TF-LGA Reliability Evaluation_IM可靠度评估

http://www.materialsnet.com.tw901169109TFLGA******(ChipScalePackage)(Flex)TFLGA(ThinFineLandGridArray)(TapeCarrierPackage)50µmPitchTFLGATFBGA(0.5mm)(Board-Level)(PCB)(DieAttachAdhesive)(SolderLand)TFLGASMD(Lead)(SolderBall)CTETFLGA(TapeCarrierPackage)(ThinFinepitchLandGridArray;TFLGA)(ChipScalePackage;CSP)(Board-LevelReliability)(FlexSubstrate)(SolderLand)(ThermalStress)(AcceleratedTemperatureTest;ATC)(FatigueLife)ICJEDECEIAJ(Fail-Mechanism-Driven)110169901http://www.materialsnet.com.twPCB(GridArray)PCB(SurfaceMountTe-chnology)LGA(LandGridArray)PCBFlexTFLGA-144LCSP0.4mm0.8mm12×121.0mmFlexTFLGA-144LPCBPCBLGAPCBPCBLGAPCBPCB1.6mm1.0mm0.6mm18µm(Mass=152g/m2)36µm20~80%TFLGA-144L(Die)(Su-bstrate)(GoldWire)(DieAttach)(MoldingCompound)FlexTFLGA-144Lhttp://www.materialsnet.com.tw901169111(Conduction)(Convection)TFLGATFLGATFLGAPCBTFLGA-144L2PCB(b)(c)PCB1.6mm0.6mmTFLGA-144L5~30%4PCB20%80%25~45%TFLGA-144L0.1mm0.05mmTFLGA-144L(a)2PCB(b)4PCB(c)6PCBTFLGA-144L(θJA)(1.6mmPCBThickness)TFLGA-144L(θJA)(0.6mmPCBThickness)CopperFoils20%30%40%50%80%2PCB74.2665.9060.5256.6849.584PCB46.4940.2536.5834.1229.93CopperFoils20%30%40%50%80%2PCB73.73/74.5067.04/67.6962.77/63.3559.74/60.2754.17/54.614PCB50.28/50.5644.50/44.7041.05/41.2238.72/38.8734.69/34.79CopperFoilCopperFoilCopperFoil18µm18µm18µm18µm18µm18µm18µm18µm35µm35µm35µm35µm35µm35µm35µm35µm18µm35µm35µm35µm35µm18µm35µm35µm1.6mm1.0mm0.6mm1.6mm1.0mm0.6mm1.6mm1.0mm0.6mm0.25mm0.25mm0.15mm0.15mm0.15mm0.2mm0.4mm0.2mm0.4mm0.2mm0.15mm0.15mm0.2mm0.15mm0.2mm0.1mm0.1mm0.1mm0.1mm0.1mm0.15mm1.0mm0.6mm0.2mm18µm18µm18µm18µm18µm35µm35µm35µm35µm18µm18µm18µm(a)(b)(c)IC(GridArray)(CSP)CTE(SolderJoint)CTEIC(Yield)ICCTESilicon(2.5ppm/˚C)PCBCTEWafer-Level112169901http://www.materialsnet.com.twCSPCTE3ppm/˚C5ppm/˚CLaminate-basedCSPCTE10ppm/˚C15ppm/˚CPrimavera(Primavera,2000)(FlexCarrier,CeramicCarrierandLaminateCarrier)144I/O0.8mmPitchCSP(12-mmSquare)(6.5mmSquareDie)200100˚CATCLaminateFlexLaminate10Ceramic100PCBFLEXTFLGA-144L(HighTem-peratureStorage)+150(-0,+4)˚C1000TestConditionsDurationThermalShock-55˚Cto+125˚C,MethodA110100cyclesThermalCycling-55˚Cto+125˚C1,000cyclesPressurePot121˚C,100%RH,2atmospheres168hoursHAST(HighlyAccelerated130˚C,85%RH,5.5Vbias96hoursStressTesting)HighTemperatureStorage150˚C1,000hoursMechanicalShock600G,2.5msec,method20026axisSolderabilityJEDEC22-BPhysicalDimensionsJEDEC22-BMarkPermanencyJEDEC2015(a)TFLGA-144L2PCB(b)TFLGA-144L(c)TFLGA-144Lhttp://www.materialsnet.com.tw901169113(Damage)(Crack)+150˚C(a)(b)TFLGA