电子设备热设计(目录)Thermal Design of Electronic Equipment

“Frontmatter”ThermalDesignofElectronicEquipment.Ed.RalphRemsburgBocaRaton:CRCPressLLC,2001©2001byCRCPRESSLLCTHERMALDESIGNofELECTRONICEQUIPMENT©2001byCRCPRESSLLCELECTRONICSHANDBOOKSERIESSeriesEditor:JerryC.WhitakerTechnicalPressMorganHill,CaliforniaPUBLISHEDTITLESACPOWERSYSTEMSHANDBOOK,SECONDEDITIONJerryC.WhitakerTHECOMMUNICATIONSFACILITYDESIGNHANDBOOKJerryC.WhitakerTHEELECTRONICPACKAGINGHANDBOOKGlennR.BlackwellPOWERVACUUMTUBESHANDBOOK,SECONDEDITIONJerryC.WhitakerTHERMALDESIGNOFELECTRONICEQUIPMENTRalphRemsburgTHERESOURCEHANDBOOKOFELECTRONICSJerryC.WhitakerMICROELECTRONICSJerryC.WhitakerSEMICONDUCTORDEVICESANDCIRCUITSJerryC.WhitakerSIGNALMEASUREMENT,ANALYSIS,ANDTESTINGJerryC.WhitakerFORTHCOMINGTITLESELECTRONICSYSTEMSMAINTENANCEHANDBOOKJerryC.Whitaker©2001byCRCPRESSLLCBocaRatonLondonNewYorkWashington,D.C.CRCPressTHERMALDESIGNofELECTRONICEQUIPMENTRalphRemsburgNortelNetworksBocaRaton,Florida©2001byCRCPRESSLLCThisbookcontainsinformationobtainedfromauthenticandhighlyregardedsources.Reprintedmaterialisquotedwithpermission,andsourcesareindicated.Awidevarietyofreferencesarelisted.Reasonableeffortshavebeenmadetopublishreliabledataandinformation,buttheauthorandthepublishercannotassumeresponsibilityforthevalidityofallmaterialsorfortheconsequencesoftheiruse.Neitherthisbooknoranypartmaybereproducedortransmittedinanyformorbyanymeans,electronicormechanical,includingphotocopying,microfilming,andrecording,orbyanyinformationstorageorretrievalsystem,withoutpriorpermissioninwritingfromthepublisher.TheconsentofCRCPressLLCdoesnotextendtocopyingforgeneraldistribution,forpromotion,forcreatingnewworks,orforresale.SpecificpermissionmustbeobtainedinwritingfromCRCPressLLCforsuchcopying.DirectallinquiriestoCRCPressLLC,2000N.W.CorporateBlvd.,BocaRaton,Florida33431.TrademarkNotice:Productorcorporatenamesmaybetrademarksorregisteredtrademarks,andareusedonlyforidentificationandexplanation,withoutintenttoinfringe.©2001byCRCPressLLCNoclaimtooriginalU.S.GovernmentworksInternationalStandardBookNumber0-8493-0082-7LibraryofCongressCardNumber00-057170PrintedintheUnitedStatesofAmerica1234567890Printedonacid-freepaperLibraryofCongressCataloging-in-PublicationDataRemsburg,Ralph.Thermaldesignofelectronicequipment/RalphRemsburg.p.cm.--(Electronicshandbookseries)Includesbibliographicalreferencesandindex.ISBN0-8493-0082-7(alk.paper)1.Electronicapparatusandappliances--Thermalproperties.2.Electronicapparatusandappliances--Designandconstruction.3.Heat--Transmission.4.Electronicpackaging.I.Title.II.Series.TK7870.25.R462001621.38104--dc2100-0571700082-FM.fmPage4Wednesday,August23,20009:50AM©2001byCRCPRESSLLCPrefaceThefieldofelectronicpackagingcontinuestogrowatanamazingrate.Theelectronicpackagingengineerrequiresanalyticalskills,afoundationinmechanicalengineer-ing,andaccesstothelatestdevelopmentsintheelectronicsfield.Theemphasismaychangefromprojecttoproject,andfromcompanytocompany,yetsomeconstantsshouldcontinueintotheforeseeablefuture.Oneoftheseistheemphasisonthermaldesign.Thermalanalysisofelectronicequipmentisbecomingoneoftheprimaryaspectsofmanypackagingjobs.Anup-frontcommitmenttoCFD(ComputationalFluidDynamics)softwarecode,FEA(FiniteElementAnalysis)software,istheresultofrealizingthatthethermalproblemswillonlygetworse.Asthesizeoftheelectroniccircuitisreduced,speedisincreased.Asthepowerofthesesystemsincreasesandthespaceallottedtothemdiminishes,heatfluxordensity(heatperunitarea,W/m2)hasspiraled.Whileaircoolingisstillusedexten-sively,advancedheattransfertechniquesusingexoticsyntheticliquidsarebecomingmorepopular,allowingevensmallersystemstobedesigned.Thisreferencebookofformulasistheresultofsiftingthroughthevolumesofdataongeneralheattransferandextractingtheformulasthatareneededbytoday’selectronicpackagingengineers.Thereaderwillimmediatelynoticetheemphasisplacedonfluiddynamicsformulasinthisbook.Sinceconvectioncoolingistheheattransferpathmostengineerstaketodealwiththermalproblems,itisappropriatetogainasmuchunderstandingabouttheunderlyingmechanismsoffluidmotionaspossible.Theapplicationofadvancedthermalmanagementtechniquesrequiresabackgroundinfluiddynamics.0082-FM.fmPage5Wednesday,August23,20009:50AM©2001byCRCPRESSLLCAuthorRalphRemsburgiscurrentlySeniorThermalAnalystatNortelNetworks,BocaRaton,FL.Previously,heheldengineeringpositionsuptothedirectorlevel.FordAerospace,ChryslerCorporation,Delco,HughesNetworkSystems,LoralDataSystems,MoogSpaceProducts,AlconSurgicalLabs,andDellComputerhaveallbenefitedfromhisexpertiseasaconsultant.Remsburg’snameisonover30patents,5publishedpapers,andapreviousbook.HeattendedNewYorkUniversity,receivedamaster’sdegreefromColumbiaUni-versity,andiscompletingadissertationforadoctorate.0082-FM.fmPage7Wednesday,August23,20009:50AM©2001byCRCPRESSLLCNomenclatureandSymbologySYMBOLDEFINITIONSymbolDescriptionInternationalUnitsEnglishUnitsaVelocityofsound;accelerationm/sft/saThermaldiffusivity(ak/c)m2/sft2/hAArea;Ac,cross-sectionalareaAp,projectedareaofabodynormaltoflowAs,surfaceareaAo,outsideareaAi,insideaream2ft2bBreadthorwidthmftcSpecificheatcp,specificheatatconstant