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毕业设计说明书基于单片机的果园环境温度检测报警系统设计专业自动化学生姓名班级学号指导教师完成日期2013年6月5日基于单片机的果园环境温度检测报警系统设计毕业设计说明书（毕业论文）独创性声明本人声明所呈交的毕业设计说明书(毕业论文)是本人在导师指导下进行的研究、设计工作后独立完成的。除了文中特别加以标注和致谢的地方外，说明书中不包含其他人己经发表或撰写过的研究成果。对本文的研究所做贡献集体和个人，均己在说明书中作了明确的说明并表示谢意。本人完全意识到本声明的法律后果由本人承担。毕业设计说明书（毕业论文）作者签名(手写):日期:年月日指导教师签名(手写):日期:年月日盐城工学院本科生毕业设计说明书(2013)基于单片机的果园环境温度检测报警系统设计摘要：温度是人们在农业生产中经常需要测量和控制的一个量，而基于单片机的果园环境温度测量和报警系统使得温度测量与报警更加的直观、准确，它具有使用方便、性能可靠的优点。主要讨论了在果园的环境下的温度测量及报警的处理方法和系统构成。基于数字传感器DS18B20的性能特点，利用单片机和简单的接口电路组成一个温度测量及报警系统，通过键盘和LED显示数码管对温度进行显示和对温度报警上下限进行设置。给出了相关的应用电路和软件程序。该系统的温度的测量范围在－55℃-+100℃之间，它的测量的精度为0.1℃。这个系统完全满足了果园的温度测量及报警需求。随着单片机技术和半导体技术的发展，这种智能化的温度测量及报警技术将会慢慢取代传统的温度测量技术，使得温度测量技术朝着更加智能化和自动化的方向发展。关键字：果园环境；单片机；温度传感器DS18B20；温度测量及报警基于单片机的果园环境温度检测报警系统设计TheDesignofBasedonSingle-chipOrchardAmbientTemperatureDetectionandAlarmSystemAbstract:Temperatureisthatpeopleinagriculturalproductionoftenneedtomeasureandcontrolanamount,andmicrocontroller-basedorchardambienttemperaturemeasurementandtemperaturemeasurementalarmandalarmsystemmakesmoreintuitive,accurate,anditiseasytouse,reliableperformanceadvantages.mainlydiscussestheorchardenvironmenttemperaturemeasurementandalarmprocessingmethodandsystemconfiguration.BasedontheperformancecharacteristicsofdigitalsensorDS18B20,usingSCMandsimpleinterfacecircuitatemperaturemeasurementandalarmsystem,throughthekeyboardandLEDdisplaydigitaltemperaturedisplayandtemperaturealarmlimitsettings.Theregivestherelevantapplicationcircuitandsoftwareprograms.Thesystemtemperaturemeasuringrange-55℃-+100℃between,itsmeasurementaccuracyof0.1℃.Thesystemfullymeetstheorchardtemperaturemeasurementandalarmrequirements.Withchiptechnologyanddevelopmentofsemiconductortechnology,thisintelligenttemperaturemeasurementandalarmtechnologywillgraduallyreplacethetraditionaltemperaturemeasurementtechnology,makingthetemperaturemeasurementandautomationtechnologytowardsmoreintelligentdirection.KeyWords:Orchardenvironment；Microcontroller；TemperaturesensorDS18B20；Temperaturemeasurementandalarm盐城工学院本科生毕业设计说明书(2013)目录1课题概述..............................................................................................................................11.1课题背景和意义............................................................................................................11.2课题研究的内容及要求................................................................................................12整体方案的论证与设计......................................................................................................32.1系统的基本设计思想....................................................................................................32.2系统模块结构论证........................................................................................................33系统硬件设计......................................................................................................................53.1单片机STC89C52.........................................................................................................53.2温度传感器....................................................................................................................63.3系统概述........................................................................................................................83.4模块化系统设计............................................................................................................94软件设计............................................................................................................................144.1程序设计流程..............................................................................................................144.2程序编写......................................................................................................................175硬件调试............................................................................................................................185.1静态检查......................................................................................................................185.2通电检查......................................................................................................................185.3软件调试及软硬件联调..............................................................................................185.4硬件实物图..................................................................................................................186结束语................................................................................................................................19参考文献................................................................................................................................20致谢....................................................................................................................................21附录....................................................................................................................................22附录1：程序清单.............................................................................................................22附录2：电路原理图.................