金相技术在电子装联领域的应用

BUEHLER10002000SEM1Leica112SnPbPbSnSnPbPbPb3Pb4BGAFLIPCHIP2SnPb2500:13Pb1000:134BGAFLIPCHIPIMCIMCIMC2PCBHASLPCBIMCOSPHASLSnCuCu6Sn5OSPCuHASLCu6Sn5OSPCuHASLPCBOSPNi/AuHASLIMC15PCBHASL1000:146PCBOSP1000:17PCBNi/Au1000:11PCBIMC1.21.60.91.62.21.10.91.31.30.90.6Ni/AuCu6Sn51.21.11.61.61.30.91.20.61.61.20.9OSPCu6Sn51.60.91.91.51.22.01.22.21.91.61.9HASLIMC10987654321IMC(μm)3afillet(void)58Al910b6IMC1-2um11200:1121000:17131000:14PCBPCB14PCBPCBlackofplatingashensionfinalplatingfaultsprimaryplatingvoidfibreproreusionaverageplatingthicknesslaminatevoidplatingvoidnodulewickingkneecrackpoorconnectionwithresinsmear14PCB81550:15Leica1662000BGABGA9BGA222()17BGA()18(x500)()107198IMCIMC201000:11121.EDAXIMCNi3Sn4CuIMCIMCPCBSAM1213