctober1,2003SheetMetalConstructionzLowercostinhighvolumezLoosertoleranceszEarthquakeperformancez1.6mmto2.4mmslotsESDclipGuideRailfunnelRetentionScr