搜索
1电子专业术语缩写简写All-In-On（单一主板结构设计）VGA（VideoGrephicsArray）视频图形阵列CRT（CathodeReyTude）阴极射线管LVDS（LowVoltageDifferentialSignal）低压差分信号LCD（LiquidCrystalDisplay）液晶显示器CPU（CentralProcessUnit）中央处理器DIY（DoItYourself）自己动手做TFT（ThinFilmTramsistor）薄膜晶体管HDD（HardDiskDrive）硬盘驱动器IDE（IntegratedDriveElectronics）集成开发环境、电子集成驱动器SATA（SerialATA）串行ATAODD（OpticalDiskDrive）光盘驱动器1×（ODD中的一倍速）150KB/SRAM（RandomAccessMemory）随机存取存储器Inverter（高压板）反向器XGA（ExtendedGraphicsArray）延伸绘图陈列SVGA（SuperVGA）UXGA（UltraXGA）调整VGAWLAN（WirelessLocalAreaNet）无线局域网CCK（ComplementaryCodeKeying)补码键控调制OFDM（OrthogonalFrequencyDivisionMultiplexing）正交频分多路复用技术FSB（FrontSideBus）前端总线SDRAM（SynchronousDynamicRAM）同步动态RAMDDR（DoubleDataRate）双倍数据传输率StickPoint（指点杆）TouthPad（触控板）OEM（OriginalEquipmentManufacturer）电脑原始设备制造商ODM（OriginalDesignManufacturer）设计制造商R&D（Research&Development）研发PCB（PrintCircuitBoard）印制电路板EMI（ElectroMagneticInterference）电磁干扰EMC（ElectroMagneticCompatibility）电磁兼容BlindVia(盲孔)BuriedVia(埋孔)ThroughVia(通孔)PAD(焊点)VIA(导通孔)SMT(SurfaceMountTechnology)表面安装技术ME(Mechabicalengineer)机构工程师BOM(BillOfMaterial)物料单DIP(DualInlinePackage)双列直插式组装QFP(QualFlatPackage)方型扁平封装2PGA(PinGridArray)BGA(BallGridArrayPackage)球栅阵列阵列CSP（ShipSizePackage）芯片尺寸封装MCM（MultiChipModel）多芯片模块OOBA(OutOfBoxAudit)开箱检查ElectricScrewDiver（电动起子）Fixture（治具）BarcodeScanner(条形码扫描仪)IPQC(InProcessQualityControl)制程中的质量检测人员OQC(OutputQualityControl)最终出货质量管理人员IQC(IncomingQualityComtrol)进料质量管理人员OQA(OutputQualityAssurance)出货质量保证人员FAI(FirstArticleInspection)新品首件检查FAA(FirstArticleAssurance)首件确认P/N(PartNumber)料号L/N(LotNumber)批号PDCA(PlanDoCheckAction)计划、执行、检查、总结ECN(EngineeringChangeNotes)工程变更通知（供货商）ECO(EngineeringChangeOrder)工程改动要求（客户）PCN(ProcessChangeNotice)工序改动通知PMP(ProductManagementPlan)生产管制计划SOP(StandardOperationProcedure)制造作业规范IS(InspectionSpecification)成品检验规范PS（PackageSpecification）包装规范SPEC（Specification）规格ES（EngineeringStandardization）工程标准PO（PurchasingOrder）采购订单MO（ManufactureOrde）生产单D/C（DateCode）生产日期码ID/C（IdentificationCode）（供货商）识别码ESD（ElectroStaticDischarge）静电排放ASS’Y（Assembly）组装MAT’S（Material）材料LED（Light-EmittingDiode）发光二极管COA（CertificationOfAuthentication）微软之授权条码EOL（EndOfLife）产品生产周期SCSI（SmallComputerSystemInterface）小型计算机接口系统BIOS（BasicInput/OutputSystem）基本输入输出系统SFIS（ShopFloorInformationSystem）现场信息整合系统IC（IntegratedCircuit）集成电路SPC（StatisticalProcessControl）统计制程管制SQC（StatisticalQualityControl）统计品质管制DIM（Dimension）尺寸DIA（Diameter）直径3SIP（StandardInspectionProcedure）制程检验标准程序IS（InspectionSpecification）成品检验规范MC（MaterialControl）物料控制PCC（ProductionPlanControl）生产计划控制N/A（NotApplicable）不适用NG（NotGood）不良AC(alternatingcurrent)交流(电)A／D(analogtodigital)模拟／数字转换ADC(analogtodigitalconvertor)模拟／数字转换器ADM(adaptivedeltamodulation)自适应增量调制ADPCM(adaptivedifferentialpulsecodemodulation)自适应差分脉冲编码调制ALU(arithmeticlogicunit)算术逻辑单ASCII(Americanstandardcodeforinformationinterchange)美国信息交换标准码AV(audiovisual)声视，视听BCD(binarycodeddecimal)二进制编码的十进制数BCR(bi-directionalcontrolledrectifier)双向晶闸管BCR(buffercourtierreset)缓冲计数器BZ(buzzer)蜂鸣器，蜂音器C(capacitance，capacitor)电容量，电容器CATV(cabletelevision)电缆电视CCD(charge-coupleddevice)电荷耦合器件CCTV(closed-circuittelevision)闭路电视CMOS(complementary)互补MOSCPU(centralprocessingunit)**处理单元CS(controlsignal)控制信号D(diode)二极管DAST(directanalogstoretechnology)直接模拟存储技术DC(directcurrent)直流DIP(dualin-linepackage)双列直插封装DP(dialpulse)拨号脉冲DRAM(dynamicrandomaccessmemory)动态随机存储器DTL(diode-transistorlogic)二极管晶体管逻辑DUT(deviceundertest)被测器件DVM(digitalvoltmeter)数字电压表ECG(electrocardiograph)心电图ECL(emittercoupledlogic)射极耦合逻辑EDI(electronicdatainterchange)电子数据交换EIA(ElectronicIndustriesAssociation)电子工业联合会EOC(endofconversion)转换结束EPROM(erasableprogrammablereadonlymemory)可擦可编程只读存储器EEPROM(electricallyEPROM)电可擦可编程只读存储器ESD(electro-staticdischarge)静电放电FET(field-effecttransistor)场效应晶体管4FS(fullscale)满量程F／V(frequencytovoltageconvertor)频率／电压转换FM(frequencymodulation)调频FSK(frequencyshiftkeying)频移键控FSM(fieldstrengthmeter)场强计FST(fastswitchingshyster)快速晶闸管FU(fuseunit)保险丝装置FWD(forward)正向的GAL(genericarraylogic)通用阵列逻辑GND(ground)接地，地线GTO(Sateturnoffthruster)门极可关断晶体管HART(highwayaddressableremotetransducer)可寻址远程传感器数据公路HCMOS(highdensityCOMS)高密度互补金属氧化物半导体(器件)HF(highfrequency)高频HTL(highthresholdlogic)高阈值逻辑电路HTS(heattemperaturesensor)热温度传感器IC(integratedcircuit)集成电路ID(internationaldata)国际数据IGBT(insulatedgatebipolartransistor)绝缘栅双极型晶体管IGFET(insulatedgatefieldeffecttransistor)绝缘栅场效应晶体管I／O(input／output)输入／输出I／V(currenttovoltageconvertor)电流-电压变换器IPM(incidentalphasemodulation)附带的相位调制IPM(intelligentpowermodule)智能功率模块IR(infraredradiation)红外辐射IRQ(interruptrequest)中断请求JFET(junctionfieldeffecttransistor)结型场效应晶体管LAS(lightactivatedswitch)光敏开关LASCS(lightactivatedsiliconcontrolledswitch)光控可控硅开关LCD(liquidcrystaldisplay)液晶显示器LDR(lightdependentresistor)光敏电阻LED(lightemittingdiode)发光二极管LRC(longitudinalredundancycheck)纵向冗余(码)校验LSB(leastsignificantbit)最低有效位LSI(1argescaleintegration)大规模集成电路M(motor)电动机MCT(MOScontrolledgyrator)场控晶闸管MIC(microphone)话筒，微音器，麦克风min(minute)分MOS(metaloxidesemiconductor)金属氧化物半导体MOSFET(metaloxidesemiconductorFET)金属氧化物半导体场效应晶体管[N(negative)负NMOS(N-channelmetaloxidesemiconductorFET)N沟道MOSFETNTC(negativetempera