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(,710065)(DSC),CYD128/DMP-30,2070min;,5012MPa,315GPa,15617MPa,1510kJm-2,(Tg)96CYD128/DMP-30,95418MPa,105714MPa;;;DMP-30StudyonAHighPerformanceEpoxyResinCuringSystemNINGBaojiang(TheNorthwestChinaResearchInstituteofElectronicEquipment,Xian710065)ABSTRACTThecuringreactionofCYD128/DMP-30systemwascharacterizedusinggelatinizationtestanddifferentialscan2ningcalorimetry(DSC)analysisinthisresearch,wherethegelatinizationtimeis70minat20.Themechanicalpropertiesandheatresistanceofcastingplasticweretestedandresultsareasfollowed,flexuralstrength156.7MPa,impactstrength15.0kJm-2,andglasstransitiontemperature96.ThepropertiesofcontinuousfiberreinforcedCYD128/DMP-30compositeswerestudied,andtheflexuralstrengthofcontinuousglassfiberreinforcedcompositesis954.8MPa.Theflexuralstrengthofcontinuouscarbonfiberreinforcedmatrixis1057.4MPa1KEYWORDSEpoxyresin;Moderatetemperaturecuring;Composites;DMP-301,[1-4],[5-10],,,CYD128/DMP-30,DMP-30[4,5,6],,CYD128/DMP-302211CYD128,0151,;2,4,6-()(DMP-30),,;E-,012mm,;S-,400g/m2,;T700S-,200g/m2,212:CYD12850,DMP-305phr,,50,50502h,,:E-,,502h,,,80;CYD128/DMP-30/S-CYD128/DMP-30/T700S-,502h,80213,2080,DSC:TA1INSTRUMENT440No14200812FIBERCOMPOSITESDec1,2008©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(MDSC)10/min,15/min,20/min,DSC,Ti,Tp,Tf02001GB/T2568-1995;830011GB/T2657-1995;XCJ-40GB/T1041-92;(HDT)GB1634-79TgTA1INSTRUMENT2910MDSC15/min,200830011GB3354-82;1GB3357-823311CYD128/DMP-30,204060801CYD128/DMP-30,2070min,401CYD128/DMP-30-312DSCDSC1DSC,CYD128/DMP-30,80,50/2h+80/2h1CYD128/DMP-30DSC/minTiTpTf1091116138159512114120104122140313250/2h,80/2h2(f)HDT,,10h15617MPa,10h,;HDT,92,CYD128/DMP-3050/2h+80/10h2/MPa5012HDT/88/GPa315Tg/96/MPa12616/kJm-215102fHDT314CYD128/DMP-30,3E-(f)(s),(Vf)30%3,f35515MPa,s80/8h3718MPaCYD128/DMP-30/S-CYD128/DMP-30/T700S-,Vf60%,52%4CYD128/DMP-30/S-fs4:41©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(1)CYD128/DMP-30,,,,(2)CYD128/DMP-3050/2h+80/10h,6613MPa,315GPa,15617MPa,Tg96(3)CYD128/DMP-30/S-95418MPa,5519MPa;CYD128/DMP-30/T700S-105714MPa,6617MPa[1],,,1[J]1,2008,25(1):32-341[2],,1[J]1,2003,20(1):18-191[3],,1TDE-85[J]1,2007,24(3):6-81[4]1[J]1,2007,24(4):15-161[5],1[J]1,1997,14(1):7-101[6],1[J]1,1999,27(11):29-301[7]JiaoPingYang,GuoYang1CryogenicmechanicalbehaviorsofMMT/e2poxynanocomposites[J]1CompositesScienceandTechnology,2007,64(14):2934-29401[8],,,1[J]1,2004,21(3):6-81[9],,1[J]1/,2004,(4):50-531[10],,,1[J]1/,2004,(3):27-291[11]KeisukeChino,KazuoSuga1Novelrapid-cureadhesivesforlowtem2peratureusingthiiranecompound[J]1JournalofAppliedPolymerSci2ence,2001,82(12):2953-29571[12]JAmpudia,ELarrauri1Thermalscanningrheometricanalysisofcuringkineticofanepoxyresin1I1Ananhydrideascuringagent[J]1JournalofAppliedPolymerScience,1999,71(8):1239-12451[13]WRLockwood1Areliableandeasilysectionedepoxyembeddingmedium[J]1TheAnatomicalRecord,1964,150(2):129-1391422008©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.