JIS Z3198-1-2003 英文版 无铅焊剂的试验方法.第1部分熔化温度范围的测量方法

ISJAPANESEINDUSTRIALSTANDARDTranslatedandPublishedbyJapaneseStandardsAssociationJISZ3198-1:2003Testmethodsforlead-freesolders-Part1:Methodsformeasuringofmeltingtemperatureranges~~ICs25.160.50Referencenumber:JISZ3198-1:2003(E)PROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:29:35MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---Z3198-1:2003ForewordThistranslationhasbeenmadebasedontheoriginalJapaneseIndustrialStandardestablishedbytheMinisterofEconomy,TradeandIndustrythroughdeliberationsattheJapaneseIndustrialStandardsCommitteeaccordingtotheproposalofestablishingaJapaneseIndustrialStandardfromTheJapanWeldingEngineeringSociety(JWES),withadraft,ofIndustrialStandardbasedontheprovisionofArticle12Clause1oftheIndustrialStandardizationLaw.SolderingiscalledHANDAZUKE(Japanese),atechniquetobeusedformountingelectronicandelectricalmachineryandapparatus,communicationequipmentandthelikeanditsusefieldiswideandexpectationforhighreliabilityoftheconnectionislarge.ThoughtherearestandardsinsideandoutsideJapanaswellasInternationalStandardslikeIECorISO,thisStandardusesresultsof?standardizationoftestmethodsandthelikenecessaryforsolderconnectioncorrespondingtothereductionofanenvironmentalload?basedontheresearchanddevelopmentbycontractofNewEnergyandIndustrialTechnologyDevelopmentOrganization.ThisStandardconcernsthemethodsformeasuringameltingtemperaturerangeoflead-freesolderswhichareenvironmentallyfriendlyandispositionedasastandardforconsideringenvironment.AttentionisdrawntothepossibilitythatsomepartsofthisStandardmayconflictwithapatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavetechnicalproperties.TherelevantMinisterandtheJapaneseIndustrialStandardsCommitteearenotresponsibleforidentifyingthepatentright,applicationforapatentafteropeningtothepublic,utilitymodelrightorapplicationforregistrationofutilitymodelafteropeningtothepublicwhichhavethesaidtechnicalproperties.JISZ3198includesthefollowing7partswiththegeneraltitleTestmethodsforlead-freesoldersPart1:MethodsformeasuringofmeltingtemperaturerangesPart2:Methodsfortestingofmechanicalcharacteristics-tensiletestPart3:MethodsforspreadtestPart4:MethodsforsolderabilitytestbyawettingbalancemethodandacontactanglePart5:MethodsfortensiletestsandsheartestsonsolderjointsPart6:Methodsfor45?pulltestofsolderjointsonQFPleadPart7:MethodsforshearstrengthofsolderjointsonchipcomponentsmethodDateofEstablishment:2003-06-20DateofPublicNoticeinOfficialGazette:2003-06-20Investigatedby:JapaneseIndustrialStandardsCommitteeStandardsBoardTechnicalCommitteeonWeldingTISZ3198-1:2003,FirstEnglisheditionpublishedin2003-12Translatedandpublishedby:JapaneseStandardsAssociation4-1-24,Akasaka,Minato-ku,Tokyo,107-8440JAPANIntheeventofanydoubtsarisingastothecontents,theoriginalJISistobethefinalauthority.OJSA2003Allrightsreserved.Unlessotherwisespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromthepublisher.PrintedinJapanPROTECTEDBYCOPYRIGHTCopyrightJapaneseStandardsAssociationProvidedbyIHSunderlicensewithJSALicensee=HongKongPolytechnicUniv/9976803100NotforResale,08/01/200904:29:35MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--```,`,,`,,,````,,,```,,``,`-`-`,,`,,`,`,,`---23198-1:2003ContentsPageIntroduction.................................................................................................................1Scope....................................................................................................................2Normativereferences........................................................................................3Definitions..........................................................................................................4Summaryoftest................................................................................................5Fusionstarttemperature.................................................................................5.1Testmethod......................................................................................................5.2Apparatusandequipment..............................................................................5.2.1DSCapparatusandDTAapparatus..........................................................5.2.2Appliance.........................................................................................................5.35.45.55.65.766.16.26.36.46.5Calibrationoftemperature............................................................................Sample...............................................................................................................Procedure..........................................................................................................Me