MT47H32M16HR-25EI

DDR2SDRAMMT47H128M4–32Megx4x4banksMT47H64M8–16Megx8x4banksMT47H32M16–8Megx16x4banksFeatures•VDD=1.8V±0.1V,VDDQ=1.8V±0.1V•JEDEC-standard1.8VI/O(SSTL_18-compatible)•Differentialdatastrobe(DQS,DQS#)option•4n-bitprefetcharchitecture•Duplicateoutputstrobe(RDQS)optionforx8•DLLtoalignDQandDQStransitionswithCK•4internalbanksforconcurrentoperation•ProgrammableCASlatency(CL)•PostedCASadditivelatency(AL)•WRITElatency=READlatency-1tCK•Selectableburstlengths:4or8•Adjustabledata-outputdrivestrength•64ms,8192-cyclerefresh•On-dietermination(ODT)•Industrialtemperature(IT)option•Automotivetemperature(AT)option•RoHS-compliant•SupportsJEDECclockjitterspecificationOptions1Marking•Configuration–128Megx4(32Megx4x4banks)128M4–64Megx8(16Megx8x4banks)64M8–32Megx16(8Megx16x4banks)32M16•FBGApackage(Pb-free)–x16–84-ballFBGA(8mmx12.5mm)Rev.F,GHR•FBGApackage(Pb-free)–x4,x8–60-ballFBGA(8mmx10mm)Rev.F,GCF•FBGApackage(leadsolder)–x16–84-ballFBGA(8mmx12.5mm)Rev.F,GHW•FBGApackage(leadsolder)–x4,x8–60-ballFBGA(8mmx10mm)Rev.F,GJN•Timing–cycletime–1.875ns@CL=7(DDR2-1066)-187E–2.5ns@CL=5(DDR2-800)-25E–2.5ns@CL=6(DDR2-800)-25–3.0ns@CL=4(DDR2-667)-3E–3.0ns@CL=5(DDR2-667)-3–3.75ns@CL=4(DDR2-533)-37E•Selfrefresh–StandardNone–Low-powerL•Operatingtemperature–Commercial(0°C≤TC≤+85°C)None–Industrial(–40°C≤TC≤+95°C;–40°C≤TA≤+85°C)IT–Automotive(–40°C≤TC,TA≤+105°C)AT•Revision:F/:GNote:1.Notalloptionslistedcanbecombinedtodefineanofferedproduct.UsethePartCatalogSearchon:09005aef82f1e6e2512MbDDR2.pdf-Rev.T2/12EN1MicronTechnology,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.‹2004MicronTechnology,Inc.Allrightsreserved.ProductsandspecificationsdiscussedhereinaresubjecttochangebyMicronwithoutnotice.Table1:KeyTimingParametersSpeedGradeDataRate(MT/s)tRC(ns)CL=3CL=4CL=5CL=6CL=7-187E400533800800106654-25E400533800800n/a55-25400533667800n/a55-3E400667667n/an/a54-3400533667n/an/a55-37E400533n/an/an/a55Table2:AddressingParameter128Megx464Megx832Megx16Configuration32Megx4x4banks16Megx8x4banks8Megx16x4banksRefreshcount8K8K8KRowaddressA[13:0](16K)A[13:0](16K)A[12:0](8K)BankaddressBA[1:0](4)BA[1:0](4)BA[1:0](4)ColumnaddressA[11,9:0](2K)A[9:0](1K)A[9:0](1K)Figure1:512MbDDR2PartNumbersExamplePartNumber:MT47H128M4HR-25E:GConfiguration128Megx464Megx832Megx16128M464M832M16SpeedGradetCK=3.75ns,CL=4tCK=3ns,CL=5tCK=3ns,CL=4tCK=2.5ns,CL=6tCK=2.5ns,CL=5-37E-3-3E-25-25E-ConfigurationMT47HPackageSpeedRevision:^PackagePb-free84-ball8mmx12.5mmFBGA60-ball8mmx10mmFBGALeadSolder84-ball8mmx12.5mmFBGA60-ball8mmx10mmFBGAHRCFHWJNLowpowerIndustrialtemperatureAutomotivetemperatureLITATRevision:F/:GtCK=1.875ns,CL=7-187ENote:1.Notallspeedsandconfigurationsareavailableinallpackages.512Mb:x4,x8,x16DDR2SDRAMFeaturesPDF:09005aef82f1e6e2512MbDDR2.pdf-Rev.T2/12EN2MicronTechnology,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.‹2004MicronTechnology,Inc.Allrightsreserved.FBGAPartNumberSystemDuetospacelimitations,FBGA-packagedcomponentshaveanabbreviatedpartmarkingthatisdifferentfromthepartnumber.ForaquickconversionofanFBGAcode,seetheFBGAPartMarkingDecoderonMicron’sWebsite::09005aef82f1e6e2512MbDDR2.pdf-Rev.T2/12EN3MicronTechnology,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.‹2004MicronTechnology,Inc.Allrightsreserved.ContentsStateDiagram..................................................................................................................................................9FunctionalDescription...................................................................................................................................10IndustrialTemperature...............................................................................................................................10AutomotiveTemperature............................................................................................................................11GeneralNotes............................................................................................................................................11FunctionalBlockDiagrams.............................................................................................................................12BallAssignmentsandDescriptions.................................................................................................................14Packaging......................................................................................................................................................18PackageDimensions...................................................................................................................................18FBGAPackageCapacitance.........................................................................................................................20ElectricalSpecifications–AbsoluteRatings............................................................