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173Vo1.17.No.320079JournalofHunanInstituteofEngineeringSept.2007:2007-04-02:(1979-),,,:.CSP1,2(1.,411101;2.,014010):CSP,.,,.CSP.:CSP;;:TG331:A:1671-119X(2007)03-0022-03CSP..CSP,,,,.CSP.CSP,,100m.1050s,900830650..CSP,,.,,.1,.:(1);(2),;(3);(4);(5).1.1[1]:ýks(ýTs)+qs=sCps(9Ts9t)(1):Ts,qs,ks,s,Cps,kssCps.,S.Yue[2]Ce,Browne[3].1.2CSP.,.[4],,,.,..,.,.1.2.1,.-:qr=A(T4s-T4)(2),-,,,A,TsT.:qc=hcA(Ts-T(3),hc.,,:h=hc+(T4s-T4)Ts-T(4)[5],(4)(5):=111+Ts1000(01125Ts1000-0138)(5)1.2.2,:;,,,,..,,.,,..,:h=qTs-Tl=ql-sF+qv-s(1-F)Ts-Tt(6),ql-s,qv-s,F,Ts,Tl.2CSP,,.,..,,[6]...,(C)(L0).()C,Ce=C+L0[6]).,:L0=L/(Tstart-Tend)(7):Tstart,Tend.3,2915mm1500mmCSP,13.2CSiMnPSAl0.200.190.390.0160.0050.0161212.5,0.3m3/min0.35m3/min0.417m3/min0.45m3/min0.5m3/min.12,.,10m.,.,,,.,.,.,323:CSP,,.,,.,.,,,.,CSP.,,,3.3,:y=-0.4167x3+4.4286x2-20.726x+711(8):y(),x(m3/min).,,,,.,0.3m3/min0.5m3/min,694656.4(1)CSP,.,.(2)CSP,.(3),(,,)..[1],,,.CSP[J].,2003,38(8):39.[2]PurcellA,YueS.SmartcalibrationModuleforPredic2tingTemperatureDuringHotRolling[J].I&SM,2000,(2):49-54.[3]BrowneKM.RecentAdvantagesinHeatTransferandMicrostructureModelingforMetalProcessing[J].MD,ASME,1995,67:105-115.[4]E.Fried.ThermalConductionContributiontoHeatTransferatContacts[J].ThermalConductivity,1969,(2).[5]F.Seredinski.PredictionofPlateCoolingDuringRolling-MillOperation[J].JournalofIronSteelInstitute,1973,211:197-203.[6],,,.[J].,2001,50(7):1-2.InfluenceofWaterDischargeDensityonCSPLaminarCoolingLIDong-feng1,CAOJian-gang2(1.Dept.ofMech.Eng.,HunanInstituteofEngineering,Xiangtan411101,China;2.CollegeofMaterialScience&Engineering,InnerMongoliaUniversityofScienceandTechnology,Baotou014010,China)Abstract:TheeffectsofheattransferintheCSPlaminarcoolingareanalyzed.Accordingly,atwo2dimensionalmathematicalmodelofheattransferisproposed.Theheattransfercoefficientmodelsaredeterminedaccordingtovariousboundaryconditions.Intheend,theinfluenceofwaterdischargedensityonCSPlaminarcoolingisstud2ied.Keywords:CSP;laminarcooling;numericalsimulation422007