-144LIn-PlanezWarpage±6µm(c)TFLGA-144LVonMises(InService)TFLGA-144LTFLGA-144L2(a)TFLGA-144L(heatingprocess)(b)TFLGA-144L(coolingprocess)(c)TFLGA-144LVonMises(coolingprocess)(a)TFLGA-144L(b)TFLGA-144L(c)TFLGA-144L114169901http://www.materialsnet.com.twPCB=0.1mm0.5mmTambient65˚C(a)ANSYSTFLGA-144LWarpage44.83Mpa/W(b)0.013mm(c)23.77Mpa/W0.1mm(4mil)0.05mm(2mil)1.0mmLGA/CSPFLEXTFLGA-144LCTEPCBFLEXTFLGA-144LCTE(a)(c)FLEXTFLGA-144L(FatigueLife)(Acce-leratedTemperatureCycling)(%)(N)ConditionABCD(˚C,minute)TEMPDurationTEMPDurationTEMPDurationTEMPDuration1-65330-65330-55330Topmin3301cycle2201510~15201510~15201510~15201510~153125330100330100330Topmax3304201510~15201510~15201510~15201510~15http://www.materialsnet.com.tw901169115S-NS-N50%(Nf)(DamageDegree)(Nf)DeviceSample0-100CBetaFEMsizeN50N50beta=4Flex1584056.5390Flex2124344.4387Flex33553007.92161Laminate1624806Laminate22463008.14436Laminate3854987Ceramic301502172(a)TFLGA-144L(b)TFLGA-144L(c)TFLGA-144L(Nff)Nff=Nft∆Tt∆Tf∆Tt∆Tf1.9ffftffft1.3exp14141Tfmax1Tfmax–1Ttmax1Ttmax(2)NffNft∆Tt∆TfftftTtmax(Nff)Nt=Testcycles@N.01=630Nf=FieldCycles=629,277CPD=95YearsFt=48CyclesPerDay(CPD)Ff=90minutespercyc=16CyclesPerDay(CPD)∆Tt=-55Cto+105C=160C∆Tf=+28Cto+34C=6CTmaxt=+105CTmaxf=+34CCoffin-Manson(Nf)Nf=12∆εp2εf1/c(1)∆εp=εf==0.325c==-0.5~-0.7(Nff)116169901http://www.materialsnet.com.tw(Nff)(Nff)TFLGA-144LPCBPCBPCB1.6mm0.6mmTFLGA-144L5~30%WarpagePCBPCBPCBCTETFLGA-144L(SolderJoint)CTETFLGA-144L0.1mm0.05mmCTE60~70%BGA1.EIA/JESD51-3,“LowEffectiveTher-malConductivityTestBoardforLeadedSurfaceMountPackages,”1996.2.EIA/JESD51-7,“HighEffectiveTher-malConductivityTestBoardforLeadedSurfaceMountPackages,”1999.3.EIAJEDR-7316,“DesignGuidelineofIntegratedCircuitsforFine-pitchBallGridArrayandFine-pitchLandGridArray(FBGA/FLGA),”1998.4.EIAJ/ED4702,“MechanicalStressTestMethodsforSemiconductorSurfaceMountingDevices,”1992.5.EIAJ/ED4704,“FailureMechanismDrivenReliabilityTestMethodsforLSIs,”May,2000.6.EIA/JESD34,“Failure-Mechanism-DrivenReliabilityQualificationofSili-conDevices,”Mar.,1993.7.EIA/JESD47,“Stress-Test-DrivenQualificationofIntegratedCircuits,”July,1995.8.EIA/LESD22-B108.“CoplanarityTestforSurface-MountSemiconductorDevices,”Nov.,1991.9.EIA/JESD22-A113-B,“PreconditioningofNonhermeticSurfaceMountDevicesPriortoReliabilityTesting,”Mar.,1999.10.SchuellerR.D.,E.A.BradleyandP.M.Harvey,“MeetingtheCost/Perfor-manceRequirementsofFlex-basedChip-ScalePackages,”3M,Report,2000.11.Lau,J.H.andS.W.,Lee,“ChipScalePackage:Design,Materials,Process,Reliability,andApplication,”McGraw-H