IPC-EIA-J-STD-003B(印制板可焊性试验)

J-STD-003B3rdWorkingDraftFebruary20041IPC/EIAJ-STD-003BSolderabilityTestsforPrintedBoards3rdWorkingDraftFebruary2004J-STD-003B3rdWorkingDraftFebruary200421GENERAL1.1ScopeThisstandardprescribestestmethods,defectdefinitionsandillustrationsforassessingthesolderabilityofprintedboardsurfaceconductors,attachmentlands,andplated-throughholes.Thisstandardisintendedforusebybothvendoranduser.1.2PurposeThesolderabilitydeterminationismadetoverifythattheprintedboardfabricationprocessesandsubsequentstoragehavehadnoadverseeffectonthesolderabilityofthoseportionsoftheprintedboardintendedtobesoldered.Thisisdeterminedbyevaluationofthesolderabilityspecimenportionofaboardorrepresentativecouponwhichhasbeenprocessedaspartofthepanelofboardsandsubsequentlyremovedfortestingperthemethodselected.1.3ObjectiveTheobjectiveofthesolderabilitytestmethodsdescribedinthisstandardistodeterminetheabilityofprintedboardsurfaceconductors,attachmentlands,andplated-throughholestoweteasilywithsolderandtowithstandtherigorsoftheprintedboardassemblyprocesses.1.4PerformanceClassesThreegeneralclasseshavebeenestablishedtoreflectprogressiveincreasesinsophistication,functionalperformancerequirementsandtesting/inspectionfrequency.Itshouldberecognizedthattheremaybeanoverlapofequipmentcategoriesindifferentclasses.Theuserhastheresponsibilitytospecifyinthecontractorpurchaseordertheperformanceclassrequiredforeachproductandshallindicateanyexceptionstospecificparameters,whereappropriate.Class1–GeneralElectronicProductsIncludesconsumerproducts,somecomputerandcomputerperipheralssuitableforapplicationswherecosmeticimperfectionsarenotimportantandthemajorrequirementisfunctionofthecompletedprintedboard.Class2–DedicatedServiceElectronicProductsIncludescommunicationsequipment,sophisticatedbusinessmachines,instrumentswherehighperformanceandextendedlifeisrequiredandforwhichuninterruptedserviceisdesiredbutnotcritical.Certaincosmeticimperfectionsareallowed.Class3–HighPerformanceElectronicProductsIncludestheequipmentandproductswherecontinuedperformanceorperformanceondemandiscritical.Equipmentdowntimecannotbetoleratedandmustfunctionwhenrequiredsuchasinlifesupportitemsorflightcontrolsystems.Printedboardsinthisclassaresuitableforapplicationswherehighlevelsofassurancearerequiredandserviceisessential.1.5MethodClassificationThisstandarddescribestestmethodsbywhichboththesurfaceconductors(andattachmentlands)andplated-throughholesmaybeevaluatedforsolderability.Unlessotherwiseagreeduponbetweenvendoranduser,TestAorTestCistobeusedforeachapplicationofthisstandard.Provisionsaremadeforthisdeterminationtobeperformedatthetimeofmanufacture,atthereceiptoftheboardsbytheuser,orjustpriortoassemblyandsoldering.Userandvendorshallagreetotheappropriatemethodtobeusedandtheircorrelation.Standarddwelltimesaredefinedinsomeofthemethodscalledoutinthisstandard.Variationsinboardheatcapacitymaynecessitatetheuseoflongersolderdwelltimes(see6.3.)Anychangeinsolderdwellshallbeagreeduponbyuserandvendor.1.5.1TestswithEstablishedAccept/RejectCriteriaTestA–EdgeDipTestForsurfaceconductorsandattachmentlandsonly.TestB–RotaryDipTestForplated-throughholes,surfaceconductorsandattachmentlands,soldersourceside.TestC–SolderFloatTestForplated-throughholes,surfaceconductorsandattachmentlands,soldersourceside.TestD–WaveSolderTestForplated-throughholes,surfaceconductorsandattachmentlands,soldersourceside.TestE–SurfaceMountSimulationTestForsurfaceconductorsandattachmentlands.1.5.2Test(s)WithoutEstablishedAccept/RejectCriteriaTestF–WettingBalanceTestForplated-throughholes,surfaceconductorsandattachmentlands.Pleaseforwardalltestdatageneratedusingthesetestmethods,includingtypeofboardtested(suchasType2or12layer,Type3),dimensionsofcoupontested,andanypretreatment,to:J-STD-003B3rdWorkingDraftFebruary20043IPCAttn.J-STD-003StaffLiaison2215SandersRoadNorthbrook,IL60062-61361.5.3Test(s)MethodologiesUnderCommitteeReviewTheJ-STD-003committeehasundertaken,characterized,andreviewedtheuseoftheSequentialElectrochemicalReductionAnalysis(SERA®)methodologyforsolderabilitytesting.Thecommittee’scurrentpositionisthatSERA®testmethodshouldresidewithintheIPC-TM-650manualuntiladditionalsolderabilitytestinformationisgenerated.Pleaseforwardalltestdataforcommitteereviewto:IPCAttn.J-STD-003StaffLiaison2215SandersRoadNorthbrook,IL60062-61361.6TestMethodSelectionForappropriatetestselectionreferto1.5andTables1-1and1-2.Thetestselectionshouldconsiderthefinalsolderingprocesssothattheresultsofthetestwillbestrepresentthatprocess.1.7TestSpecimenRequirementsThetestspecimenshallbearepresentativecoupon,aportionoftheprintedboardbeingtested,orawholeboardifwithinsizelimits,suchthatanimmersiondepthdefinedintheindividualmethodispossible.Thetestspecimenshallberepresentativeofthelotbeingtested.Whenthistestspecimenistobeusedasacriterionformaterialacceptance,thenumberoftestspecimensshallbedefinedbyagreementbetweentheuserandvendor.Testcouponsthatmaybeusedforrigidboardsurfacesolderabilityandplated-throughholesolderabilityaredetailedintheparagraphsectionsundertheindividualtestmethods.Similar