JIS Z3198-6-2003 英文版 无铅焊剂的试验方法.第6部分QFP 铅焊点 45°拉伸试验

JISJAPANESE1NDUSTRIALSTANDARDTranslatedandPublishedbyJapaneseStandardsAssociationTestmethodsforlead-freesolders-Part6:Methodsfor45'pulltestofsolderjointsonQFPleadICs25.160.50Referencenumber:JISZ3198-6:2003(E)PROTECTEDBYCOPYRIGHT5sCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:28:05MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---23198-6:2003ForewordThistranslationhasbeenmadebasedontheoriginalJapaneseIndustrialStandardestablishedbytheMinisterofEconomy,TradeandIndustrythroughdeliberationsattheJapaneseIndustrialStandardsCommitteeaccordingtotheproposalofestablishingaJapaneseIndustrialStandardfromTheJapanWeldingEngineeringSociety(JWES),withadraftofIndustrialStandardbasedontheprovisionofArticle12Clause1oftheIndustrialStandardizationLaw.SolderingiscalledHANDAZUKE(Japanese),atechniquetobeusedformountingelectronicandelectricalmachineryandapparatus,communicationequipmentandthelikeanditsusefieldiswideandexpectationforhighreliabilityoftheconnectionislarge.ThoughtherearestandardsinsideandoutsideJapanaswellasInternationalStandardslikeIECorISO,thisStandardusesresultsof“standardizationoftestmethodsandthelikenecessaryforsolderconnectioncorrespondingtothereductionofanenvironmentalload”basedontheresearchanddevelopmentbycontractofNewEnergyandIndustrialTechnologyDevelopmentOrganization.ThisStandardconcernsthemethodsfor45”pulltestofsolderjointsonQFPleadoflead-freesolderswhichareenvironmentallyfriendlyandispositionedasastandardforconsideringenvironment.AttentionisdrawntothepossibilitythatsomepartsofthisStandardmayconflictwithapatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavetechnicalproperties.TherelevantMinisterandtheJapaneseIndustrialStandardsCommitteearenotresponsibleforidentifyingthepatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavethesaidtechnicalproperties.JISZ3198includesthefollowing7partswiththegeneraltitleTestmethodsforlead-freesoldersPart1:MethodsformeasuringofmeltingtemperaturerangesPart2:Methodsfortestingofmechanicalcharacteristics-tensiletestPart3:MethodsforspreadtestPart4:MethodsforsolderabilitytestbyawettingbalancemethodandacontactanglePart5:MethodsfortensiletestsandsheartestsonsolderjointsPart6:Methodsfor45opulltestofsolderjointsonQFPleadPart7:MethodsforshearstrengthofsolderjointsonchipcomponentsmethodDateofEstablishment:2003-06-20DateofPublicNoticeinOfficialGazette:2003-06-20Investigatedby:JapaneseIndustrialStandardsCommitteeStandardsBoardTechnicalCommitteeonWeldingJISZ3198-6:2003,FirstEnglisheditionpublishedin2003-12Translatedandpublishedby:JapaneseStandardsAssociation4-1-24,Akasaka,Minato-ku,Tokyo,107-8440JAPANIntheeventofanydoubtsarisingastothecontents,theoriginalJISistobethefinalauthority.OJCA2003Allrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromthepublisher.PrintedinJapanPROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:28:05MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-6:2003ContentsPageIntroduction.................................................................................................................Scope....................................................................................................................Normativereferences........................................................................................Definitions..........................................................................................................Outlineoftest....................................................................................................Testpiece............................................................................................................Testmethod........................................................................................................Methodforobtainingofmeasuredvalue......................................................Recordingoftestresults..................................................................................PROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:28:05MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---JAPANESEINDUSTRIALSTANDARDJIS23198-6:2003Testmethodsforlead-freesolders-Part6:Methodsfor45”pulltestofsolderjointsonQFPleadIntroductionThisJapaneseIndustrialStandardspecifiesthemethodsfor45”pulltestofsolderjointsonQFPlea