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电子封装微互连中的电迁移作者：尹立孟，张新平，YINLi-meng，ZHANGXin-ping作者单位：华南理工大学机械上程学院,广东广州,510640刊名：电子学报英文刊名：ACTAELECTRONICASINICA年，卷(期)：2008,36(8)被引用次数：6次参考文献(20条)1.Hau-RiegeCSAnintroductiontoCuelectromigration[外文期刊]2004(02)2.CeuninckWAD;D'haegerV;OlMENJVTheinfluenceofadditionelementsontheearlyresistancechangesobservedduringelectromigrationtestingofA1metallines[外文期刊]1998(01)3.SpolenakR;KraftO;AratEEffectsofalloyingelementsonelectromigration[外文期刊]1998(6-8)4.HuangAT;GusakAM;TuKN;LaiYSThermomigrationinSnPbcompositeflipchipsolderjoints[外文期刊]2006(141911)5.YeH;BasaranC;HopkinsDThermomigrationinPb-Snsol-derjointsunderjouleheatingduringelectriccurrentstressing[外文期刊]2003(07)6.ChenC;LiangSWElectromigrafionissuesinlead-freesolderjoints[外文期刊]2007(1-3)7.杨卫力电失效学20018.YoungD;ChristouAFailuremechanismmodelsforelectromi-grafion[外文期刊]1994(02)9.TuKNRecentadvancesonelectromigrationinvery-large-scale-integrationinterconnects[外文期刊]2003(09)10.张新平;尹立孟;于传宝电子及光子封装无铅钎料研究和应用进展[期刊论文]-材料研究学报2008(1)11.ZhangXP;YuCB;ShresthaS;DomLCreepandfatiguebe-haviorsofthelead-fleeSn-Ag-Cu-BiandSn60Pb40solderin-terconnectionsatelevatexdtemperatures[外文期刊]2007(08)12.ChoiWJ;YehECC;TuKNMean-time-to-failurestudyofflipchipsolderjointsonCu/Ni(V)/AIthin-filmunder-bump-metallization[外文期刊]2003(09)13.KielbasifiskiK;KalenikJ;KisielRInvestigationofelectromi-grationonprintedcircuitboardssolderedwithlead-freesolder200614.YuDQ;JillekW;SchmittEElectrochemicalmigrationofleadfreesolderjoints[外文期刊]2006(03)15.ChuangYC;LiuCYThermomigrationineutecticSnPballoy[外文期刊]2006(174105)16.ChoiJY;LeeSS;PaikJM;JooYCElectromigrationbe-haviorofeutecticSnPbsolder200117.HuangAT;TuKN;LaiYSEffectofthecombinationofelectromigrationandthermomigrationonphasemigrationandpartialmeltinginflipchipcompositeSnPbsolderjoints[外文期刊]2006(033512)18.ZengK;TuKNSixcasesofreliabilitystudyofPb-freesol-tierjointsinelectronicpackagingtechnology[外文期刊]2002(02)19.YeH;BasaranC;HopkinsDCMechanicaldegradationofmicroelectronicssolderjointsundercurrentstressing[外文期刊]2003(26)20.TuKN;GusakAM;LiMPhysicsandmaterialschallengesforlead-freesolders[外文期刊]2003(03)引证文献(7条)1.尹立孟.张新平无铅微互连焊点力学行为尺寸效应的试验及数值模拟[期刊论文]-机械工程学报2010(2)2.杨艳.尹立孟.马骁.张新平电迁移致SnAgCu微焊点强度退化及尺寸效应研究[期刊论文]-电子元件与材料2010(2)3.任春岭.高娜燕.丁荣峥倒装焊陶瓷封装失效模式分析及失效机理研究[期刊论文]-电子与封装2010(8)4.黎滨.杨艳.尹立孟.张新平无铅微焊点界面断裂行为的尺寸效应[期刊论文]-机械工程学报2010(18)5.杜明星.魏克新IGBT模块故障机理及其预报方法综述[期刊论文]-世界科技研究与发展2010(6)6.尹立孟.杨艳.刘亮岐.张新平电子封装微互连焊点力学行为的尺寸效应[期刊论文]-金属学报2009(4)7.杜明星.魏克新IGBT模块故障机理及其预报方法综述[期刊论文]-世界科技研究与发展2010(6)本文链接：