上美电科技SunmadiaTechnologiesTel:010-84829432Fax:010-51413040QQ:764340707/869227002:mkt@sunmadia.com印制电路术语总汇(中英文)行业术语一、综合词汇1、印制电路:printedcircuit2、印制线路:printedwiring3、印制板:printedboard4、印制板电路:printedcircuitboard(pcb)5、印制线路板:printedwiringboard(pwb)6、印制元件:printedcomponent7、印制接点:printedcontact8、印制板装配:printedboardassembly9、板:board10、单面印制板:single-sidedprintedboard(ssb)11、双面印制板:double-sidedprintedboard(dsb)12、多层印制板:mulitlayerprintedboard(mlb)13、多层印制电路板:mulitlayerprintedcircuitboard14、多层印制线路板:mulitlayerpritedwiringboard15、刚性印制板:rigidprintedboard16、刚性单面印制板:rigidsingle-sidedprintedborad17、刚性双面印制板:rigiddouble-sidedprintedborad18、刚性多层印制板:rigidmultilayerprintedboard19、挠性多层印制板:flexiblemultilayerprintedboard20、挠性印制板:flexibleprintedboard21、挠性单面印制板:flexiblesingle-sidedprintedboard22、挠性双面印制板:flexibledouble-sidedprintedboard23、挠性印制电路:flexibleprintedcircuit(fpc)24、挠性印制线路:flexibleprintedwiring25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、齐平印制板:flushprintedboard29、金属芯印制板:metalcoreprintedboard30、金属基印制板:metalbaseprintedboard31、多重布线印制板:mulit-wiringprintedboard32、陶瓷印制板:ceramicsubstrateprintedboard33、导电胶印制板:electroconductivepasteprintedboard34、模塑电路板:moldedcircuitboard35、模压印制板:stampedprintedwiringboard36、顺序层压多层印制板:sequentially-laminatedmulitlayer37、散线印制板:discretewiringboard38、微线印制板:microwireboard39、积层印制板:buile-upprintedboard40、积层多层印制板:build-upmulitlayerprintedboard(bum)上美电科技SunmadiaTechnologiesTel:010-84829432Fax:010-51413040QQ:764340707/869227002:mkt@sunmadia.com41、积层挠印制板:build-upflexibleprintedboard42、表面层合电路板:surfacelaminarcircuit(slc)43、埋入凸块连印制板:b2itprintedboard44、多层膜基板:multi-layeredfilmsubstrate(mfs)45、层间全内导通多层印制板:alivhmultilayerprintedboard46、载芯片板:chiponboard(cob)47、埋电阻板:buriedresistanceboard48、母板:motherboard49、子板:daughterboard50、背板:backplane51、裸板:bareboard52、键盘板夹心板:copper-invar-copperboard53、动态挠性板:dynamicflexboard54、静态挠性板:staticflexboard55、可断拼板:break-awayplanel56、电缆:cable57、挠性扁平电缆:flexibleflatcable(ffc)58、薄膜开关:membraneswitch59、混合电路:hybridcircuit60、厚膜:thickfilm61、厚膜电路:thickfilmcircuit62、薄膜:thinfilm63、薄膜混合电路:thinfilmhybridcircuit64、互连:interconnection65、导线:conductortraceline66、齐平导线:flushconductor67、传输线:transmissionline68、跨交:crossover69、板边插头:edge-boardcontact70、增强板:stiffener71、基底:substrate72、基板面:realestate73、导线面:conductorside74、元件面:componentside75、焊接面:solderside76、印制:printing77、网格:grid78、图形:pattern79、导电图形:conductivepattern80、非导电图形:non-conductivepattern81、字符:legend82、标志:mark二、基材:1、基材:basematerial上美电科技SunmadiaTechnologiesTel:010-84829432Fax:010-51413040QQ:764340707/869227002:mkt@sunmadia.com2、层压板:laminate3、覆金属箔基材:metal-cladbadematerial4、覆铜箔层压板:copper-cladlaminate(ccl)5、单面覆铜箔层压板:single-sidedcopper-cladlaminate6、双面覆铜箔层压板:double-sidedcopper-cladlaminate7、复合层压板:compositelaminate8、薄层压板:thinlaminate9、金属芯覆铜箔层压板:metalcorecopper-cladlaminate10、金属基覆铜层压板:metalbasecopper-cladlaminate11、挠性覆铜箔绝缘薄膜:flexiblecopper-claddielectricfilm12、基体材料:basismaterial13、预浸材料:prepreg14、粘结片:bondingsheet15、预浸粘结片:preimpregnatedbondingsheer16、环氧玻璃基板:epoxyglasssubstrate17、加成法用层压板:laminateforadditiveprocess18、预制内层覆箔板:masslaminationpanel19、内层芯板:corematerial20、催化板材:catalyzedboard,coatedcatalyzedlaminate21、涂胶催化层压板:adhesive-coatedcatalyzedlaminate22、涂胶无催层压板:adhesive-coateduncatalyzedlaminate23、粘结层:bondinglayer24、粘结膜:filmadhesive25、涂胶粘剂绝缘薄膜:adhesivecoateddielectricfilm26、无支撑胶粘剂膜:unsupportedadhesivefilm27、覆盖层:coverlayer(coverlay)28、增强板材:stiffenermaterial29、铜箔面:copper-cladsurface30、去铜箔面:foilremovalsurface31、层压板面:uncladlaminatesurface32、基膜面:basefilmsurface33、胶粘剂面:adhesivefaec34、原始光洁面:platefinish35、粗面:mattfinish36、纵向:lengthwisedirection37、模向:crosswisedirection38、剪切板:cuttosizepanel39、酚醛纸质覆铜箔板:phenoliccellulosepapercopper-cladlaminates(phenolic/paperccl)40、环氧纸质覆铜箔板:epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)41、环氧玻璃布基覆铜箔板:epoxidewovenglassfabriccopper-cladlaminates42、环氧玻璃布纸复合覆铜箔板:epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates上美电科技SunmadiaTechnologiesTel:010-84829432Fax:010-51413040QQ:764340707/869227002:mkt@sunmadia.com44、聚酯玻璃布覆铜箔板:ployesterwovenglassfabriccopper-cladlaminates45、聚酰亚胺玻璃布覆铜箔板:polyimidewovenglassfabriccopper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates47、环氧合成纤维布覆铜箔板:epoxidesyntheticfiberfabriccopper-cladlaminates48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiberglasscopper-cladlaminates49、超薄型层压板:ultrathinlaminate50、陶瓷基覆铜箔板:ceramicsbasecopper-cladlaminates51、紫外线阻挡型覆铜箔板:uvblockingcopper-cladlaminates三、基材的材料1、a阶树脂:a-stageresin2、b阶树脂:b-stageresin3、c阶树脂:c-stageresin4、环氧树脂:epoxyresin5、酚醛树脂:phenolicresin6、聚酯树脂:polyesterresin7、聚酰亚胺树脂:polyimideresin8、双马来酰亚胺三嗪树脂:bismaleimide-triazineresin9、丙烯酸树脂:acrylicresin10、三聚氰胺甲醛树脂:melamineformaldehyderesin11、多官能环氧树脂:polyfunctionalepoxyr