含铜高纯钢中铜的沉淀规律的研究

内蒙古科技大学硕士学位论文含铜高纯钢中铜的沉淀规律的研究姓名：郭凤莲申请学位级别：硕士专业：材料学工程指导教师：刘宗昌;任慧平20070521-1-PHILIPSPW1700XJEM-2010001G.PG.PG.P-CuX55050550-Cu650550G.PG.P-2-StudyonPrecipitation’sLawofCopperduringAgingProcessinCu-containingHighPuritySteelsAbstractHighstrenghthlowalloysteelcontainingCuhasmanyexcellentperformances,i.ehighstrength,hightoughness,wellweldablity,corroderesistanceandsoon,soitiswidelyusedintheautomobileindustry,thestructuralpurposesteelproducts,theheavyengineeringstructure,thehighpressureconduit,thebridge,thehigh-pressurevessel,thecontainers,theships,thechemicalindustryoilequipment,et.Studyonagingstrengtheningbehaviorandtheprecipitation’lawofCuinsteelissignificant.Microhardnessofthesolutionstateandthedifferentstateduringaginghadbeentestedandanalyzedbymicrohardnesstester.Bymeansoftheopticalmicroscope,PHILIPSPW1700X-raydiffractionmeterandJEM-2010transmissionelectronmicroscope,thesolutionstateandthemicrostructureunderthedifferentstateduringagingandthecopperclusterswereobserved.TheinfluenceofdifferentCu-containingquantityonthestructureandhardnesswasstudied.Theprecipitationparticle’stype,appearance,microstructure,size,distribution,volumefraction,nucleationmechanismanditsorientationrelationswiththeparentphasewerestudiedduringagingtreatment.Theprecipitationsequenceduringagingprocessofhighpuritylow-carbonsteelbearingcopperwasresearched.ThestrengthenedmechanismofCuinthesteelwasanalysed.Theresultsshowedthatatthesameagingtemperature,withCu-containingquantityincreasing,agingprocesswasaccelerated,theholdingtimearrivingatagingpeakwasshorterandtheagingpeakhardnesswaslowerduringagingindifferentCu-containingquantity.Aftersolutiontreatment,whentherateofcoolingachievesdefinitevalue,wecanobtainthetiniermassiveferritecrystalgrain.Differentcoppercontent’sspecimen,undersameagingtemperature,microstructuresnothavechangeobviously.Copperisnotdistributedequallyinmatrixaftersolutiontreatment,butexistsasakindoforderingdomain,Cuatomsshowclusterstate,whichmicrostructureeffectsonthefollowingagingbehaviorgreatly.Cu-richclustersinCu–containinghighpuritysteelduringagingwereprecipitatedfirstlyinferritecrystalgrain,Cuatomswereclusteredon(001)αplanes.ItwasalsoshownthattheywereCu-richG.Pzoneparticlesatagingpeak,whoseappearancewaslayeredandroundcake-shaped.Cu-richlayerandCu-poorlayerdistributedalternatelyonCu-richG.Pzoneparticles.TheG.Pzonekepthalf-coherencywithferritematrix.Ahighdensityofdislocationsandfaultswasinvolvedinorabout-3-theCu-richlayersandCu-poorlayersoftheG.Pzone.Attheearlyofover-aging,withCu-richclustersparticlesgrowingupgradually,thenumberofCu-richlayersandCu-poorlayersincreasedintheseclusters,butthethicknessofCu-richlayerdecreased,thedensityofdislocationswasreduced.TherehasnotεCuparticlesprecipitatedatagingpeak.ThenewstructurehasnotfoundbyX-raydiffractionanalysisandhigh-resolutionelectronmicroscopeobservationat550aging50h.Onlyafterlong-timeagingtreatmentat550,orenhancingagingtemperature,ε-Cuparticlescanbeprecipitated.Thefactorsaffectingprecipitatingprocessarethetemperature,coppercontent,vacancy,dislocationandsoon.Thehigheragingtemperaturecanacceleratethediffusionandprecipitatingofcopperinsteel,namelyCu-richparticlesareprecipitatedat650agingthanat550aging.Theimportantreasonforagingstrengtheningofhighpuritysteelcontainingcopperisthedistortion,thehalf-coherencyinterface,thehighdensitydislocationsandfaultsbythecopper-containingG.Pareacausing,anditsinitiatingstressfield.KeyWordshighpuritysteelbearingcopper,solution,agingstrengthening,precipitation,Cu-richclusters,G.Pzone_________________________________________________________-1-CuCuCu-Cu-CuXTEM50361001-2-11.19021[1]1201975()60%[2]NbVTi0.280[3],E.K.Holappa-3-[4]SPONHCIFCSPNHO10010-6SPNHO4010-6[5]CNSPOH207090235ppm40ppm[6]Cu[7]1084PSO1100~12000.35%0.75%[8]1%IF[9~11][12]1%-4-[71314]-Cu[15]CuFe-CuFe-Cu1.21.2.1270(1.1)1.10.1%[16]-5-1.11.2.21%40~50MPa1.4%0.7%Cu[17]0.5%8502.1%850-Cu1%Cu248MPa1.2.3McGrathandBratina[18]1.5mass%CuCuCuCuLeMayCu-6-CuCu1.2.4ε-Cu[19]500600ε–Cu1.2.5,1.2.618Cu-9Ni1163%Cu8418Cr-9Ni-3CuS30300(18%Cr,9%Ni+S),18Cr-9Ni[7]1.2.7[20]1.32050,-7-1.3.1HSLAHY195080HSLA[21]HY80(HSLA-80)HSLA-80ASTM710-Cu[22,23]HSLA-80HSLA-100HY-100[24]HSLA-80HSLA-100[25]-Cu[26]HSLAHSLAMnMoNi,Ni-Cu1%[7]HSLAγ(TMCP)[15]HSLA80HSLA100(ULCB),NiCrMo,,-8-(1.2),1.2[27][28][28]HSLAHSLAHSLA1.3.2IFIFIFCNIF[7]70400-9-7080340Mpa390MpaIFIFPBHIFIFIFIF(BH)IFCNBH2010-4%1010-4%[29]IFIFBHIFBH30-60MpaIFr1.8440MpaIFKishiada[3031]IF1.1600Mpar1.825%1.1CuIFCSiMnPTiNiBCuYS(Mpa)TS(Mpa)EI(%)r0.00430.010.250.0140.050.670.00061.2750761024.41.9IFIFIFCuIFIF0.01%TiCN40%50%[32]CuIF-10--CuIF-Cu450-550Cu-IF550300-CuCu-IFCu-IF1.3.3[33]Cub.c.c.f.c.c.0.1C-18Cr-9Ni-3Cu-Nb-N,1.3.40.35%wt,[34]1.3.523%1030Cr-8Ni-3Cu30Cr-8Ni3%Cu-11-30Cr-8Ni-3Cu[35]1.4XWassermanWincierz[36]XFe-Cu-Cufcc-FeRickettLeslie[37]-CuHornbogenGlenn[38]-Cu[39]30nmHornbogenCubccfcc-Cu9nm[38]5nm[40]4nmHornbogenGlenn[22]-CufccHornbogenbccfccfcc30nm,[110]-copper//[111]-ironGoodmanbrennerLow[40]50%773K11ks430ks-12-100%LucasOdettebccbcc-CuK.Osamura[41]Fe-1.17at%cu773Kbcc-Fefcc-CuOthen[