UMTC-Substrate-Process-Flow-Intro

WorldClassQualityCONFIDENTIALUnimicron1(MESA)ProcessElectrolyticNi/AuplatingAFOPEPPENEPIGSurfaceFinishWorldClassQualityCONFIDENTIALUnimicron32LSubtractiveProcessFlow2LSubtractiveProcessFlowWorldClassQualityCONFIDENTIALUnimicron4CSPtechnologyinUnimicronCSPtechnologyinUnimicronCSPProductSTDUni-PadSTDHDI6LayerHDIStructure2Layer4LayerSubtractiveSemi-additive(MESA)ProcessElectrolyticNi/AuplatingAFOPEPPENEPIGSurfaceFinishWorldClassQualityCONFIDENTIALUnimicron5ManufacturingProcessof2LSTDDesignDrillingElectrolessCopperPlatingPretreatmentPretreatmentD/FLaminateExposuringElectrolyticCopperPlatingLithographyAOISolderMaskAOI/VRSStrippingEtchingDevelopingCuPlatingPretreatmentStrikeAuPlatingNickelPlatingDevelopingExposuringS/MPrintingVisualInspectionVisualInspectionPackagingFinalCleanAuPlatingPostcurePrecureRoutingDrillingNi/AuPlatingCleaningPretreatmentStorageShiptocustomerPackaging/StorageRoutingWorldClassQualityCONFIDENTIALUnimicron6PanelReleaseCuFoilCoreLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseCCLGlassFiberClothRefertoP.47WorldClassQualityCONFIDENTIALUnimicron7MechanicalDrillLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseMechanicalDrillRefertoP.48WorldClassQualityCONFIDENTIALUnimicron8PanelPlating-PretreatmentLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseDesmearElectrolessCopperPlatingPretreatmentElectrolyticCopperPlatingRefertoP.49WorldClassQualityCONFIDENTIALUnimicron9PlatingCuPanelPlatingLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseCufoilElectrolessCuElectrolessCopperPlatingPretreatmentElectrolyticCopperPlatingRefertoP.49WorldClassQualityCONFIDENTIALUnimicron10Lithography–PretreatmentMicroroughnessLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleasePretreatmentD/FLaminateExposuringStrippingEtchingDevelopingWorldClassQualityCONFIDENTIALUnimicron11Lithography–DryfilmlaminatePhotoResistLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleasePretreatmentD/FLaminateExposuringStrippingEtchingDevelopingTracePitchDryfilmtype60/60Thicker50/50Medium40/40ThinnerRefertoP.50WorldClassQualityCONFIDENTIALUnimicron12Lithography–MaskcoveredMaskLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseMaskPretreatmentD/FLaminateExposuringStrippingEtchingDevelopingWorldClassQualityCONFIDENTIALUnimicron13Lithography–ExposureUVLightLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleasePretreatmentD/FLaminateExposuringStrippingEtchingDevelopingWorldClassQualityCONFIDENTIALUnimicron14Lithography–DevelopingCuredPhotoresistLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleasePretreatmentD/FLaminateExposuringStrippingEtchingDevelopingWorldClassQualityCONFIDENTIALUnimicron15Lithography–EtchingLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseSpace(Etched)PretreatmentD/FLaminateExposuringStrippingEtchingDevelopingWorldClassQualityCONFIDENTIALUnimicron16Lithography–StrippingCapturepadBondfinger&traceSolderballpadLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleasePretreatmentD/FLaminateExposuringStrippingEtchingDevelopingRefertoP.51WorldClassQualityCONFIDENTIALUnimicron17LithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseIlluminationIlluminationReflectionCCDCameraAOI–AutoOpticalInspectionRefertoP.52WorldClassQualityCONFIDENTIALUnimicron18AOI–AutoOpticalInspectionLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseShortOpenScratchVoidProtrusionWorldClassQualityCONFIDENTIALUnimicron19Soldermask–Pretreatment(MECEtch)LithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleaseCZSolutionCZSolutionPretreatmentDevelopingExposuringS/MPrintingPrecureRefertoP.53WorldClassQualityCONFIDENTIALUnimicron20Soldermask-PrintingSoldermaskLithographyAOISolderMaskPanelPlatingMechanicalDrillElectrolyticNi/AuPlatingFinalVisualInspection&FQCRoutingPanelReleasePretreatmentDevelopingExposuringS/MPrintingPrecureWorldClassQual