JIS Z3198-7-2003 英文版 无铅焊剂的试验方法.第7部分芯片产品的焊料切割检测方法

JISJAPANESEINDUSTRIALSTANDARDTranslatedandPublishedbyJapaneseStandardsAssociationTestmethodsforlead-freesolders-Part7:MethodsforshearstrengthofsolderjointsonchipcomponentsICs25.160.50Referencenumber:JISZ3198-7:2003(E)PROTECTEDBYCOPYRIGHT5sCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:25:55MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-7:2003ForewordThistranslationhasbeenmadebasedontheoriginalJapaneseIndustrialStandardestablishedbytheMinisterofEconomy,TradeandIndustrythroughdeliberationsattheJapaneseIndustrialStandardsCommitteeaccordingtotheproposalofestablishingaJapaneseIndustrialStandardfromTheJapanWeldingEngineeringSociety(JWES),withadraftofIndustrialStandardbasedontheprovisionofArticle12Clause1oftheIndustrialStandardizationLaw.SolderingiscalledHANDAZUKE(Japanese),atechniquetobeusedformountingelectronicandelectricalmachineryandapparatus,communicationequipmentandthelikeanditsusefieldiswideandexpectationforhighreliabilityoftheconnectionislarge.ThoughtherearestandardsinsideandoutsideJapanaswellasInternationalStandardslikeIECorISO,thisStandardusesresultsofstandardizationoftestmethodsandthelikenecessaryforsolderconnectioncorrespondingtothereductionofanenvironmentalloadbasedontheresearchanddevelopmentbycontractofNewEnergyandIndustrialTechnologyDevelopmentOrganization.ThisStandardconcernsthemethodsforshearstrengthofsolderjointsonchipcompo-nentsoflead-freesolderswhichareenvironmentallyfriendlyandispositionedasastan-dardforconsideringenvironment.AttentionisdrawntothepossibilitythatsomepartsofthisStandardmayconflictwithapatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavetechnicalproperties.TherelevantMinisterandtheJapaneseIndustrialStandardsCommitteearenotresponsibleforidentifyingthepatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavethesaidtechnicalproperties.JISZ3198includesthefollowing7partswiththegeneraltitleTestmethodsforEead-freesoldersPart1:MethodsformeasuringofmeltingtemperaturerangesPart2:Methodsfortestingofmechanicalcharacteristics-tensizetestPart3:MethodsforspreadtestPart4:MethodsforsolderabilitytestbyawettingbalancemethodandacontactanglePart5:MethodsfortensiletestsandsheartestsonsolderjointsPart6:Methodsfor45puEltestofsolderjointsonQFPleadPart7:MethodsforshearstrengthofsolderjointsonchipcomponentsmethodDateofEstablishment:2003-06-20DateofPublicNoticeinOfficialGazette:2003-06-20Investigatedby:JapaneseIndustrialStandardsCommitteeStandardsBoardTechnicalCommitteeonWeldingJISZ3198-7:2003,FirstEnglisheditionpublishedin2003-12Translatedandpublishedby:JapaneseStandardsAssociation4-1-24,Akasaka,Minato-ku,Tokyo,107-8440JAPANIntheeventofanydoubtsarisingastothecontents,theoriginalJISistobethefinalauthority.OJSA2003Allrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromthepublisher.PrintedinJapanPROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:25:55MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---23198-7:2003ContentsPageIntroduction.................................................................................................................Scope....................................................................................................................Normativereferences........................................................................................Definitions..........................................................................................................Testpiece............................................................................................................Testmethod........................................................................................................Methodforobtainingmeasuredvalue...........................................................Recordingoftestresults..................................................................................(iPROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:25:55MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---JAPANESEINDUSTRIALSTANDARDJISZ3198-7:2003Testmethodsforlead-freesolders-Part7:MethodsforshearstrengthofsolderjointsonchipcomponentsIntroductionThisJapaneseIndustrialStandardspecifiesthetestmethodsforshearstrengthofsolderjointsonchipcomponentsbylead-freesolderbasedonoccupa-tionalresultsbycontractofNewEnergyan